SE0103042L - Anordning och metod för att placera en optisk komponent på en bärare - Google Patents

Anordning och metod för att placera en optisk komponent på en bärare

Info

Publication number
SE0103042L
SE0103042L SE0103042A SE0103042A SE0103042L SE 0103042 L SE0103042 L SE 0103042L SE 0103042 A SE0103042 A SE 0103042A SE 0103042 A SE0103042 A SE 0103042A SE 0103042 L SE0103042 L SE 0103042L
Authority
SE
Sweden
Prior art keywords
optical component
component
carrier
tolerance
range
Prior art date
Application number
SE0103042A
Other languages
English (en)
Other versions
SE0103042D0 (sv
SE523121C2 (sv
Inventor
Atsushi Ishii
Original Assignee
Optillion Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optillion Ab filed Critical Optillion Ab
Priority to SE0103042A priority Critical patent/SE523121C2/sv
Publication of SE0103042D0 publication Critical patent/SE0103042D0/sv
Priority to PCT/SE2002/001636 priority patent/WO2003023846A1/en
Publication of SE0103042L publication Critical patent/SE0103042L/sv
Publication of SE523121C2 publication Critical patent/SE523121C2/sv

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H01L21/681—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Lens Barrels (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
SE0103042A 2001-09-13 2001-09-13 Metod, anordning och datorprogram för att placera en optisk komponent på en bärare SE523121C2 (sv)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SE0103042A SE523121C2 (sv) 2001-09-13 2001-09-13 Metod, anordning och datorprogram för att placera en optisk komponent på en bärare
PCT/SE2002/001636 WO2003023846A1 (en) 2001-09-13 2002-09-12 Method and apparatus for high-accuracy placing of an optical component on a component carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0103042A SE523121C2 (sv) 2001-09-13 2001-09-13 Metod, anordning och datorprogram för att placera en optisk komponent på en bärare

Publications (3)

Publication Number Publication Date
SE0103042D0 SE0103042D0 (sv) 2001-09-13
SE0103042L true SE0103042L (sv) 2003-03-14
SE523121C2 SE523121C2 (sv) 2004-03-30

Family

ID=20285313

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0103042A SE523121C2 (sv) 2001-09-13 2001-09-13 Metod, anordning och datorprogram för att placera en optisk komponent på en bärare

Country Status (2)

Country Link
SE (1) SE523121C2 (sv)
WO (1) WO2003023846A1 (sv)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10325179A1 (de) * 2003-06-04 2004-12-23 Marconi Communications Gmbh Verfahren zum Montieren einer Schaltung
DE102004010958A1 (de) * 2004-03-03 2005-09-22 Robert Bosch Gmbh Vorrichtung zur Herstellung einer Kamera
CN119423415A (zh) * 2023-08-07 2025-02-14 思摩尔国际控股有限公司 气溶胶生成装置及气溶胶生成装置的控制方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2710850B2 (ja) * 1989-03-27 1998-02-10 キヤノン株式会社 ワーク把持装置、ワーク及びその収納ケース
US5185811A (en) * 1990-12-27 1993-02-09 International Business Machines Corporation Automated visual inspection of electronic component leads prior to placement
EP0809926B1 (en) * 1995-12-14 1999-11-10 Koninklijke Philips Electronics N.V. Component placement machine
JP3894581B2 (ja) * 1996-11-26 2007-03-22 アセンブレオン ネムローゼ フェンノートシャップ 担体上に構成要素を配置する方法及び機械、並びにこの方法及び機械に使用する較正担体検出装置
JPH11207611A (ja) * 1998-01-21 1999-08-03 Shin Etsu Handotai Co Ltd 両面研磨装置におけるワークの自動搬送装置

Also Published As

Publication number Publication date
WO2003023846A1 (en) 2003-03-20
SE0103042D0 (sv) 2001-09-13
SE523121C2 (sv) 2004-03-30

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Legal Events

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NUG Patent has lapsed