SE0200404D0 - Microwave component - Google Patents
Microwave componentInfo
- Publication number
- SE0200404D0 SE0200404D0 SE0200404A SE0200404A SE0200404D0 SE 0200404 D0 SE0200404 D0 SE 0200404D0 SE 0200404 A SE0200404 A SE 0200404A SE 0200404 A SE0200404 A SE 0200404A SE 0200404 D0 SE0200404 D0 SE 0200404D0
- Authority
- SE
- Sweden
- Prior art keywords
- assembly
- film
- cofired
- ferroelectric
- integrated circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/32—Non-reciprocal transmission devices
- H01P1/38—Circulators
- H01P1/383—Junction circulators, e.g. Y-circulators
- H01P1/387—Strip line circulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/098—Applying pastes or inks, e.g. screen printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Thin Magnetic Films (AREA)
- Non-Reversible Transmitting Devices (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE0200404A SE0200404D0 (sv) | 2002-02-11 | 2002-02-11 | Microwave component |
| PCT/SE2003/000226 WO2003069722A1 (en) | 2002-02-11 | 2003-02-11 | Cofired multi-layer ceramic structure incorporating a microwave component |
| AU2003206342A AU2003206342A1 (en) | 2002-02-11 | 2003-02-11 | Cofired multi-layer ceramic structure incorporating a microwave component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE0200404A SE0200404D0 (sv) | 2002-02-11 | 2002-02-11 | Microwave component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE0200404D0 true SE0200404D0 (sv) | 2002-02-11 |
Family
ID=20286932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE0200404A SE0200404D0 (sv) | 2002-02-11 | 2002-02-11 | Microwave component |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU2003206342A1 (sv) |
| SE (1) | SE0200404D0 (sv) |
| WO (1) | WO2003069722A1 (sv) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5312674A (en) * | 1992-07-31 | 1994-05-17 | Hughes Aircraft Company | Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
| JP3147615B2 (ja) * | 1993-10-12 | 2001-03-19 | 株式会社村田製作所 | 高周波用非可逆回路素子 |
| US6507249B1 (en) * | 1999-09-01 | 2003-01-14 | Ernst F. R. A. Schloemann | Isolator for a broad frequency band with at least two magnetic materials |
-
2002
- 2002-02-11 SE SE0200404A patent/SE0200404D0/sv unknown
-
2003
- 2003-02-11 AU AU2003206342A patent/AU2003206342A1/en not_active Abandoned
- 2003-02-11 WO PCT/SE2003/000226 patent/WO2003069722A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003069722A1 (en) | 2003-08-21 |
| AU2003206342A1 (en) | 2003-09-04 |
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