SE0200404D0 - Microwave component - Google Patents

Microwave component

Info

Publication number
SE0200404D0
SE0200404D0 SE0200404A SE0200404A SE0200404D0 SE 0200404 D0 SE0200404 D0 SE 0200404D0 SE 0200404 A SE0200404 A SE 0200404A SE 0200404 A SE0200404 A SE 0200404A SE 0200404 D0 SE0200404 D0 SE 0200404D0
Authority
SE
Sweden
Prior art keywords
assembly
film
cofired
ferroelectric
integrated circuit
Prior art date
Application number
SE0200404A
Other languages
English (en)
Inventor
Marino Poppe
Hans Groenqvist
Original Assignee
Saab Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saab Ab filed Critical Saab Ab
Priority to SE0200404A priority Critical patent/SE0200404D0/sv
Publication of SE0200404D0 publication Critical patent/SE0200404D0/sv
Priority to PCT/SE2003/000226 priority patent/WO2003069722A1/en
Priority to AU2003206342A priority patent/AU2003206342A1/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/32Non-reciprocal transmission devices
    • H01P1/38Circulators
    • H01P1/383Junction circulators, e.g. Y-circulators
    • H01P1/387Strip line circulators
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01Manufacture or treatment
    • H10W70/05Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098Applying pastes or inks, e.g. screen printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Magnetic Films (AREA)
  • Non-Reversible Transmitting Devices (AREA)
SE0200404A 2002-02-11 2002-02-11 Microwave component SE0200404D0 (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0200404A SE0200404D0 (sv) 2002-02-11 2002-02-11 Microwave component
PCT/SE2003/000226 WO2003069722A1 (en) 2002-02-11 2003-02-11 Cofired multi-layer ceramic structure incorporating a microwave component
AU2003206342A AU2003206342A1 (en) 2002-02-11 2003-02-11 Cofired multi-layer ceramic structure incorporating a microwave component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0200404A SE0200404D0 (sv) 2002-02-11 2002-02-11 Microwave component

Publications (1)

Publication Number Publication Date
SE0200404D0 true SE0200404D0 (sv) 2002-02-11

Family

ID=20286932

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0200404A SE0200404D0 (sv) 2002-02-11 2002-02-11 Microwave component

Country Status (3)

Country Link
AU (1) AU2003206342A1 (sv)
SE (1) SE0200404D0 (sv)
WO (1) WO2003069722A1 (sv)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5312674A (en) * 1992-07-31 1994-05-17 Hughes Aircraft Company Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer
JP3147615B2 (ja) * 1993-10-12 2001-03-19 株式会社村田製作所 高周波用非可逆回路素子
US6507249B1 (en) * 1999-09-01 2003-01-14 Ernst F. R. A. Schloemann Isolator for a broad frequency band with at least two magnetic materials

Also Published As

Publication number Publication date
WO2003069722A1 (en) 2003-08-21
AU2003206342A1 (en) 2003-09-04

Similar Documents

Publication Publication Date Title
MY128632A (en) Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
ATE360889T1 (de) Elektronischer aufbau mit substrat und eingebettetem kondensator und herstellungsverfahren
BR9904886A (pt) Compósito metalizado multicamada na forma de uma pelìcula de um produto polimérico e seu processo de fabricação
ATE438925T1 (de) Mikroelektronisches substrat mit integrierten vorrichtungen
EP1060647A4 (en) METHOD FOR MANUFACTURING HYPERFREQUENCY MULTI-FUNCTION MODULES USING COMPOSITE FLUOROPOLYMER SUBSTRATES
FI20030493A0 (sv) Förfarande för tillverkning av en elektronikmodul och en elektronikmodul
FR2840711B1 (fr) Carte de circuit integre et procede de fabrication de celle-ci
FI20020190A0 (sv) F÷rfarande f÷r insõttning av en komponent i ett basmaterial och f÷rbildning av en kontakt
WO2004001837A3 (en) Methods of forming electronic structures including conductive shunt layers and related structures
FI20041525L (sv) Elektronikmodul och förfarande för tillverkning
EP1699277A4 (en) CERAMIC MULTILAYER SUBSTRATE
FI20030293A7 (sv) Förfarande för tillverkning av en elektronikmodul och en elektronikmodul
MY128174A (en) Thin film capacitor and thin film electronic component and method for manufacturing the same.
ATE376256T1 (de) Schaltung mit einem kondensator und mindestens einem halbleiterbauelement und entwurfsverfahren dafür
BR0113133A (pt) Processo de realização de um conjunto de circuitos; uso do processo; conjunto de circuitos; circuito impresso e módulo multicamadas
ATE341799T1 (de) Datenträger mit transponderspule
WO2004057662A3 (en) Electronic device and method of manufacturing same
DE60134042D1 (de) Parallelebenensubstrat
TW200611620A (en) A manufacturing method of a multi-layer circuit board with embedded passive components
ATE472242T1 (de) Mehrschichtige integrierte schaltungskapselung
WO2002071482A8 (de) Hohlraumstruktur in einer integrierten schaltung und verfahren zum herstellen einer hohlraumstruktur in einer integrierten schaltung
SE0200404D0 (sv) Microwave component
WO2002054839A3 (en) Layered circuit boards and methods of production thereof
EP1626615A4 (en) FLEXIBLE PCB, METHOD FOR THE PRODUCTION THEREOF, FLEXIBLE MULTILAYER PCB AND METHOD FOR THE PRODUCTION THEREOF
SE0000097D0 (sv) Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt