SE457584B - REFRIGERATOR FOR SEMI-CONDUCTOR - Google Patents
REFRIGERATOR FOR SEMI-CONDUCTORInfo
- Publication number
- SE457584B SE457584B SE8103779A SE8103779A SE457584B SE 457584 B SE457584 B SE 457584B SE 8103779 A SE8103779 A SE 8103779A SE 8103779 A SE8103779 A SE 8103779A SE 457584 B SE457584 B SE 457584B
- Authority
- SE
- Sweden
- Prior art keywords
- heat sink
- sink according
- cooling fins
- profile insert
- profile
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/641—Snap-on arrangements, e.g. clips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
457 584' ' 10 15 20 25 30 55 Tack vare åtgärderna enligt uppfinningen förbättras avsevärt strömningsförhållandena genom kylkroppens speciella utform- ning vid väsentligt reducerat fläneförhållande. 457 584' ' 10 15 20 25 30 55 Thanks to the measures according to the invention, the flow conditions are significantly improved by the special design of the heat sink with a significantly reduced fin ratio.
Kylkroppen enligt uppfinningen uppvisar alltså flänsar med olika höjd, varvid höjdskillnaderna utjämnas genom de på- klämda profilinsatserna, som i sin tur uppvisar tvärflänsar och således avsevärt bidrager till kylningsbeteendet. Här- igenom kan flänsförhållandet sänkas från hittills 7. 25 : 1 till ungefär 4 s l. Därutöver uppnås en avsevärd tillverk- ningsförenkling. Såväl själva kylkroppen som profilinsatsen kapae i längder från strängpressade profiler.The heat sink according to the invention thus has flanges of different heights, the height differences being equalised by the clamped profile inserts, which in turn have transverse flanges and thus contribute considerably to the cooling behaviour. This allows the flange ratio to be reduced from the previous 7.25 : 1 to approximately 4 s l. In addition, a considerable simplification of manufacture is achieved. Both the heat sink itself and the profile insert are cut to length from extruded profiles.
Hed hänvisning till bifogade ritning beskrivs nedan som exempel sn lämplig utföringsform av finningen. På ritningen visar fig. del av kylkroppen enligt upp- l ett tvärsnitt genom en en sådan utföringsform av kylkroppen enligt uppfin- ningen med profilinsats, och fig. 2 ett tvärsnitt genom profilinsatsen.With reference to the accompanying drawing, a suitable embodiment of the invention is described below by way of example. In the drawing, Fig. 1 shows a cross-section through such an embodiment of the cooling body according to the invention with a profile insert, and Fig. 2 shows a cross-section through the profile insert.
En kylkropp l uppvisar enligt fig. l en grundplatta 2 med en tjocklek i på exempelvis 15 nn och med därifrån utskjutande kylflänsar 3. 4-av olika höjd a- (exempelvis 40 m) respek- tive b (70 un) och med tvärsnitt som avsmalnar mot de av- rundade flänsspetsarna 5, 6.A heat sink 1 has, according to Fig. 1, a base plate 2 with a thickness i of, for example, 15 mm and with cooling fins 3, 4 projecting therefrom of different heights a (for example, 40 mm) and b (70 mm) respectively and with cross sections that taper towards the rounded fin tips 5, 6.
De längre kylflänsarnas 3 basbredd d uppgår till 5 :mn och är obetydligt större än de kortare kylflänsarnas 4 basbredd e.The base width d of the longer cooling fins 3 amounts to 5 mm and is slightly larger than the base width e of the shorter cooling fins 4.
Profilbredden f vid de längre kylflänsarnas 3 spets 5 är med 2.5 :mn endast obetydligt större än bredden g vid de kortare kylflänsarnas 4 spets 6.The profile width f at the tip 5 of the longer cooling fins 3 is, at 2.5 mm, only slightly larger than the width g at the tip 6 of the shorter cooling fins 4.
De långa kylflänearnas 3 flänshöjd b förhåller sig till flänsmellanrummet m såsom 3 : l, och de korta kylflänsarnas 4 flänshöjd a. till det i fig. 1 för ökad tydlighet smala 10 15 20 25 457 584 flänsmellanrummet n till den närbelägna långa kylflänsen 3 såsom 4 :l . Basmellanrummet p mäter ungefär 7 mm.The flange height b of the long cooling fins 3 is related to the flange spacing m as 3 : l, and the flange height a of the short cooling fins 4 to the flange spacing n, which is narrow in Fig. 1 for increased clarity, to the adjacent long cooling fin 3 as 4 : l. The base spacing p measures approximately 7 mm.
Flänsspetsarna 6 kan uppvisa räfflade ytor, för att ge bättre fäste åt en profilinsats 10, som medelst en klämlik- nande huvuddel 11 är pâträdbar på de korta kylflänsarna 4 och sedan medelst stödben 12, 13 stöder sig mot de långa kylflänsarnas 3 flanker 9. Således uppstår överallt i en dal mellan varandra intilliggande långa kylflänsar 3 fyra kam- mare 14, 15, vars inre kammare 14 bildas av grundplattan 2, kylflänsarna 3, 4, 3 och den klämliknande huvuddelens ll stödben 12, och de yttre kamrarna 15 av de långa kylflän- sarnas 3 spetsområden och profilinsatsen eller påträdnings- profilen 10. 0 Från profilinsatsens 10 trappstegsartade profilkropp 20 ut- skjuter tvärs dess längdaxel M på båda sidor tvärflänsar 21, som kan vara av olika höjd h eller ha samma längd. n Varje stödbenpars båda stödben 12, 13 lutar överallt med lika vinkel t resp. w mot längdaxeln M, varvid stödbenen 12 på huvuddelen ll bildar ett klämspár 22. Stödbenen 12, 13 på varje sida förlöper ungefär oarallellt med varandra. 1 Profilinsatsens 10 totala längd q mäter ungefär 35 mm.The flange tips 6 can have grooved surfaces to provide better grip for a profile insert 10, which can be threaded onto the short cooling fins 4 by means of a clamp-like main part 11 and then rests against the flanks 9 of the long cooling fins 3 by means of support legs 12, 13. Thus, four chambers 14, 15 are formed everywhere in a valley between adjacent long cooling fins 3, the inner chamber 14 of which is formed by the base plate 2, the cooling fins 3, 4, 3 and the support legs 12 of the clamp-like main part 11, and the outer chambers 15 by the tip regions of the long cooling fins 3 and the profile insert or threading profile 10. 0 From the stepped profile body 20 of the profile insert 10, projecting transversely to its longitudinal axis M on both sides cross flanges 21, which can be of different heights h or have the same length. n The two supporting legs 12, 13 of each supporting leg pair are inclined everywhere at the same angle t or w to the longitudinal axis M, whereby the supporting legs 12 on the main part ll form a clamping groove 22. The supporting legs 12, 13 on each side run approximately parallel to each other. 1 The total length q of the profile insert 10 measures approximately 35 mm.
Claims (12)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3024748A DE3024748C2 (en) | 1980-06-30 | 1980-06-30 | Heat sinks for semiconductor components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE8103779L SE8103779L (en) | 1981-12-31 |
| SE457584B true SE457584B (en) | 1989-01-09 |
Family
ID=6106046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE8103779A SE457584B (en) | 1980-06-30 | 1981-06-16 | REFRIGERATOR FOR SEMI-CONDUCTOR |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE3024748C2 (en) |
| FR (1) | FR2485807A1 (en) |
| GB (1) | GB2079052B (en) |
| SE (1) | SE457584B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3518310A1 (en) * | 1985-05-22 | 1986-11-27 | Aluminium-Walzwerke Singen Gmbh, 7700 Singen | REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF |
| DE8703604U1 (en) * | 1987-03-11 | 1988-07-21 | Euroatlas GmbH für Umformertechnik und Optronik, 2800 Bremen | Heat sink with semiconductor switch |
| DE59106364D1 (en) * | 1990-10-24 | 1995-10-05 | Alusuisse Lonza Services Ag | Heatsinks for semiconductor devices. |
| DE9319259U1 (en) * | 1993-12-15 | 1994-03-24 | Siemens AG, 80333 München | Heatsink |
| GB2333353A (en) * | 1998-01-16 | 1999-07-21 | Kuo Ching Sung | Heat dissipating device |
| DE19806978B4 (en) * | 1998-02-19 | 2008-08-21 | Behr Gmbh & Co. Kg | Cooling device for cooling by convection |
| DE102004040557A1 (en) * | 2004-08-16 | 2006-02-23 | Kern, Dietmar, Dr.-Ing. | Electronics heatsink |
| DE102009037259B4 (en) * | 2009-08-12 | 2012-04-19 | Semikron Elektronik Gmbh & Co. Kg | Arrangement with a cooling device and a power semiconductor module |
| US20160369995A1 (en) * | 2015-06-16 | 2016-12-22 | Posco Led Company Ltd. | Optical semiconductor lighting apparatus |
| EP3403937B1 (en) * | 2017-05-19 | 2021-01-13 | Goodrich Lighting Systems GmbH | Exterior aircraft light unit |
| DE102019107280B4 (en) * | 2019-03-21 | 2026-01-29 | apt Extrusions GmbH & Co. KG | Cooling device for cooling a third-party object to be cooled |
| EP3973749B1 (en) * | 2019-06-03 | 2026-02-25 | Huawei Technologies Co., Ltd. | An apparatus for transferring heat from a heat source to air |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1959193A1 (en) * | 1969-11-25 | 1971-05-27 | Leonhard Roesch | Knitting loops and courses indicator |
| DE7913126U1 (en) * | 1979-05-07 | 1979-08-23 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | HEAT SINK MADE OF EXTRUDED ALUMINUM FOR PERFORMANCE SEMICONDUCTORS |
-
1980
- 1980-06-30 DE DE3024748A patent/DE3024748C2/en not_active Expired
-
1981
- 1981-06-16 SE SE8103779A patent/SE457584B/en not_active IP Right Cessation
- 1981-06-30 FR FR8112876A patent/FR2485807A1/en active Granted
- 1981-06-30 GB GB8120125A patent/GB2079052B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE3024748C2 (en) | 1986-09-04 |
| FR2485807A1 (en) | 1981-12-31 |
| GB2079052A (en) | 1982-01-13 |
| SE8103779L (en) | 1981-12-31 |
| GB2079052B (en) | 1984-10-24 |
| FR2485807B3 (en) | 1983-07-18 |
| DE3024748A1 (en) | 1982-02-04 |
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| NAL | Patent in force |
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