SE381536B - Forfarande for framstellning av en halvledaranordning bestaende av en halvledarkropp med ett metalliserat monster pa nagon yta derav - Google Patents

Forfarande for framstellning av en halvledaranordning bestaende av en halvledarkropp med ett metalliserat monster pa nagon yta derav

Info

Publication number
SE381536B
SE381536B SE7215965A SE1596572A SE381536B SE 381536 B SE381536 B SE 381536B SE 7215965 A SE7215965 A SE 7215965A SE 1596572 A SE1596572 A SE 1596572A SE 381536 B SE381536 B SE 381536B
Authority
SE
Sweden
Prior art keywords
monster
metallized
procedure
manufacturing
device consisting
Prior art date
Application number
SE7215965A
Other languages
English (en)
Swedish (sv)
Inventor
G K Herb
E F Labuda
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of SE381536B publication Critical patent/SE381536B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/945—Special, e.g. metal
SE7215965A 1971-12-20 1972-12-07 Forfarande for framstellning av en halvledaranordning bestaende av en halvledarkropp med ett metalliserat monster pa nagon yta derav SE381536B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00209560A US3808108A (en) 1971-12-20 1971-12-20 Semiconductor device fabrication using nickel to mask cathodic etching

Publications (1)

Publication Number Publication Date
SE381536B true SE381536B (sv) 1975-12-08

Family

ID=22779246

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7215965A SE381536B (sv) 1971-12-20 1972-12-07 Forfarande for framstellning av en halvledaranordning bestaende av en halvledarkropp med ett metalliserat monster pa nagon yta derav

Country Status (10)

Country Link
US (1) US3808108A (fr)
JP (1) JPS5117871B2 (fr)
BE (1) BE792908A (fr)
CA (1) CA956039A (fr)
CH (1) CH544409A (fr)
DE (1) DE2261337B2 (fr)
FR (1) FR2164684B1 (fr)
IT (1) IT976112B (fr)
NL (1) NL155984B (fr)
SE (1) SE381536B (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2328284A1 (fr) * 1975-10-15 1977-05-13 Labo Electronique Physique Diode fonctionnant dans le domaine des ondes millimetriques et son procede de fabrication
JPS52136590A (en) * 1976-05-11 1977-11-15 Matsushita Electric Ind Co Ltd Production of semiconductor device
US4206541A (en) * 1978-06-26 1980-06-10 Extel Corporation Method of manufacturing thin film thermal print heads
CA1109927A (fr) * 1978-06-26 1981-09-29 Edmund T. Marciniec Fabrication d'une tete d'impression thermique sur pellicule mince
US4232440A (en) * 1979-02-27 1980-11-11 Bell Telephone Laboratories, Incorporated Contact structure for light emitting device
US4375390A (en) * 1982-03-15 1983-03-01 Anderson Nathaniel C Thin film techniques for fabricating narrow track ferrite heads
US4514751A (en) * 1982-12-23 1985-04-30 International Business Machines Corporation Compressively stresses titanium metallurgy for contacting passivated semiconductor devices
EP2267784B1 (fr) 2001-07-24 2020-04-29 Cree, Inc. HEMT AlGaN/GaN À GRILLE ISOLÉE
US7692263B2 (en) 2006-11-21 2010-04-06 Cree, Inc. High voltage GaN transistors
US8212290B2 (en) 2007-03-23 2012-07-03 Cree, Inc. High temperature performance capable gallium nitride transistor
US8729156B2 (en) 2009-07-17 2014-05-20 Arkema France Polyhydroxyalkanoate composition exhibiting improved impact resistance at low levels of impact modifier
EP2925484A4 (fr) * 2012-11-29 2016-07-27 Corning Inc Procédés de réunion pour verres métalliques massifs
TWI733069B (zh) * 2017-12-31 2021-07-11 美商羅門哈斯電子材料有限公司 單體、聚合物及包含其的微影組合物

Also Published As

Publication number Publication date
CH544409A (de) 1973-11-15
US3808108A (en) 1974-04-30
FR2164684A1 (fr) 1973-08-03
JPS4886473A (fr) 1973-11-15
DE2261337A1 (de) 1973-07-26
JPS5117871B2 (fr) 1976-06-05
FR2164684B1 (fr) 1977-04-08
NL155984B (nl) 1978-02-15
DE2261337B2 (de) 1977-09-15
NL7217010A (fr) 1973-06-22
CA956039A (en) 1974-10-08
IT976112B (it) 1974-08-20
BE792908A (fr) 1973-04-16

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