SE502520C2 - Bad, sätt och användning vid elektroplätering med tenn- vismutlegeringar - Google Patents

Bad, sätt och användning vid elektroplätering med tenn- vismutlegeringar

Info

Publication number
SE502520C2
SE502520C2 SE9002096A SE9002096A SE502520C2 SE 502520 C2 SE502520 C2 SE 502520C2 SE 9002096 A SE9002096 A SE 9002096A SE 9002096 A SE9002096 A SE 9002096A SE 502520 C2 SE502520 C2 SE 502520C2
Authority
SE
Sweden
Prior art keywords
bismuth
tin
bath
electroplating
plating
Prior art date
Application number
SE9002096A
Other languages
English (en)
Swedish (sv)
Other versions
SE9002096L (sv
SE9002096D0 (sv
Inventor
Harold P Wilson
Original Assignee
Atochem North America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22208944&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SE502520(C2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Atochem North America filed Critical Atochem North America
Publication of SE9002096L publication Critical patent/SE9002096L/
Publication of SE9002096D0 publication Critical patent/SE9002096D0/xx
Publication of SE502520C2 publication Critical patent/SE502520C2/sv

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Physical Vapour Deposition (AREA)
SE9002096A 1988-10-14 1990-06-12 Bad, sätt och användning vid elektroplätering med tenn- vismutlegeringar SE502520C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1988/003536 WO1990004048A1 (en) 1988-10-14 1988-10-14 A method, bath and cell for the electrodeposition of tin-bismuth alloys

Publications (3)

Publication Number Publication Date
SE9002096L SE9002096L (sv) 1990-06-12
SE9002096D0 SE9002096D0 (sv) 1990-06-12
SE502520C2 true SE502520C2 (sv) 1995-11-06

Family

ID=22208944

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9002096A SE502520C2 (sv) 1988-10-14 1990-06-12 Bad, sätt och användning vid elektroplätering med tenn- vismutlegeringar

Country Status (13)

Country Link
EP (1) EP0397663B1 (da)
JP (1) JP2983548B2 (da)
KR (1) KR960008155B1 (da)
AT (1) ATE105877T1 (da)
BR (1) BR8807847A (da)
DE (1) DE3889667T2 (da)
DK (1) DK143590A (da)
HK (1) HK103095A (da)
LU (1) LU87746A1 (da)
NL (1) NL194005C (da)
NO (1) NO902630L (da)
SE (1) SE502520C2 (da)
WO (1) WO1990004048A1 (da)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227046A (en) * 1991-10-07 1993-07-13 Unisys Corporation Low temperature tin-bismuth electroplating system
EP0911428B1 (de) * 1997-10-22 2003-01-08 Goldschmidt AG Verfahren zur Herstellung von Wismutverbindungen
AU2003272790A1 (en) 2002-10-08 2004-05-04 Honeywell International Inc. Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials
JP2005002368A (ja) * 2003-06-09 2005-01-06 Ishihara Chem Co Ltd ホイスカー防止用スズメッキ浴
DE102005016819B4 (de) * 2005-04-12 2009-10-01 Dr.-Ing. Max Schlötter GmbH & Co KG Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten
KR100849439B1 (ko) * 2007-08-13 2008-07-30 다이섹(주) 노광장비의 스텝퍼척 제조방법
JP7508077B2 (ja) * 2019-04-03 2024-07-01 奥野製薬工業株式会社 電気めっき用Ｂｉ－Ｓｂ合金めっき液
US12529159B2 (en) 2023-07-12 2026-01-20 Hong Kong Applied Science and Technology Research Institute Company Limited Co-electroplating Sn—Bi alloy solder for 3D-IC low-temperature bonding
CN117980544A (zh) * 2023-07-12 2024-05-03 香港应用科技研究院有限公司 用于3D-IC低温键合的共电镀Sn-Bi合金焊料

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3198877A (en) * 1962-02-09 1965-08-03 Anaconda Wire & Cable Co Pothead closure sealed with bismuth-tin alloy
US3360446A (en) * 1964-05-08 1967-12-26 M & T Chemicals Inc Electrodepositing a tin-bismuth alloy and additives therefor
FR2071199A5 (da) * 1969-12-19 1971-09-17 Ibm France
SU467145A1 (ru) * 1972-08-15 1975-04-15 Предприятие П/Я Х-5885 Электролит дл осаждени сплава олово-висмут
SU463747A1 (ru) * 1972-12-26 1975-03-15 Морской Гидрофизический Институт Ан Укр.Сср Электролит дл осаждени сплава олово-висмут
SU697610A1 (ru) * 1977-11-22 1979-11-15 Харьковский Ордена Ленина Политехнический Институт Им.В.И.Ленина Электролит дл нанесени покрытий сплавом олово-висмут
US4252618A (en) * 1980-02-11 1981-02-24 Pitt Metals & Chemicals, Inc. Method of electroplating tin and alkaline electroplating bath therefor
US4331518A (en) * 1981-01-09 1982-05-25 Vulcan Materials Company Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor
US4565610A (en) * 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating lead and lead/tin alloys
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
JPH0781196B2 (ja) * 1986-07-04 1995-08-30 株式会社大和化成研究所 有機スルホン酸塩からのビスマス及びビスマス合金めつき浴

Also Published As

Publication number Publication date
JP2983548B2 (ja) 1999-11-29
HK103095A (en) 1995-07-07
NO902630D0 (no) 1990-06-13
DK143590A (da) 1990-07-27
BR8807847A (pt) 1990-11-13
NO902630L (no) 1990-08-06
EP0397663B1 (en) 1994-05-18
SE9002096L (sv) 1990-06-12
ATE105877T1 (de) 1994-06-15
SE9002096D0 (sv) 1990-06-12
EP0397663A1 (en) 1990-11-22
WO1990004048A1 (en) 1990-04-19
KR960008155B1 (ko) 1996-06-20
JPH03503068A (ja) 1991-07-11
DE3889667T2 (de) 1994-10-13
DK143590D0 (da) 1990-06-12
NL194005B (nl) 2000-12-01
LU87746A1 (en) 1991-05-07
DE3889667D1 (de) 1994-06-23
NL8820893A (nl) 1990-10-01
EP0397663A4 (en) 1991-01-09
KR900702085A (ko) 1990-12-05
NL194005C (nl) 2001-04-03

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Legal Events

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NUG Patent has lapsed