SE0400035L - Monolitiskt integrerad krets - Google Patents
Monolitiskt integrerad kretsInfo
- Publication number
- SE0400035L SE0400035L SE0400035A SE0400035A SE0400035L SE 0400035 L SE0400035 L SE 0400035L SE 0400035 A SE0400035 A SE 0400035A SE 0400035 A SE0400035 A SE 0400035A SE 0400035 L SE0400035 L SE 0400035L
- Authority
- SE
- Sweden
- Prior art keywords
- integrated circuit
- monolithic integrated
- monolithic
- circuit
- integrated
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
- H10D84/151—LDMOS having built-in components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/20—Inductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE0400035A SE526360C2 (sv) | 2004-01-09 | 2004-01-09 | Monolitiskt integrerad krets |
| EP04809146A EP1702362A1 (en) | 2004-01-09 | 2004-12-22 | Monolithically integrated circuit for radio frequency applications |
| CNB2004800398992A CN100499109C (zh) | 2004-01-09 | 2004-12-22 | 用于射频应用的单片集成电路 |
| PCT/SE2004/001973 WO2005067043A1 (en) | 2004-01-09 | 2004-12-22 | Monolithically integrated circuit for radio frequency applications |
| US11/482,860 US7536166B2 (en) | 2004-01-09 | 2006-07-07 | Monolithically integrated circuit |
| US12/432,778 US8260245B2 (en) | 2004-01-09 | 2009-04-30 | Monolithically integrated circuit |
| US13/600,183 US9042860B2 (en) | 2004-01-09 | 2012-08-30 | Monolithically integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE0400035A SE526360C2 (sv) | 2004-01-09 | 2004-01-09 | Monolitiskt integrerad krets |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| SE0400035D0 SE0400035D0 (sv) | 2004-01-09 |
| SE0400035L true SE0400035L (sv) | 2005-07-10 |
| SE526360C2 SE526360C2 (sv) | 2005-08-30 |
Family
ID=31493020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE0400035A SE526360C2 (sv) | 2004-01-09 | 2004-01-09 | Monolitiskt integrerad krets |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US7536166B2 (sv) |
| EP (1) | EP1702362A1 (sv) |
| CN (1) | CN100499109C (sv) |
| SE (1) | SE526360C2 (sv) |
| WO (1) | WO2005067043A1 (sv) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2687120A1 (en) | 2007-05-08 | 2008-11-13 | Scanimetrics Inc. | Ultra high speed signal transmission/reception |
| US9064712B2 (en) * | 2010-08-12 | 2015-06-23 | Freescale Semiconductor Inc. | Monolithic microwave integrated circuit |
| CN102624225A (zh) * | 2011-01-28 | 2012-08-01 | 精材科技股份有限公司 | 电源模组及其封装方法 |
| CN103905012B (zh) * | 2014-03-27 | 2017-06-06 | 北京工业大学 | 可小型化设计的电感 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2211987B (en) | 1987-10-30 | 1992-01-02 | Plessey Co Plc | Circuit arrangement including an inductor and a mesfet |
| JP3036233B2 (ja) * | 1992-06-22 | 2000-04-24 | 松下電器産業株式会社 | 半導体装置およびその製造方法 |
| TW262595B (sv) | 1993-11-17 | 1995-11-11 | Ikeda Takeshi | |
| US5815014A (en) * | 1996-06-28 | 1998-09-29 | The Whitaker Corporation | Transistor based frequency multiplier |
| US5789799A (en) * | 1996-09-27 | 1998-08-04 | Northern Telecom Limited | High frequency noise and impedance matched integrated circuits |
| US6236101B1 (en) * | 1997-11-05 | 2001-05-22 | Texas Instruments Incorporated | Metallization outside protective overcoat for improved capacitors and inductors |
| US6087723A (en) * | 1998-03-30 | 2000-07-11 | Micron Technology, Inc. | Vertical surface mount assembly and methods |
| EP0966040A1 (en) * | 1998-06-19 | 1999-12-22 | International Business Machines Corporation | Passive component above isolation trenches |
| JP3425573B2 (ja) * | 1999-05-19 | 2003-07-14 | Necエレクトロニクス株式会社 | 半導体装置 |
| JP4005762B2 (ja) * | 1999-06-30 | 2007-11-14 | 株式会社東芝 | 集積回路装置及びその製造方法 |
| US6455915B1 (en) | 2000-05-30 | 2002-09-24 | Programmable Silicon Solutions | Integrated inductive circuits |
| JP2002164512A (ja) * | 2000-11-28 | 2002-06-07 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| JPWO2002056381A1 (ja) * | 2001-01-16 | 2004-05-20 | ソニー株式会社 | 半導体装置及びその製造方法 |
| US6342424B1 (en) * | 2001-04-06 | 2002-01-29 | National Semiconductor Corp. | High-Q spiral inductor structure and methods of manufacturing the structure |
| JP3898024B2 (ja) * | 2001-10-19 | 2007-03-28 | Necエレクトロニクス株式会社 | 集積回路及びその製造方法 |
| JP2003282582A (ja) * | 2002-03-26 | 2003-10-03 | Hitachi Ltd | 半導体装置の製造方法 |
| JP4355128B2 (ja) * | 2002-07-04 | 2009-10-28 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| KR100698617B1 (ko) * | 2005-02-15 | 2007-03-21 | 삼성전자주식회사 | 집적 인덕터를 포함한 집적회로 |
| US20080157222A1 (en) * | 2006-12-27 | 2008-07-03 | Mediatek Inc. | Rf integrated circuit device |
-
2004
- 2004-01-09 SE SE0400035A patent/SE526360C2/sv not_active IP Right Cessation
- 2004-12-22 CN CNB2004800398992A patent/CN100499109C/zh not_active Expired - Fee Related
- 2004-12-22 WO PCT/SE2004/001973 patent/WO2005067043A1/en not_active Ceased
- 2004-12-22 EP EP04809146A patent/EP1702362A1/en not_active Withdrawn
-
2006
- 2006-07-07 US US11/482,860 patent/US7536166B2/en not_active Expired - Fee Related
-
2009
- 2009-04-30 US US12/432,778 patent/US8260245B2/en not_active Expired - Fee Related
-
2012
- 2012-08-30 US US13/600,183 patent/US9042860B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| SE526360C2 (sv) | 2005-08-30 |
| SE0400035D0 (sv) | 2004-01-09 |
| US20120319200A1 (en) | 2012-12-20 |
| US7536166B2 (en) | 2009-05-19 |
| US8260245B2 (en) | 2012-09-04 |
| US20100109092A1 (en) | 2010-05-06 |
| US9042860B2 (en) | 2015-05-26 |
| WO2005067043A1 (en) | 2005-07-21 |
| US20070176724A1 (en) | 2007-08-02 |
| EP1702362A1 (en) | 2006-09-20 |
| CN1934703A (zh) | 2007-03-21 |
| CN100499109C (zh) | 2009-06-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NUG | Patent has lapsed |