SE435343B - Forfarande vid beleggning vid skarpa kanter pa metallforemal - Google Patents
Forfarande vid beleggning vid skarpa kanter pa metallforemalInfo
- Publication number
- SE435343B SE435343B SE7812499A SE7812499A SE435343B SE 435343 B SE435343 B SE 435343B SE 7812499 A SE7812499 A SE 7812499A SE 7812499 A SE7812499 A SE 7812499A SE 435343 B SE435343 B SE 435343B
- Authority
- SE
- Sweden
- Prior art keywords
- coating
- exposed
- edge
- etched
- metal
- Prior art date
Links
- 238000000576 coating method Methods 0.000 title claims description 20
- 229910052751 metal Inorganic materials 0.000 title claims description 20
- 239000002184 metal Substances 0.000 title claims description 20
- 239000011248 coating agent Substances 0.000 title claims description 17
- 238000000034 method Methods 0.000 title claims description 12
- 238000001962 electrophoresis Methods 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000007790 scraping Methods 0.000 claims 2
- 239000003973 paint Substances 0.000 description 14
- 239000002966 varnish Substances 0.000 description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000004922 lacquer Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000000866 electrolytic etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 235000016068 Berberis vulgaris Nutrition 0.000 description 1
- 241000335053 Beta vulgaris Species 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 239000002650 laminated plastic Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical compound [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09581—Applying an insulating coating on the walls of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1438—Treating holes after another process, e.g. coating holes after coating the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- ing And Chemical Polishing (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE7812499A SE435343B (sv) | 1978-12-05 | 1978-12-05 | Forfarande vid beleggning vid skarpa kanter pa metallforemal |
| CA000340850A CA1145207A (en) | 1978-12-05 | 1979-11-29 | Process for coating a metal article on and at an edge |
| US06/099,754 US4321290A (en) | 1978-12-05 | 1979-12-03 | Process for coating a metal article on and at an edge |
| FR7929634A FR2443519A1 (fr) | 1978-12-05 | 1979-12-03 | Procede pour le revetement des aretes d'articles metalliques, notamment par electrophorese |
| IT69336/79A IT1119588B (it) | 1978-12-05 | 1979-12-04 | Procedimento per il rivestimento di articoli metallici in corrispondenza di uno spigolo |
| AU53422/79A AU525331B2 (en) | 1978-12-05 | 1979-12-04 | Process for coating a metal article |
| DK515479A DK151459C (da) | 1978-12-05 | 1979-12-04 | Fremgangsmaade til overtraekning af en metalgenstand i et kantomraade |
| JP54156951A JPS6014627B2 (ja) | 1978-12-05 | 1979-12-05 | 金属物品のへりを被覆する方法 |
| GB7942020A GB2040186B (en) | 1978-12-05 | 1979-12-05 | Process for coating a metal article on and at an edge |
| NL7908794A NL7908794A (nl) | 1978-12-05 | 1979-12-05 | Werkwijze voor het bekleden van een metalen voorwerp op en bij een rand. |
| CH1080679A CH645042A5 (de) | 1978-12-05 | 1979-12-05 | Verfahren zum gleichmaessigen beschichten der oberflaeche und der kanten eines metallischen gegenstandes. |
| AT0771079A AT370012B (de) | 1978-12-05 | 1979-12-05 | Verfahren zum ueberziehen von metallgegenstaenden auf und an einer kante |
| DE2948940A DE2948940C2 (de) | 1978-12-05 | 1979-12-05 | Anwendung eines Beschichtungsverfahrens, um an Kanten eines beschichteten Metallkörpers eine Beschichtungsmittelschicht zu erzeugen |
| BE0/198436A BE880447A (fr) | 1978-12-05 | 1979-12-05 | Procede d'enduction d'un article metallique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE7812499A SE435343B (sv) | 1978-12-05 | 1978-12-05 | Forfarande vid beleggning vid skarpa kanter pa metallforemal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE7812499L SE7812499L (sv) | 1980-06-06 |
| SE435343B true SE435343B (sv) | 1984-09-24 |
Family
ID=20336533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7812499A SE435343B (sv) | 1978-12-05 | 1978-12-05 | Forfarande vid beleggning vid skarpa kanter pa metallforemal |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US4321290A (de) |
| JP (1) | JPS6014627B2 (de) |
| AT (1) | AT370012B (de) |
| AU (1) | AU525331B2 (de) |
| BE (1) | BE880447A (de) |
| CA (1) | CA1145207A (de) |
| CH (1) | CH645042A5 (de) |
| DE (1) | DE2948940C2 (de) |
| DK (1) | DK151459C (de) |
| FR (1) | FR2443519A1 (de) |
| GB (1) | GB2040186B (de) |
| IT (1) | IT1119588B (de) |
| NL (1) | NL7908794A (de) |
| SE (1) | SE435343B (de) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5763294A (en) * | 1980-10-06 | 1982-04-16 | Fuji Photo Film Co Ltd | Photosensitive printing plate for lithography |
| JPS59102237U (ja) * | 1982-12-25 | 1984-07-10 | 筒井 将裕 | 端面を防蝕加工した塩ビ鋼板 |
| US4601916A (en) * | 1984-07-18 | 1986-07-22 | Kollmorgen Technologies Corporation | Process for bonding metals to electrophoretically deposited resin coatings |
| DE3517796A1 (de) * | 1985-05-17 | 1986-11-20 | Hoechst Ag, 6230 Frankfurt | Verfahren zur herstellung von elektrisch isolierendem basismaterial fuer die fertigung von durchkontaktierten leiterplatten |
| US4714646A (en) * | 1986-03-24 | 1987-12-22 | International Business Machines Corporation | Electrophoretic insulation of metal circuit board core |
| US5422167A (en) * | 1993-09-17 | 1995-06-06 | Infosight Corporation | High temperature-resistant, thermally-printable label for attachment to hot metal stock and method thereof |
| US5590460A (en) | 1994-07-19 | 1997-01-07 | Tessera, Inc. | Method of making multilayer circuit |
| US5714234A (en) * | 1996-06-10 | 1998-02-03 | Infosight Corporation | Identification tag with preform attachment |
| US6423907B1 (en) | 1998-02-09 | 2002-07-23 | Tessera, Inc. | Components with releasable leads |
| US6492201B1 (en) * | 1998-07-10 | 2002-12-10 | Tessera, Inc. | Forming microelectronic connection components by electrophoretic deposition |
| US6713587B2 (en) | 2001-03-08 | 2004-03-30 | Ppg Industries Ohio, Inc. | Electrodepositable dielectric coating compositions and methods related thereto |
| US6951707B2 (en) * | 2001-03-08 | 2005-10-04 | Ppg Industries Ohio, Inc. | Process for creating vias for circuit assemblies |
| US7000313B2 (en) * | 2001-03-08 | 2006-02-21 | Ppg Industries Ohio, Inc. | Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
| US6588095B2 (en) * | 2001-04-27 | 2003-07-08 | Hewlett-Packard Development Company, Lp. | Method of processing a device by electrophoresis coating |
| US20060213685A1 (en) * | 2002-06-27 | 2006-09-28 | Wang Alan E | Single or multi-layer printed circuit board with improved edge via design |
| EP1520454B1 (de) * | 2002-06-27 | 2012-01-25 | PPG Industries Ohio, Inc. | Ein- oder mehrschichtige leiterplatte mit vorstehenden sollbruch-laschen und verfahren zu deren herstellung |
| ES2389051T5 (es) | 2005-05-19 | 2021-07-07 | Hydro Aluminium Rolled Prod | Acondicionamiento de una tira litográfica |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US813618A (en) * | 1905-07-10 | 1906-02-27 | Arlington Company | Coated strip and method of making the same. |
| US3218187A (en) * | 1962-04-16 | 1965-11-16 | Anaconda Wire & Cable Co | Coating method |
| GB1191219A (en) * | 1967-07-04 | 1970-05-13 | Fuji Photo Film Co Ltd | A Method of Producing a Magnetic Recording Medium |
| GB1144844A (en) * | 1967-08-03 | 1969-03-12 | Pyrene Co Ltd | Coating of metals |
| US3682785A (en) * | 1971-03-30 | 1972-08-08 | Rca Corp | Process for forming an isolated circuit pattern on a conductive substrate |
-
1978
- 1978-12-05 SE SE7812499A patent/SE435343B/sv not_active IP Right Cessation
-
1979
- 1979-11-29 CA CA000340850A patent/CA1145207A/en not_active Expired
- 1979-12-03 US US06/099,754 patent/US4321290A/en not_active Expired - Lifetime
- 1979-12-03 FR FR7929634A patent/FR2443519A1/fr active Granted
- 1979-12-04 DK DK515479A patent/DK151459C/da not_active IP Right Cessation
- 1979-12-04 IT IT69336/79A patent/IT1119588B/it active
- 1979-12-04 AU AU53422/79A patent/AU525331B2/en not_active Ceased
- 1979-12-05 GB GB7942020A patent/GB2040186B/en not_active Expired
- 1979-12-05 DE DE2948940A patent/DE2948940C2/de not_active Expired
- 1979-12-05 NL NL7908794A patent/NL7908794A/nl not_active Application Discontinuation
- 1979-12-05 CH CH1080679A patent/CH645042A5/de not_active IP Right Cessation
- 1979-12-05 AT AT0771079A patent/AT370012B/de not_active IP Right Cessation
- 1979-12-05 BE BE0/198436A patent/BE880447A/fr not_active IP Right Cessation
- 1979-12-05 JP JP54156951A patent/JPS6014627B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| AT370012B (de) | 1983-02-25 |
| JPS55116469A (en) | 1980-09-08 |
| IT7969336A0 (it) | 1979-12-04 |
| ATA771079A (de) | 1982-07-15 |
| FR2443519A1 (fr) | 1980-07-04 |
| AU525331B2 (en) | 1982-10-28 |
| DK151459B (da) | 1987-12-07 |
| BE880447A (fr) | 1980-04-01 |
| SE7812499L (sv) | 1980-06-06 |
| DE2948940A1 (de) | 1980-06-19 |
| DK515479A (da) | 1980-06-06 |
| FR2443519B1 (de) | 1984-01-13 |
| NL7908794A (nl) | 1980-06-09 |
| DE2948940C2 (de) | 1986-02-27 |
| GB2040186A (en) | 1980-08-28 |
| CH645042A5 (de) | 1984-09-14 |
| DK151459C (da) | 1988-05-30 |
| AU5342279A (en) | 1980-06-12 |
| JPS6014627B2 (ja) | 1985-04-15 |
| GB2040186B (en) | 1983-01-26 |
| IT1119588B (it) | 1986-03-10 |
| CA1145207A (en) | 1983-04-26 |
| US4321290A (en) | 1982-03-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SE435343B (sv) | Forfarande vid beleggning vid skarpa kanter pa metallforemal | |
| EP0048406B1 (de) | Wärmeableitende Leiterplatten | |
| US3620933A (en) | Forming plastic parts having surfaces receptive to adherent coatings | |
| US3745095A (en) | Process of making a metal core printed circuit board | |
| US3742597A (en) | Method for making a coated printed circuit board | |
| US3666549A (en) | Method of making additive printed circuit boards and product thereof | |
| JPH02128492A (ja) | 印刷配線板の製造方法 | |
| CN105163502B (zh) | 厚铜板细小线宽线距蚀刻控制方法 | |
| US4783247A (en) | Method and manufacture for electrically insulating base material used in plated-through printed circuit panels | |
| CN104411099B (zh) | 厚铜电路板电路图形的转移方法 | |
| US3558441A (en) | Method of making a metal core printed circuit board | |
| CN105228357B (zh) | 一种阶梯线路板的制作方法 | |
| US3240684A (en) | Method of etching rhodium plated metal layers and of making rhodium plated printed circuit boards | |
| USRE28042E (en) | Method of making additive printed circuit boards and product thereof | |
| US3424658A (en) | Method of producing a printed circuit board on a metallic substrate | |
| US3131103A (en) | Method of making circuit components | |
| US3764485A (en) | Method of making and using electroplating matrix | |
| GB1253047A (de) | ||
| ES349275A1 (es) | Un metodo de producir un dibujo de circuito conductor de configuracion previamente determinada. | |
| JPH02144988A (ja) | スルーホール付配線板の製造方法 | |
| JPS5843920B2 (ja) | 印刷配線板の製造方法 | |
| JPH0344823B2 (de) | ||
| JPS63177585A (ja) | プリント配線板の製法 | |
| JPS61208891A (ja) | 金属ベ−スプリント基板の防錆方法 | |
| JPH04297088A (ja) | スルーホール付配線板の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NUG | Patent has lapsed |
Ref document number: 7812499-7 Effective date: 19930709 Format of ref document f/p: F |