SE409039B - Sett vid sammanbindning medelst lim, varvid en kontaktyta behandlas med en kolloidal losning av en vattenhaltig oxid - Google Patents

Sett vid sammanbindning medelst lim, varvid en kontaktyta behandlas med en kolloidal losning av en vattenhaltig oxid

Info

Publication number: SE409039B
Authority: SE; Sweden
Prior art keywords: adhesive; treated; colloidal solution; aqueous; procedure
Prior art date: 1973-03-08

Application number

SE7402685A

Other languages

English (en)

Swedish (sv)

Inventor

K B Connole

W P Townsend

Original Assignee

Western Electric Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-03-08

Filing date

1974-02-28

Publication date

1979-07-23

1974-02-28 Application filed by Western Electric Co filed Critical Western Electric Co

1979-07-23 Publication of SE409039B publication Critical patent/SE409039B/sv

Links

239000000853 adhesive Substances 0.000 title claims description 147
230000001070 adhesive effect Effects 0.000 title claims description 146
238000005259 measurement Methods 0.000 title 1
238000000034 method Methods 0.000 claims description 63
239000012736 aqueous medium Substances 0.000 claims description 7
239000002245 particle Substances 0.000 claims description 7
238000006460 hydrolysis reaction Methods 0.000 claims description 6
229910052742 iron Inorganic materials 0.000 claims description 6
239000000463 material Substances 0.000 claims description 6
230000007062 hydrolysis Effects 0.000 claims description 4
229910052719 titanium Inorganic materials 0.000 claims description 4
229910052684 Cerium Inorganic materials 0.000 claims description 3
229910052776 Thorium Inorganic materials 0.000 claims description 3
229910052770 Uranium Inorganic materials 0.000 claims description 3
229910052790 beryllium Inorganic materials 0.000 claims description 3
229910052797 bismuth Inorganic materials 0.000 claims description 3
238000006243 chemical reaction Methods 0.000 claims description 3
229910052804 chromium Inorganic materials 0.000 claims description 3
238000005189 flocculation Methods 0.000 claims description 3
230000016615 flocculation Effects 0.000 claims description 3
229910052737 gold Inorganic materials 0.000 claims description 3
229910052738 indium Inorganic materials 0.000 claims description 3
229910052746 lanthanum Inorganic materials 0.000 claims description 3
229910052745 lead Inorganic materials 0.000 claims description 3
229910052749 magnesium Inorganic materials 0.000 claims description 3
229910052748 manganese Inorganic materials 0.000 claims description 3
229910052751 metal Inorganic materials 0.000 claims description 3
239000002184 metal Substances 0.000 claims description 3
239000000203 mixture Substances 0.000 claims description 3
229910052750 molybdenum Inorganic materials 0.000 claims description 3
229910052759 nickel Inorganic materials 0.000 claims description 3
230000006911 nucleation Effects 0.000 claims description 3
238000010899 nucleation Methods 0.000 claims description 3
229910052697 platinum Inorganic materials 0.000 claims description 3
150000003839 salts Chemical class 0.000 claims description 3
229910052709 silver Inorganic materials 0.000 claims description 3
229910052721 tungsten Inorganic materials 0.000 claims description 3
229910052720 vanadium Inorganic materials 0.000 claims description 3
229910052726 zirconium Inorganic materials 0.000 claims description 3
239000004033 plastic Substances 0.000 claims description 2
229920003023 plastic Polymers 0.000 claims description 2
229910052774 Proactinium Inorganic materials 0.000 claims 1
229910052753 mercury Inorganic materials 0.000 claims 1
229920001721 polyimide Polymers 0.000 description 22
239000004642 Polyimide Substances 0.000 description 21
229910001887 tin oxide Inorganic materials 0.000 description 20
XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 19
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
239000000084 colloidal system Substances 0.000 description 15
UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 14
229920000728 polyester Polymers 0.000 description 12
238000012876 topography Methods 0.000 description 9
XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
238000007788 roughening Methods 0.000 description 5
239000000758 substrate Substances 0.000 description 5
229910052718 tin Inorganic materials 0.000 description 5
229920001577 copolymer Polymers 0.000 description 4
238000005304 joining Methods 0.000 description 4
239000007788 liquid Substances 0.000 description 4
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
229910052782 aluminium Inorganic materials 0.000 description 3
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
238000001723 curing Methods 0.000 description 3
XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 3
-1 polyethylene terephthalate Polymers 0.000 description 3
230000003746 surface roughness Effects 0.000 description 3
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
229910052793 cadmium Inorganic materials 0.000 description 2
239000004568 cement Substances 0.000 description 2
238000004140 cleaning Methods 0.000 description 2
230000000052 comparative effect Effects 0.000 description 2
238000007796 conventional method Methods 0.000 description 2
229910052802 copper Inorganic materials 0.000 description 2
239000008367 deionised water Substances 0.000 description 2
229910021641 deionized water Inorganic materials 0.000 description 2
230000001419 dependent effect Effects 0.000 description 2
238000007598 dipping method Methods 0.000 description 2
229920006332 epoxy adhesive Polymers 0.000 description 2
229910052732 germanium Inorganic materials 0.000 description 2
LELOWRISYMNNSU-UHFFFAOYSA-N hydrogen cyanide Chemical compound N#C LELOWRISYMNNSU-UHFFFAOYSA-N 0.000 description 2
238000007654 immersion Methods 0.000 description 2
229910052763 palladium Inorganic materials 0.000 description 2
229920000139 polyethylene terephthalate Polymers 0.000 description 2
239000005020 polyethylene terephthalate Substances 0.000 description 2
CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
229910052710 silicon Inorganic materials 0.000 description 2
238000005507 spraying Methods 0.000 description 2
229910052716 thallium Inorganic materials 0.000 description 2
229910052725 zinc Inorganic materials 0.000 description 2
KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
239000004593 Epoxy Substances 0.000 description 1
239000004831 Hot glue Substances 0.000 description 1
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
229920000715 Mucilage Polymers 0.000 description 1
239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
150000001412 amines Chemical class 0.000 description 1
150000008064 anhydrides Chemical class 0.000 description 1
230000001680 brushing effect Effects 0.000 description 1
VNXDDLGFKMIFKO-UHFFFAOYSA-N carbanide;iron Chemical compound [CH3-].[Fe] VNXDDLGFKMIFKO-UHFFFAOYSA-N 0.000 description 1
239000003054 catalyst Substances 0.000 description 1
239000012612 commercial material Substances 0.000 description 1
239000004020 conductor Substances 0.000 description 1
238000012790 confirmation Methods 0.000 description 1
239000000356 contaminant Substances 0.000 description 1
238000001816 cooling Methods 0.000 description 1
239000003989 dielectric material Substances 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
230000007613 environmental effect Effects 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
238000001704 evaporation Methods 0.000 description 1
230000008020 evaporation Effects 0.000 description 1
239000007789 gas Substances 0.000 description 1
239000003292 glue Substances 0.000 description 1
238000013007 heat curing Methods 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
150000004679 hydroxides Chemical class 0.000 description 1
238000011065 in-situ storage Methods 0.000 description 1
230000003993 interaction Effects 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
239000012811 non-conductive material Substances 0.000 description 1
229920000620 organic polymer Polymers 0.000 description 1
239000003960 organic solvent Substances 0.000 description 1
239000006072 paste Substances 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
238000006116 polymerization reaction Methods 0.000 description 1
102000004169 proteins and genes Human genes 0.000 description 1
108090000623 proteins and genes Proteins 0.000 description 1
239000007787 solid Substances 0.000 description 1
239000000126 substance Substances 0.000 description 1
229920003051 synthetic elastomer Polymers 0.000 description 1
229920003002 synthetic resin Polymers 0.000 description 1
239000000057 synthetic resin Substances 0.000 description 1
239000005061 synthetic rubber Substances 0.000 description 1
238000012360 testing method Methods 0.000 description 1
BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
229920001187 thermosetting polymer Polymers 0.000 description 1
238000009736 wetting Methods 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/06—Coating with compositions not containing macromolecular substances
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Engineering & Computer Science (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Manufacturing & Machinery (AREA)
Materials Engineering (AREA)
Microelectronics & Electronic Packaging (AREA)
Adhesives Or Adhesive Processes (AREA)
Laminated Bodies (AREA)
Manufacture Of Macromolecular Shaped Articles (AREA)
Treatments Of Macromolecular Shaped Articles (AREA)

SE7402685A 1973-03-08 1974-02-28 Sett vid sammanbindning medelst lim, varvid en kontaktyta behandlas med en kolloidal losning av en vattenhaltig oxid SE409039B (sv)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US339459A US3861978A (en)	1973-03-08	1973-03-08	Method of joining two bodies after treatment with an inorganic colloid

Publications (1)

Publication Number	Publication Date
SE409039B true SE409039B (sv)	1979-07-23

Family

ID=23329084

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SE7402685A SE409039B (sv)	1973-03-08	1974-02-28	Sett vid sammanbindning medelst lim, varvid en kontaktyta behandlas med en kolloidal losning av en vattenhaltig oxid

Country Status (11)

Country	Link
US (1)	US3861978A (fr)
JP (1)	JPS5222787B2 (fr)
BE (1)	BE811990A (fr)
CA (1)	CA991521A (fr)
CH (1)	CH606373A5 (fr)
DE (1)	DE2410858C2 (fr)
FR (1)	FR2220705B1 (fr)
GB (1)	GB1466333A (fr)
IT (1)	IT1011553B (fr)
NL (1)	NL158214B (fr)
SE (1)	SE409039B (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3968221A (en) *	1972-05-05	1976-07-06	Medi-Physics, Inc.	99M-Technetium labeled tin colloid radiopharmaceuticals
US3976274A (en) *	1975-05-27	1976-08-24	The United States Of America As Represented By The Secretary Of The Navy	Permanent attachment for suction cups
JPS5456564A (en) *	1977-10-13	1979-05-07	Kondo Giken Yuugen	Artificial hair
US4482418A (en) *	1983-08-17	1984-11-13	International Business Machines Corporation	Bonding method for producing very thin bond lines
DE3780914T2 (de) *	1986-11-12	1992-12-24	United Technologies Corp	Vorbehandlungsverfahren eines amorphen hydratierten metalloxydgrundiermittels fuer organische klebverbindungsfugen.
US4888079A (en) *	1987-10-21	1989-12-19	United Technologies Corporation	Method for bonding joints with an organic adhesive using a water soluble amorphous hydrated metal oxide primer
US5189337A (en) *	1988-09-09	1993-02-23	Hitachi, Ltd.	Ultrafine particles for use in a cathode ray tube or an image display face plate
US5742118A (en) *	1988-09-09	1998-04-21	Hitachi, Ltd.	Ultrafine particle film, process for producing the same, transparent plate and image display plate
US4961971A (en) *	1988-12-19	1990-10-09	United Technologies Corporation	Method of making oxidatively stable water soluble amorphous hydrated metal oxide sized fibers
US5112418A (en) *	1989-12-13	1992-05-12	United Technologies Corporation	Method for bonding joints with an organic adhesive using a water soluble silane modified amorphous hydrated metal oxide primer
US6342434B1 (en)	1995-12-04	2002-01-29	Hitachi, Ltd.	Methods of processing semiconductor wafer, and producing IC card, and carrier
DE19609033A1 (de) *	1996-03-08	1997-09-11	Beiersdorf Ag	Klebfilm mit Haftvermittler

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB559075A (en) *	1942-04-09	1944-02-03	Meyer Hans	Improvements in or relating to the production of compound fabrics
US3361589A (en) *	1964-10-05	1968-01-02	Du Pont	Process for treating polyimide surface with basic compounds, and polyimide surface having thin layer of polyamide acid
US3657003A (en) *	1970-02-02	1972-04-18	Western Electric Co	Method of rendering a non-wettable surface wettable
US3767590A (en) *	1971-06-21	1973-10-23	Western Electric Co	Method of producing nondetergent aqueous wetting solutions

1973
- 1973-03-08 US US339459A patent/US3861978A/en not_active Expired - Lifetime
- 1973-10-17 CA CA183,617A patent/CA991521A/en not_active Expired
1974
- 1974-02-28 SE SE7402685A patent/SE409039B/sv not_active IP Right Cessation
- 1974-03-06 NL NL7403032.A patent/NL158214B/xx not_active IP Right Cessation
- 1974-03-07 IT IT67648/74A patent/IT1011553B/it active
- 1974-03-07 DE DE2410858A patent/DE2410858C2/de not_active Expired
- 1974-03-07 BE BE141742A patent/BE811990A/fr not_active IP Right Cessation
- 1974-03-08 JP JP49026456A patent/JPS5222787B2/ja not_active Expired
- 1974-03-08 FR FR7408055A patent/FR2220705B1/fr not_active Expired
- 1974-03-08 GB GB1041174A patent/GB1466333A/en not_active Expired
- 1974-03-08 CH CH331274A patent/CH606373A5/xx not_active IP Right Cessation

Also Published As

Publication number	Publication date
JPS508872A (fr)	1975-01-29
BE811990A (fr)	1974-07-01
FR2220705A1 (fr)	1974-10-04
CH606373A5 (fr)	1978-10-31
NL7403032A (fr)	1974-09-10
CA991521A (en)	1976-06-22
DE2410858C2 (de)	1984-05-10
GB1466333A (en)	1977-03-09
IT1011553B (it)	1977-02-10
US3861978A (en)	1975-01-21
DE2410858A1 (de)	1974-10-03
JPS5222787B2 (fr)	1977-06-20
NL158214B (nl)	1978-10-16
FR2220705B1 (fr)	1977-03-04

Legal Events

Date

Code

Title

Description

1995-01-31

NUG

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Ref document number: 7402685-7

Effective date: 19931008

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