SE337053B - - Google Patents

Info

Publication number
SE337053B
SE337053B SE10978/67*A SE1097867A SE337053B SE 337053 B SE337053 B SE 337053B SE 1097867 A SE1097867 A SE 1097867A SE 337053 B SE337053 B SE 337053B
Authority
SE
Sweden
Application number
SE10978/67*A
Inventor
H Bond
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of SE337053B publication Critical patent/SE337053B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/308—Wires with resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SE10978/67*A 1966-08-01 1967-07-31 SE337053B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56906666A 1966-08-01 1966-08-01

Publications (1)

Publication Number Publication Date
SE337053B true SE337053B (de) 1971-07-26

Family

ID=24273953

Family Applications (1)

Application Number Title Priority Date Filing Date
SE10978/67*A SE337053B (de) 1966-08-01 1967-07-31

Country Status (5)

Country Link
US (1) US3486934A (de)
CH (1) CH520738A (de)
DE (1) DE1694634A1 (de)
GB (1) GB1198856A (de)
SE (1) SE337053B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3652355A (en) * 1970-03-12 1972-03-28 Gen Electric Metallic laminated structure and method
US3717543A (en) * 1971-01-13 1973-02-20 Rexham Corp Laminations of polyimide films to like films and/or to metal foils
US4022649A (en) * 1972-04-21 1977-05-10 Nitto Electric Industrial Co., Ltd. Method for producing metal laminates containing an interlayer of thermally stable heterocyclic polymer
FR2198835B1 (de) * 1972-09-11 1975-03-07 Rhone Poulenc Ind
US4039610A (en) * 1973-05-14 1977-08-02 Exxon Research And Engineering Company Method of making an oriental dimensionally stable article from a high softening aromatic polymer or copolymer
DE3301197A1 (de) * 1983-01-15 1984-07-19 Akzo Gmbh, 5600 Wuppertal Polyimid-laminate mit hoher schaelfestigkeit
US4656050A (en) * 1983-11-30 1987-04-07 International Business Machines Corporation Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers
DE3424232A1 (de) * 1984-06-30 1986-01-23 Akzo Gmbh, 5600 Wuppertal Flexible polyimid-mehrschicht-laminate
US4939039A (en) * 1986-09-29 1990-07-03 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits and method of making same
DE3936488C2 (de) * 1989-11-02 1996-04-04 Beck & Co Ag Dr Verfahren zur Herstellung von flexiblen Basismaterialien, nach diesem Verfahren hergestellte Basismaterialen und deren Verwendung
WO2001097578A1 (en) * 2000-06-16 2001-12-20 Unitika Ltd. Method for preparing substrate for flexible print wiring board and substrate for flexible print wiring board
KR100730320B1 (ko) * 2002-05-28 2007-06-19 마츠시다 덴코 가부시키가이샤 광회로-전기회로 혼재기판용 재료 및 광회로-전기회로혼재기판
CN101415549B (zh) * 2006-04-07 2012-01-04 日立金属株式会社 软磁性金属薄带层叠体及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE615937A (de) * 1961-04-03 1900-01-01
US3190770A (en) * 1961-04-24 1965-06-22 Shawinigan Resins Corp Metal conductor coated with polyester outer layer and polymide inner layer
US3179635A (en) * 1963-07-08 1965-04-20 Westinghouse Electric Corp Linear polymeric amide-modified polyimides and process of making same
US3168417A (en) * 1963-09-25 1965-02-02 Haveg Industries Inc Polyimide coated fluorocarbon insulated wire
DE1440862B2 (de) * 1963-11-18 1971-06-24 Dr Beck & Co AG, 2000 Hamburg Isolierter elektrischer leiter
US3442703A (en) * 1965-12-06 1969-05-06 Du Pont Plural coated electrical conductor

Also Published As

Publication number Publication date
US3486934A (en) 1969-12-30
CH520738A (de) 1972-03-31
GB1198856A (en) 1970-07-15
DE1694634A1 (de) 1972-03-16

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