SE435343B - Forfarande vid beleggning vid skarpa kanter pa metallforemal - Google Patents

Forfarande vid beleggning vid skarpa kanter pa metallforemal

Info

Publication number: SE435343B
Authority: SE; Sweden
Prior art keywords: coating; exposed; edge; etched; metal
Prior art date: 1978-12-05

Application number

SE7812499A

Other languages

English (en)

Swedish (sv)

Other versions

SE7812499L (sv

Inventor

Johan-Petter Brynjulf Thams

Original Assignee

Thams Johan Petter B

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-12-05

Filing date

1978-12-05

Publication date

1984-09-24

1978-12-05 Application filed by Thams Johan Petter B filed Critical Thams Johan Petter B

1978-12-05 Priority to SE7812499A priority Critical patent/SE435343B/sv

1979-11-29 Priority to CA000340850A priority patent/CA1145207A/en

1979-12-03 Priority to FR7929634A priority patent/FR2443519A1/fr

1979-12-03 Priority to US06/099,754 priority patent/US4321290A/en

1979-12-04 Priority to AU53422/79A priority patent/AU525331B2/en

1979-12-04 Priority to IT69336/79A priority patent/IT1119588B/it

1979-12-04 Priority to DK515479A priority patent/DK151459C/da

1979-12-05 Priority to BE0/198436A priority patent/BE880447A/fr

1979-12-05 Priority to GB7942020A priority patent/GB2040186B/en

1979-12-05 Priority to NL7908794A priority patent/NL7908794A/nl

1979-12-05 Priority to CH1080679A priority patent/CH645042A5/de

1979-12-05 Priority to DE2948940A priority patent/DE2948940C2/de

1979-12-05 Priority to JP54156951A priority patent/JPS6014627B2/ja

1979-12-05 Priority to AT0771079A priority patent/AT370012B/de

1980-06-06 Publication of SE7812499L publication Critical patent/SE7812499L/xx

1984-09-24 Publication of SE435343B publication Critical patent/SE435343B/sv

Links

238000000576 coating method Methods 0.000 title claims description 20
229910052751 metal Inorganic materials 0.000 title claims description 20
239000002184 metal Substances 0.000 title claims description 20
239000011248 coating agent Substances 0.000 title claims description 17
238000000034 method Methods 0.000 title claims description 12
238000001962 electrophoresis Methods 0.000 claims description 5
239000004033 plastic Substances 0.000 claims description 5
229920003023 plastic Polymers 0.000 claims description 5
238000005553 drilling Methods 0.000 claims description 4
238000004080 punching Methods 0.000 claims description 4
238000005520 cutting process Methods 0.000 claims description 2
238000004519 manufacturing process Methods 0.000 claims description 2
238000007790 scraping Methods 0.000 claims 2
239000003973 paint Substances 0.000 description 14
239000002966 varnish Substances 0.000 description 14
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
239000004922 lacquer Substances 0.000 description 8
239000000126 substance Substances 0.000 description 7
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
239000010410 layer Substances 0.000 description 6
239000000758 substrate Substances 0.000 description 6
239000004593 Epoxy Substances 0.000 description 4
NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
239000000853 adhesive Substances 0.000 description 4
230000001070 adhesive effect Effects 0.000 description 4
AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 4
229910052782 aluminium Inorganic materials 0.000 description 4
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
229910052742 iron Inorganic materials 0.000 description 4
239000007788 liquid Substances 0.000 description 4
239000000463 material Substances 0.000 description 4
239000000243 solution Substances 0.000 description 4
YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
229910052802 copper Inorganic materials 0.000 description 3
239000010949 copper Substances 0.000 description 3
239000011889 copper foil Substances 0.000 description 3
238000005530 etching Methods 0.000 description 3
229920000515 polycarbonate Polymers 0.000 description 3
239000004417 polycarbonate Substances 0.000 description 3
239000002344 surface layer Substances 0.000 description 3
229920001187 thermosetting polymer Polymers 0.000 description 3
239000002253 acid Substances 0.000 description 2
239000000654 additive Substances 0.000 description 2
230000000996 additive effect Effects 0.000 description 2
239000002585 base Substances 0.000 description 2
239000011247 coating layer Substances 0.000 description 2
238000007598 dipping method Methods 0.000 description 2
238000001035 drying Methods 0.000 description 2
238000000866 electrolytic etching Methods 0.000 description 2
239000011521 glass Substances 0.000 description 2
238000009413 insulation Methods 0.000 description 2
238000003801 milling Methods 0.000 description 2
239000000203 mixture Substances 0.000 description 2
229920000642 polymer Polymers 0.000 description 2
238000005245 sintering Methods 0.000 description 2
235000016068 Berberis vulgaris Nutrition 0.000 description 1
241000335053 Beta vulgaris Species 0.000 description 1
KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
239000004640 Melamine resin Substances 0.000 description 1
229920000877 Melamine resin Polymers 0.000 description 1
CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
229910000831 Steel Inorganic materials 0.000 description 1
150000007513 acids Chemical class 0.000 description 1
239000003513 alkali Substances 0.000 description 1
229910001854 alkali hydroxide Inorganic materials 0.000 description 1
150000008044 alkali metal hydroxides Chemical class 0.000 description 1
238000007743 anodising Methods 0.000 description 1
239000003637 basic solution Substances 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
239000012295 chemical reaction liquid Substances 0.000 description 1
238000005260 corrosion Methods 0.000 description 1
230000007797 corrosion Effects 0.000 description 1
238000004070 electrodeposition Methods 0.000 description 1
239000011888 foil Substances 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
239000002650 laminated plastic Substances 0.000 description 1
229910001092 metal group alloy Inorganic materials 0.000 description 1
239000000178 monomer Substances 0.000 description 1
239000003960 organic solvent Substances 0.000 description 1
229920001084 poly(chloroprene) Polymers 0.000 description 1
229920000058 polyacrylate Polymers 0.000 description 1
229920000728 polyester Polymers 0.000 description 1
229920002620 polyvinyl fluoride Polymers 0.000 description 1
239000000843 powder Substances 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
238000002203 pretreatment Methods 0.000 description 1
230000001681 protective effect Effects 0.000 description 1
108090000623 proteins and genes Proteins 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
239000010935 stainless steel Substances 0.000 description 1
229910001220 stainless steel Inorganic materials 0.000 description 1
239000010959 steel Substances 0.000 description 1
LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical compound [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09581—Applying an insulating coating on the walls of holes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1438—Treating holes after another process, e.g. coating holes after coating the substrate

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Microelectronics & Electronic Packaging (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Manufacturing & Machinery (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Application Of Or Painting With Fluid Materials (AREA)
Laminated Bodies (AREA)
ing And Chemical Polishing (AREA)
Insulated Metal Substrates For Printed Circuits (AREA)
Physical Vapour Deposition (AREA)

SE7812499A 1978-12-05 1978-12-05 Forfarande vid beleggning vid skarpa kanter pa metallforemal SE435343B (sv)

Priority Applications (14)

Application Number	Priority Date	Filing Date	Title
SE7812499A SE435343B (sv)	1978-12-05	1978-12-05	Forfarande vid beleggning vid skarpa kanter pa metallforemal
CA000340850A CA1145207A (en)	1978-12-05	1979-11-29	Process for coating a metal article on and at an edge
FR7929634A FR2443519A1 (fr)	1978-12-05	1979-12-03	Procede pour le revetement des aretes d'articles metalliques, notamment par electrophorese
US06/099,754 US4321290A (en)	1978-12-05	1979-12-03	Process for coating a metal article on and at an edge
AU53422/79A AU525331B2 (en)	1978-12-05	1979-12-04	Process for coating a metal article
IT69336/79A IT1119588B (it)	1978-12-05	1979-12-04	Procedimento per il rivestimento di articoli metallici in corrispondenza di uno spigolo
DK515479A DK151459C (da)	1978-12-05	1979-12-04	Fremgangsmaade til overtraekning af en metalgenstand i et kantomraade
BE0/198436A BE880447A (fr)	1978-12-05	1979-12-05	Procede d'enduction d'un article metallique
GB7942020A GB2040186B (en)	1978-12-05	1979-12-05	Process for coating a metal article on and at an edge
NL7908794A NL7908794A (nl)	1978-12-05	1979-12-05	Werkwijze voor het bekleden van een metalen voorwerp op en bij een rand.
CH1080679A CH645042A5 (de)	1978-12-05	1979-12-05	Verfahren zum gleichmaessigen beschichten der oberflaeche und der kanten eines metallischen gegenstandes.
DE2948940A DE2948940C2 (de)	1978-12-05	1979-12-05	Anwendung eines Beschichtungsverfahrens, um an Kanten eines beschichteten Metallkörpers eine Beschichtungsmittelschicht zu erzeugen
JP54156951A JPS6014627B2 (ja)	1978-12-05	1979-12-05	金属物品のへりを被覆する方法
AT0771079A AT370012B (de)	1978-12-05	1979-12-05	Verfahren zum ueberziehen von metallgegenstaenden auf und an einer kante

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
SE7812499A SE435343B (sv)	1978-12-05	1978-12-05	Forfarande vid beleggning vid skarpa kanter pa metallforemal

Publications (2)

Publication Number	Publication Date
SE7812499L SE7812499L (sv)	1980-06-06
SE435343B true SE435343B (sv)	1984-09-24

Family

ID=20336533

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SE7812499A SE435343B (sv)	1978-12-05	1978-12-05	Forfarande vid beleggning vid skarpa kanter pa metallforemal

Country Status (14)

Country	Link
US (1)	US4321290A (de)
JP (1)	JPS6014627B2 (de)
AT (1)	AT370012B (de)
AU (1)	AU525331B2 (de)
BE (1)	BE880447A (de)
CA (1)	CA1145207A (de)
CH (1)	CH645042A5 (de)
DE (1)	DE2948940C2 (de)
DK (1)	DK151459C (de)
FR (1)	FR2443519A1 (de)
GB (1)	GB2040186B (de)
IT (1)	IT1119588B (de)
NL (1)	NL7908794A (de)
SE (1)	SE435343B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5763294A (en) *	1980-10-06	1982-04-16	Fuji Photo Film Co Ltd	Photosensitive printing plate for lithography
JPS59102237U (ja) *	1982-12-25	1984-07-10	筒井　将裕	端面を防蝕加工した塩ビ鋼板
US4601916A (en) *	1984-07-18	1986-07-22	Kollmorgen Technologies Corporation	Process for bonding metals to electrophoretically deposited resin coatings
DE3517796A1 (de) *	1985-05-17	1986-11-20	Hoechst Ag, 6230 Frankfurt	Verfahren zur herstellung von elektrisch isolierendem basismaterial fuer die fertigung von durchkontaktierten leiterplatten
US4714646A (en) *	1986-03-24	1987-12-22	International Business Machines Corporation	Electrophoretic insulation of metal circuit board core
US5422167A (en) *	1993-09-17	1995-06-06	Infosight Corporation	High temperature-resistant, thermally-printable label for attachment to hot metal stock and method thereof
US5590460A (en)	1994-07-19	1997-01-07	Tessera, Inc.	Method of making multilayer circuit
US5714234A (en) *	1996-06-10	1998-02-03	Infosight Corporation	Identification tag with preform attachment
US6423907B1 (en) *	1998-02-09	2002-07-23	Tessera, Inc.	Components with releasable leads
US6492201B1 (en)	1998-07-10	2002-12-10	Tessera, Inc.	Forming microelectronic connection components by electrophoretic deposition
US7000313B2 (en) *	2001-03-08	2006-02-21	Ppg Industries Ohio, Inc.	Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions
US6951707B2 (en) *	2001-03-08	2005-10-04	Ppg Industries Ohio, Inc.	Process for creating vias for circuit assemblies
US6713587B2 (en)	2001-03-08	2004-03-30	Ppg Industries Ohio, Inc.	Electrodepositable dielectric coating compositions and methods related thereto
US6588095B2 (en)	2001-04-27	2003-07-08	Hewlett-Packard Development Company, Lp.	Method of processing a device by electrophoresis coating
US20060213685A1 (en) *	2002-06-27	2006-09-28	Wang Alan E	Single or multi-layer printed circuit board with improved edge via design
WO2004004432A1 (en) *	2002-06-27	2004-01-08	Ppg Industries Ohio, Inc.	Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof
ES2389051T5 (es)	2005-05-19	2021-07-07	Hydro Aluminium Rolled Prod	Acondicionamiento de una tira litográfica

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US813618A (en) *	1905-07-10	1906-02-27	Arlington Company	Coated strip and method of making the same.
US3218187A (en) *	1962-04-16	1965-11-16	Anaconda Wire & Cable Co	Coating method
GB1191219A (en) *	1967-07-04	1970-05-13	Fuji Photo Film Co Ltd	A Method of Producing a Magnetic Recording Medium
GB1144844A (en) *	1967-08-03	1969-03-12	Pyrene Co Ltd	Coating of metals
US3682785A (en) *	1971-03-30	1972-08-08	Rca Corp	Process for forming an isolated circuit pattern on a conductive substrate

1978
- 1978-12-05 SE SE7812499A patent/SE435343B/sv not_active IP Right Cessation
1979
- 1979-11-29 CA CA000340850A patent/CA1145207A/en not_active Expired
- 1979-12-03 FR FR7929634A patent/FR2443519A1/fr active Granted
- 1979-12-03 US US06/099,754 patent/US4321290A/en not_active Expired - Lifetime
- 1979-12-04 DK DK515479A patent/DK151459C/da not_active IP Right Cessation
- 1979-12-04 AU AU53422/79A patent/AU525331B2/en not_active Ceased
- 1979-12-04 IT IT69336/79A patent/IT1119588B/it active
- 1979-12-05 CH CH1080679A patent/CH645042A5/de not_active IP Right Cessation
- 1979-12-05 NL NL7908794A patent/NL7908794A/nl not_active Application Discontinuation
- 1979-12-05 DE DE2948940A patent/DE2948940C2/de not_active Expired
- 1979-12-05 GB GB7942020A patent/GB2040186B/en not_active Expired
- 1979-12-05 AT AT0771079A patent/AT370012B/de not_active IP Right Cessation
- 1979-12-05 JP JP54156951A patent/JPS6014627B2/ja not_active Expired
- 1979-12-05 BE BE0/198436A patent/BE880447A/fr not_active IP Right Cessation

Also Published As

Publication number	Publication date
BE880447A (fr)	1980-04-01
GB2040186A (en)	1980-08-28
ATA771079A (de)	1982-07-15
JPS55116469A (en)	1980-09-08
DK151459B (da)	1987-12-07
FR2443519B1 (de)	1984-01-13
DE2948940A1 (de)	1980-06-19
IT1119588B (it)	1986-03-10
FR2443519A1 (fr)	1980-07-04
AT370012B (de)	1983-02-25
AU5342279A (en)	1980-06-12
DK151459C (da)	1988-05-30
JPS6014627B2 (ja)	1985-04-15
DE2948940C2 (de)	1986-02-27
AU525331B2 (en)	1982-10-28
CH645042A5 (de)	1984-09-14
DK515479A (da)	1980-06-06
SE7812499L (sv)	1980-06-06
GB2040186B (en)	1983-01-26
US4321290A (en)	1982-03-23
CA1145207A (en)	1983-04-26
IT7969336A0 (it)	1979-12-04
NL7908794A (nl)	1980-06-09

Legal Events

Date

Code

Title

Description

1995-01-31

NUG

Patent has lapsed

Ref document number: 7812499-7

Effective date: 19930709

Format of ref document f/p: F

Publication	Publication Date	Title
US4321290A (en)	1982-03-23	Process for coating a metal article on and at an edge
EP0048406B1 (de)	1989-04-26	Wärmeableitende Leiterplatten
US3745095A (en)	1973-07-10	Process of making a metal core printed circuit board
US3698940A (en)	1972-10-17	Method of making additive printed circuit boards and product thereof
US3742597A (en)	1973-07-03	Method for making a coated printed circuit board
US3666549A (en)	1972-05-30	Method of making additive printed circuit boards and product thereof
CN105163502B (zh)	2017-12-19	厚铜板细小线宽线距蚀刻控制方法
JPH02128492A (ja)	1990-05-16	印刷配線板の製造方法
US4783247A (en)	1988-11-08	Method and manufacture for electrically insulating base material used in plated-through printed circuit panels
CN104411099B (zh)	2017-04-12	厚铜电路板电路图形的转移方法
EP3000288B1 (de)	2019-03-27	Leiterplatte und verfahren zur herstellung davon
US3558441A (en)	1971-01-26	Method of making a metal core printed circuit board
CN105228357B (zh)	2017-12-01	一种阶梯线路板的制作方法
KR830008634A (ko)	1983-12-10	후막파인패턴(thick film fine pattern) 도전체(導電體)의 제조방법
US3240684A (en)	1966-03-15	Method of etching rhodium plated metal layers and of making rhodium plated printed circuit boards
USRE28042E (en)	1974-06-11	Method of making additive printed circuit boards and product thereof
US3424658A (en)	1969-01-28	Method of producing a printed circuit board on a metallic substrate
US3395057A (en)	1968-07-30	Method for etching polyiminde plastic film
GB2080630A (en)	1982-02-03	Printed circuit panels
US3131103A (en)	1964-04-28	Method of making circuit components
US3764485A (en)	1973-10-09	Method of making and using electroplating matrix
GB1253047A (de)	1971-11-10
ES349275A1 (es)	1969-04-01	Un metodo de producir un dibujo de circuito conductor de configuracion previamente determinada.
JPH02144988A (ja)	1990-06-04	スルーホール付配線板の製造方法
JPS5843920B2 (ja)	1983-09-29	印刷配線板の製造方法