SE413774B - PROCEDURE FOR PREPARING AN ADHESIVE METAL DEPOSIT ON A SURFACE OF EPOXY RESIN - Google Patents

PROCEDURE FOR PREPARING AN ADHESIVE METAL DEPOSIT ON A SURFACE OF EPOXY RESIN

Info

Publication number
SE413774B
SE413774B SE7407533A SE7407533A SE413774B SE 413774 B SE413774 B SE 413774B SE 7407533 A SE7407533 A SE 7407533A SE 7407533 A SE7407533 A SE 7407533A SE 413774 B SE413774 B SE 413774B
Authority
SE
Sweden
Prior art keywords
preparing
procedure
epoxy resin
metal deposit
adhesive metal
Prior art date
Application number
SE7407533A
Other languages
Swedish (sv)
Other versions
SE7407533L (en
Inventor
C A Mcpherson
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05465376 external-priority patent/USB465376I5/en
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of SE7407533L publication Critical patent/SE7407533L/xx
Publication of SE413774B publication Critical patent/SE413774B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
SE7407533A 1973-06-11 1974-06-07 PROCEDURE FOR PREPARING AN ADHESIVE METAL DEPOSIT ON A SURFACE OF EPOXY RESIN SE413774B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36903873A 1973-06-11 1973-06-11
US44364874A 1974-02-19 1974-02-19
US05465376 USB465376I5 (en) 1974-02-19 1974-05-01

Publications (2)

Publication Number Publication Date
SE7407533L SE7407533L (en) 1974-12-12
SE413774B true SE413774B (en) 1980-06-23

Family

ID=27408900

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7407533A SE413774B (en) 1973-06-11 1974-06-07 PROCEDURE FOR PREPARING AN ADHESIVE METAL DEPOSIT ON A SURFACE OF EPOXY RESIN

Country Status (15)

Country Link
JP (1) JPS544398B2 (en)
BR (1) BR7404745A (en)
CA (1) CA1060136A (en)
CH (1) CH603725A5 (en)
DE (1) DE2427030C3 (en)
ES (1) ES427131A1 (en)
FR (1) FR2232614B1 (en)
GB (1) GB1448415A (en)
HK (1) HK45977A (en)
IE (1) IE39796B1 (en)
IL (1) IL44997A (en)
IT (1) IT1011946B (en)
MY (1) MY7700290A (en)
NL (1) NL162118C (en)
SE (1) SE413774B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53109922A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109915A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109919A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109920A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109921A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109918A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109914A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
US4602053A (en) * 1984-05-24 1986-07-22 E. I. Du Pont De Nemours And Company Chip-resistant paint containing epoxyester linear block oligomer
EP0561048B1 (en) * 1992-03-16 1999-05-26 Raytheon Company Superior thermal transfer adhesive
JP4336955B2 (en) * 2003-08-07 2009-09-30 三菱瓦斯化学株式会社 Cyclohexanetricarboxylic acid monoester and use thereof
JP2005054145A (en) 2003-08-07 2005-03-03 Mitsubishi Gas Chem Co Inc Gas barrier (meth) acrylate resin cured product and paint, adhesive, film
JP5670048B2 (en) * 2009-12-21 2015-02-18 株式会社Ｄｎｐファインケミカル Adhesive composition and method for producing curable adhesive sheet
JP2012256872A (en) * 2011-05-12 2012-12-27 Rohm & Haas Electronic Materials Llc Adhesion promotion of metal to dielectric
CN115926110A (en) * 2022-12-29 2023-04-07 江苏扬农锦湖化工有限公司 A kind of modified epoxy resin and its preparation method and application

Also Published As

Publication number Publication date
JPS5034094A (en) 1975-04-02
NL162118C (en) 1980-04-15
FR2232614B1 (en) 1977-09-30
CA1060136A (en) 1979-08-07
ES427131A1 (en) 1976-09-01
CH603725A5 (en) 1978-08-31
DE2427030C3 (en) 1980-08-28
IT1011946B (en) 1977-02-10
IE39796L (en) 1974-12-11
DE2427030B2 (en) 1979-12-20
IL44997A0 (en) 1974-09-10
NL7407729A (en) 1974-12-13
GB1448415A (en) 1976-09-08
IL44997A (en) 1977-05-31
NL162118B (en) 1979-11-15
DE2427030A1 (en) 1975-01-02
JPS544398B2 (en) 1979-03-06
MY7700290A (en) 1977-12-31
IE39796B1 (en) 1979-01-03
SE7407533L (en) 1974-12-12
HK45977A (en) 1977-09-16
FR2232614A1 (en) 1975-01-03
BR7404745A (en) 1976-02-17

Similar Documents

Publication Publication Date Title
SE7511445L (en) DEVICE FOR COATING THE EDGE OF A MULTIPLASS WINDSCREEN
CA1031924A (en) Method of bonding a thermoplastic resinous protective coating to a metallic substrate
PT64997B (en) Process for the preparation of water-base epoxy resin zinc-rich coatings
SE408562B (en) DEVICE FOR CONTINUOUS ELECTROLYTICAL COATING OF A LONG-DIRECTED TAPE BAND
AR198566A1 (en) METHOD OF COATING SUBSTRATES
IT1033787B (en) METHOD FOR THE PREPARATION OF ADHESIVE COATINGS ON METALLIC SUBSTRATES
NL7711849A (en) PROCESS FOR PREPARING ADDUCTS OF EPOXY RESINS AND PROCESS FOR PREPARING COATING MATERIALS.
NL7613758A (en) PROCESS FOR PREPARING LIQUID EPOXY RESINS.
SE393209B (en) PROCEDURE FOR PREPARING A DIELKTRIC COATING ON THE SURFACE OF A CONDUCTIVE VIDEO DISC
IT1011946B (en) PROCEDURE FOR PRODUCING AN ADHESIVE METALLIC DEPOSIT ON A SURFACE
SE7511471L (en) NEW HARDENERS FOR EPOXIDE RESINS
IT1000481B (en) PROTECTIVE COATING FOR RESIN SUBSTRATES
SE412408B (en) PROCEDURE FOR APPLICATION OF A CURRENT COATING OF URETANACRYLATE MATERIAL ON A SUBSTRATE
SE386084B (en) DEVICE FOR APPLYING A POWDERED COATING PLANT FOR
DK415675A (en) ADHESIVE COATING SYSTEMS FOR SINGLE COATING
RO69378A (en) PROCESS FOR THE PREPARATION OF A 4- (4-BIFENYL) -1-BUTANOL COMPOUND
AR209921A1 (en) PROCEDURE FOR THE PRODUCTION OF SUBSTRATES COATED WITH MASSES OF HARDENED EPOXY RESINS
CH533795A (en) Device for maintaining the support stability of a turbo machine
IT958185B (en) PROCEDURE FOR COATING PRINTED PIECES
CA980617A (en) Method of improving adhesive properties of a cured epoxy-polyester surface
IT956310B (en) DEVICE FOR THE CREATION OF A FIXING BY ADHESION ME DIANTE AN ADHESIVE TO MULTIPLE COMPONENTS
SE417619B (en) PROCEDURE FOR PREPARING A STRONGLY ADHESIVE METAL LAYER ON A HEARTY SURFACE THROUGH STROMLESS METAL DEPOSIT
CA960074A (en) Method of improving adhesive properties of a surface comprising a cured epoxy
IT947234B (en) PROCESS FOR THE PREPARATION OF POLYADDITION COMPOUNDS BASED ON EPOXY RESINS
SE384058B (en) PROCEDURE FOR ADHESION OF PAPER BY APPLYING A WATER SOLUTION OF SAMPOLYMERISATE ON THE SURFACE OF THE PAPER

Legal Events

Date Code Title Description
NUG Patent has lapsed

Ref document number: 7407533-4

Effective date: 19900522

Format of ref document f/p: F