SE353815B - - Google Patents

Info

Publication number
SE353815B
SE353815B SE16827/70A SE1682770A SE353815B SE 353815 B SE353815 B SE 353815B SE 16827/70 A SE16827/70 A SE 16827/70A SE 1682770 A SE1682770 A SE 1682770A SE 353815 B SE353815 B SE 353815B
Authority
SE
Sweden
Application number
SE16827/70A
Inventor
K Reindl
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE353815B publication Critical patent/SE353815B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
SE16827/70A 1969-12-15 1970-12-11 SE353815B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691962814 DE1962814A1 (de) 1969-12-15 1969-12-15 Metall-Halbleiterdiode

Publications (1)

Publication Number Publication Date
SE353815B true SE353815B (de) 1973-02-12

Family

ID=5753916

Family Applications (1)

Application Number Title Priority Date Filing Date
SE16827/70A SE353815B (de) 1969-12-15 1970-12-11

Country Status (8)

Country Link
JP (1) JPS509674B1 (de)
AT (1) AT317302B (de)
CH (1) CH517382A (de)
DE (1) DE1962814A1 (de)
FR (1) FR2070856B1 (de)
GB (1) GB1271639A (de)
NL (1) NL7018216A (de)
SE (1) SE353815B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0869361A3 (de) * 1997-04-02 1999-12-29 Tohoku Electronic Industrial Co., Ltd. Verfahren und Vorrichtung zur Messung der Antioxydationsfähigkeit einer flüssigen Probe
EP1222694B1 (de) 1999-09-22 2005-02-02 SiCED Electronics Development GmbH & Co KG SiC-Halbleitervorrichtung mit einem Schottky-Kontakt und Verfahren zu deren Herstellung
DE10344749B3 (de) * 2003-09-25 2005-01-20 Infineon Technologies Ag Schottky-Kontakt in einem elektronischen Bauelement und Verfahren zur Herstellung
CN114678272B (zh) * 2022-02-28 2026-02-27 中国科学院上海微系统与信息技术研究所 一种NiGe/n-Ge肖特基二极管的制备方法

Also Published As

Publication number Publication date
FR2070856A1 (de) 1971-09-17
NL7018216A (de) 1971-06-17
CH517382A (de) 1971-12-31
DE1962814A1 (de) 1971-06-16
AT317302B (de) 1974-08-26
GB1271639A (en) 1972-04-19
JPS509674B1 (de) 1975-04-15
FR2070856B1 (de) 1974-07-12

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