SE331856B - - Google Patents
Info
- Publication number
- SE331856B SE331856B SE00836/67A SE83667A SE331856B SE 331856 B SE331856 B SE 331856B SE 00836/67 A SE00836/67 A SE 00836/67A SE 83667 A SE83667 A SE 83667A SE 331856 B SE331856 B SE 331856B
- Authority
- SE
- Sweden
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1966S0101518 DE1514668B2 (de) | 1966-01-19 | 1966-01-19 | Verfahren zum herstellen von chrom- silber-kontakten auf halbleiterbauelementen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE331856B true SE331856B (de) | 1971-01-18 |
Family
ID=7523808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE00836/67A SE331856B (de) | 1966-01-19 | 1967-01-19 |
Country Status (7)
| Country | Link |
|---|---|
| AT (1) | AT264594B (de) |
| CH (1) | CH468720A (de) |
| DE (1) | DE1514668B2 (de) |
| FR (1) | FR1508570A (de) |
| GB (1) | GB1166202A (de) |
| NL (1) | NL6615306A (de) |
| SE (1) | SE331856B (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3001613C2 (de) * | 1980-01-17 | 1986-04-03 | Siemens AG, 1000 Berlin und 8000 München | Befestigung eines, eine monolithisch integrierte Halbleiterschaltung enthaltenden Halbleiterkörpers aus Silicium an einer Unterlage mit einem entsprechenden Verfahren hierzu |
| JP2602329B2 (ja) * | 1988-07-06 | 1997-04-23 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 金属層で基板を被覆する方法 |
| US5429843A (en) * | 1991-11-21 | 1995-07-04 | Nisshin Steel Co., Ltd. | Vapor deposition for formation of plating layer |
-
1966
- 1966-01-19 DE DE1966S0101518 patent/DE1514668B2/de active Granted
- 1966-10-28 NL NL6615306A patent/NL6615306A/xx unknown
-
1967
- 1967-01-17 CH CH66167A patent/CH468720A/de unknown
- 1967-01-17 AT AT47467A patent/AT264594B/de active
- 1967-01-18 GB GB2556/67A patent/GB1166202A/en not_active Expired
- 1967-01-18 FR FR91624A patent/FR1508570A/fr not_active Expired
- 1967-01-19 SE SE00836/67A patent/SE331856B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE1514668B2 (de) | 1977-05-12 |
| CH468720A (de) | 1969-02-15 |
| DE1514668A1 (de) | 1969-07-03 |
| NL6615306A (de) | 1967-07-20 |
| AT264594B (de) | 1968-09-10 |
| FR1508570A (fr) | 1968-01-05 |
| GB1166202A (en) | 1969-10-08 |