SE457584B - REFRIGERATOR FOR SEMI-CONDUCTOR - Google Patents

REFRIGERATOR FOR SEMI-CONDUCTOR

Info

Publication number
SE457584B
SE457584B SE8103779A SE8103779A SE457584B SE 457584 B SE457584 B SE 457584B SE 8103779 A SE8103779 A SE 8103779A SE 8103779 A SE8103779 A SE 8103779A SE 457584 B SE457584 B SE 457584B
Authority
SE
Sweden
Prior art keywords
heat sink
sink according
cooling fins
profile insert
profile
Prior art date
Application number
SE8103779A
Other languages
Swedish (sv)
Other versions
SE8103779L (en
Inventor
U Bock
Original Assignee
Alusuisse
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alusuisse filed Critical Alusuisse
Publication of SE8103779L publication Critical patent/SE8103779L/en
Publication of SE457584B publication Critical patent/SE457584B/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/60Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641Snap-on arrangements, e.g. clips
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/22Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00Fins
    • F28F2215/10Secondary fins, e.g. projections or recesses on main fins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

457 584' ' 10 15 20 25 30 55 Tack vare åtgärderna enligt uppfinningen förbättras avsevärt strömningsförhållandena genom kylkroppens speciella utform- ning vid väsentligt reducerat fläneförhållande. 457 584' ' 10 15 20 25 30 55 Thanks to the measures according to the invention, the flow conditions are significantly improved by the special design of the heat sink with a significantly reduced fin ratio.

Kylkroppen enligt uppfinningen uppvisar alltså flänsar med olika höjd, varvid höjdskillnaderna utjämnas genom de på- klämda profilinsatserna, som i sin tur uppvisar tvärflänsar och således avsevärt bidrager till kylningsbeteendet. Här- igenom kan flänsförhållandet sänkas från hittills 7. 25 : 1 till ungefär 4 s l. Därutöver uppnås en avsevärd tillverk- ningsförenkling. Såväl själva kylkroppen som profilinsatsen kapae i längder från strängpressade profiler.The heat sink according to the invention thus has flanges of different heights, the height differences being equalised by the clamped profile inserts, which in turn have transverse flanges and thus contribute considerably to the cooling behaviour. This allows the flange ratio to be reduced from the previous 7.25 : 1 to approximately 4 s l. In addition, a considerable simplification of manufacture is achieved. Both the heat sink itself and the profile insert are cut to length from extruded profiles.

Hed hänvisning till bifogade ritning beskrivs nedan som exempel sn lämplig utföringsform av finningen. På ritningen visar fig. del av kylkroppen enligt upp- l ett tvärsnitt genom en en sådan utföringsform av kylkroppen enligt uppfin- ningen med profilinsats, och fig. 2 ett tvärsnitt genom profilinsatsen.With reference to the accompanying drawing, a suitable embodiment of the invention is described below by way of example. In the drawing, Fig. 1 shows a cross-section through such an embodiment of the cooling body according to the invention with a profile insert, and Fig. 2 shows a cross-section through the profile insert.

En kylkropp l uppvisar enligt fig. l en grundplatta 2 med en tjocklek i på exempelvis 15 nn och med därifrån utskjutande kylflänsar 3. 4-av olika höjd a- (exempelvis 40 m) respek- tive b (70 un) och med tvärsnitt som avsmalnar mot de av- rundade flänsspetsarna 5, 6.A heat sink 1 has, according to Fig. 1, a base plate 2 with a thickness i of, for example, 15 mm and with cooling fins 3, 4 projecting therefrom of different heights a (for example, 40 mm) and b (70 mm) respectively and with cross sections that taper towards the rounded fin tips 5, 6.

De längre kylflänsarnas 3 basbredd d uppgår till 5 :mn och är obetydligt större än de kortare kylflänsarnas 4 basbredd e.The base width d of the longer cooling fins 3 amounts to 5 mm and is slightly larger than the base width e of the shorter cooling fins 4.

Profilbredden f vid de längre kylflänsarnas 3 spets 5 är med 2.5 :mn endast obetydligt större än bredden g vid de kortare kylflänsarnas 4 spets 6.The profile width f at the tip 5 of the longer cooling fins 3 is, at 2.5 mm, only slightly larger than the width g at the tip 6 of the shorter cooling fins 4.

De långa kylflänearnas 3 flänshöjd b förhåller sig till flänsmellanrummet m såsom 3 : l, och de korta kylflänsarnas 4 flänshöjd a. till det i fig. 1 för ökad tydlighet smala 10 15 20 25 457 584 flänsmellanrummet n till den närbelägna långa kylflänsen 3 såsom 4 :l . Basmellanrummet p mäter ungefär 7 mm.The flange height b of the long cooling fins 3 is related to the flange spacing m as 3 : l, and the flange height a of the short cooling fins 4 to the flange spacing n, which is narrow in Fig. 1 for increased clarity, to the adjacent long cooling fin 3 as 4 : l. The base spacing p measures approximately 7 mm.

Flänsspetsarna 6 kan uppvisa räfflade ytor, för att ge bättre fäste åt en profilinsats 10, som medelst en klämlik- nande huvuddel 11 är pâträdbar på de korta kylflänsarna 4 och sedan medelst stödben 12, 13 stöder sig mot de långa kylflänsarnas 3 flanker 9. Således uppstår överallt i en dal mellan varandra intilliggande långa kylflänsar 3 fyra kam- mare 14, 15, vars inre kammare 14 bildas av grundplattan 2, kylflänsarna 3, 4, 3 och den klämliknande huvuddelens ll stödben 12, och de yttre kamrarna 15 av de långa kylflän- sarnas 3 spetsområden och profilinsatsen eller påträdnings- profilen 10. 0 Från profilinsatsens 10 trappstegsartade profilkropp 20 ut- skjuter tvärs dess längdaxel M på båda sidor tvärflänsar 21, som kan vara av olika höjd h eller ha samma längd. n Varje stödbenpars båda stödben 12, 13 lutar överallt med lika vinkel t resp. w mot längdaxeln M, varvid stödbenen 12 på huvuddelen ll bildar ett klämspár 22. Stödbenen 12, 13 på varje sida förlöper ungefär oarallellt med varandra. 1 Profilinsatsens 10 totala längd q mäter ungefär 35 mm.The flange tips 6 can have grooved surfaces to provide better grip for a profile insert 10, which can be threaded onto the short cooling fins 4 by means of a clamp-like main part 11 and then rests against the flanks 9 of the long cooling fins 3 by means of support legs 12, 13. Thus, four chambers 14, 15 are formed everywhere in a valley between adjacent long cooling fins 3, the inner chamber 14 of which is formed by the base plate 2, the cooling fins 3, 4, 3 and the support legs 12 of the clamp-like main part 11, and the outer chambers 15 by the tip regions of the long cooling fins 3 and the profile insert or threading profile 10. 0 From the stepped profile body 20 of the profile insert 10, projecting transversely to its longitudinal axis M on both sides cross flanges 21, which can be of different heights h or have the same length. n The two supporting legs 12, 13 of each supporting leg pair are inclined everywhere at the same angle t or w to the longitudinal axis M, whereby the supporting legs 12 on the main part ll form a clamping groove 22. The supporting legs 12, 13 on each side run approximately parallel to each other. 1 The total length q of the profile insert 10 measures approximately 35 mm.

Claims (12)

10 15 20 25 30 35 457 584- Patentkrav10 15 20 25 30 35 457 584- Patent claims 1. Kylkropp för halvledare. särskilt av strângpressadefpro- filer, med på avstånd från varandra fran en grundplatta ut- skjutande kylflânsar ned stavformigt tvärsnitt. t e c k n a d av att kylflänsar (3 resp. tvâ olika höjder (b resp. anordande, k ä n n e - 4) av åtminstone a) är i detta avseende växelvis liksom att på åtminstone en del av de kortare kyl- flänsarna (4) :inst en profilinsats (10) är fästad.1. Heat sink for semiconductors. In particular, made of extruded profiles, with cooling fins of rod-shaped cross-section projecting from a base plate at a distance from each other. Characterized by the cooling fins (3 or two different heights (b or arrangement, characteristic - 4) of at least a) being alternated in this respect, and by the fact that a profile insert (10) is attached to at least some of the shorter cooling fins (4). 2. Kylkropp enligt krav 1. k ä n n e t e c k n a d av att mellan tvâ långa kylflänsar (3) en profilinsats (10) och fastklämd på den nellan dessa kylflänsar anordnade korta kyl- flänsen (4).2. Heat sink according to claim 1, characterized in that a profile insert (10) is arranged between two long cooling fins (3) and a short cooling fin (4) is clamped onto the one between these cooling fins. 3. Kylkropp enligt krav 2. k ä n n e t e o k n a d av att de korta kylflänsarna (4) är friktionsbefränjande utbildade i omrâdet kring sina spetsar (6).3. A heat sink according to claim 2, further characterized in that the short cooling fins (4) are formed in a friction-reducing manner in the area around their tips (6). 4. Kylkropp enligt krav 1 eller 2, k ä n n e t e c k n a d av att profilinsatsen (10) är försedd ned minst ett klänorgan (22). I4. Heat sink according to claim 1 or 2, characterized in that the profile insert (10) is provided with at least one clamping member (22). In 5. Kylkropp enligt nagot av krav l-4,. k ä n n e t e c k - n a d av att profilinsatsen (10) genom från sin profilkropp (20) utstående stödben (12. 13) stöder sig på de not varandra vända flankerua (9) till de långa kylflänsarna (3).5. A heat sink according to any one of claims 1-4, characterised in that the profile insert (10) is supported on the opposite flanks (9) of the long cooling fins (3) by means of supporting legs (12, 13) projecting from its profile body (20). 6. Kylkropp enligt krav 4 och 5. k ä n n e t e c k n a d av att profilinsatsens (10) klänorgan är utformat son ett nellan två stödben (12) anordnat klänhuvud (ll).6. A heat sink according to claims 4 and 5, characterized in that the clamping member of the profile insert (10) is designed as a clamping head (11) arranged between two support legs (12). 7. Kylkropp enligt ninst nagot av krav 1-6. k ä n n e - t e c k n a d av att tvâ långa kylflänsar (3) och en kort kylfläns (4) ned profilinsatsen (10) bildar åtminstone tva. företrädesvis fyra kammare (14. 15). 10 15 20 457 5847. Heat sink according to at least one of claims 1-6. characterized in that two long cooling fins (3) and a short cooling fin (4) below the profile insert (10) form at least two. preferably four chambers (14. 15). 10 15 20 457 584 8. Kylkropp enligt åtminstone nagot av krav 1-7. k ä n n e - t e c k n a d av att från profilinsatsens (10) profilkropp (20) tvärs för dess längdaxel (H) i och för sig kända tvär- flänsar (21) sticker ut.8. A heat sink according to at least one of claims 1-7, characterized in that transverse flanges (21) known per se protrude from the profile body (20) of the profile insert (10) transversely to its longitudinal axis (H). 9. Kylkropp enligt krav 5 och 8, k ä n n e t e c k n a d av att tvärflänsarna (21) är ungefär av halva längden på stöd- benen (12, 13).9. Heat sink according to claims 5 and 8, characterized in that the transverse flanges (21) are approximately half the length of the support legs (12, 13). 10. Kylkropp enligt krav 8 eller 9. k ä n n e t e c k n a d av att tvärflänsarnas längd (h) är olika på en profilinsats- sida.10. Heat sink according to claim 8 or 9, characterized in that the length (h) of the cross-flanges is different on one side of the profile insert. 11. ll. Kylkropp enligt-åtminstone något av krav 1-7, k ä n - n e t e c k n a d av att den korta kylflänsens (4) höjd (a) mäter ungefär 1/3 till hälften av höjden (b) på den långa kylflänsen (3).11. 11. Heat sink according to at least one of claims 1-7, characterized in that the height (a) of the short heat sink (4) measures approximately 1/3 to half of the height (b) of the long heat sink (3). 12. Kylkropp enligt åtminstone något av krav 1-7 eller ll. k ä n n e t e c k n a d av.att den långa kylflänsens (3) höjd (b) förhåller sig till öppna bredden (I) lellan dessa kylflänsar son 3:1 och/eller den korta kylflänsens (4) höjd (a) förhåller sig till öppna bredden (n) nellan den och in- tilliggande ianga xylnäns (a) son 4:1.12. Heat sink according to at least one of claims 1-7 or 11. characterized in that the height (b) of the long cooling fin (3) is related to the open width (I) of these cooling fins by 3:1 and/or the height (a) of the short cooling fin (4) is related to the open width (n) of the and adjacent long fins (a) by 4:1.
SE8103779A 1980-06-30 1981-06-16 REFRIGERATOR FOR SEMI-CONDUCTOR SE457584B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3024748A DE3024748C2 (en) 1980-06-30 1980-06-30 Heat sinks for semiconductor components

Publications (2)

Publication Number Publication Date
SE8103779L SE8103779L (en) 1981-12-31
SE457584B true SE457584B (en) 1989-01-09

Family

ID=6106046

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8103779A SE457584B (en) 1980-06-30 1981-06-16 REFRIGERATOR FOR SEMI-CONDUCTOR

Country Status (4)

Country Link
DE (1) DE3024748C2 (en)
FR (1) FR2485807A1 (en)
GB (1) GB2079052B (en)
SE (1) SE457584B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3518310A1 (en) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
DE8703604U1 (en) * 1987-03-11 1988-07-21 Euroatlas GmbH für Umformertechnik und Optronik, 2800 Bremen Heat sink with semiconductor switch
DE59106364D1 (en) * 1990-10-24 1995-10-05 Alusuisse Lonza Services Ag Heatsinks for semiconductor devices.
DE9319259U1 (en) * 1993-12-15 1994-03-24 Siemens AG, 80333 München Heatsink
GB2333353A (en) * 1998-01-16 1999-07-21 Kuo Ching Sung Heat dissipating device
DE19806978B4 (en) * 1998-02-19 2008-08-21 Behr Gmbh & Co. Kg Cooling device for cooling by convection
DE102004040557A1 (en) * 2004-08-16 2006-02-23 Kern, Dietmar, Dr.-Ing. Electronics heatsink
DE102009037259B4 (en) * 2009-08-12 2012-04-19 Semikron Elektronik Gmbh & Co. Kg Arrangement with a cooling device and a power semiconductor module
US20160369995A1 (en) * 2015-06-16 2016-12-22 Posco Led Company Ltd. Optical semiconductor lighting apparatus
EP3403937B1 (en) * 2017-05-19 2021-01-13 Goodrich Lighting Systems GmbH Exterior aircraft light unit
DE102019107280B4 (en) * 2019-03-21 2026-01-29 apt Extrusions GmbH & Co. KG Cooling device for cooling a third-party object to be cooled
EP3973749B1 (en) * 2019-06-03 2026-02-25 Huawei Technologies Co., Ltd. An apparatus for transferring heat from a heat source to air

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1959193A1 (en) * 1969-11-25 1971-05-27 Leonhard Roesch Knitting loops and courses indicator
DE7913126U1 (en) * 1979-05-07 1979-08-23 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt HEAT SINK MADE OF EXTRUDED ALUMINUM FOR PERFORMANCE SEMICONDUCTORS

Also Published As

Publication number Publication date
DE3024748C2 (en) 1986-09-04
FR2485807A1 (en) 1981-12-31
GB2079052A (en) 1982-01-13
SE8103779L (en) 1981-12-31
GB2079052B (en) 1984-10-24
FR2485807B3 (en) 1983-07-18
DE3024748A1 (en) 1982-02-04

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