SE512041C3 - Foerfarande foer etsning av oeppning - Google Patents

Foerfarande foer etsning av oeppning

Info

Publication number
SE512041C3
SE512041C3 SE9801575A SE9801575A SE512041C3 SE 512041 C3 SE512041 C3 SE 512041C3 SE 9801575 A SE9801575 A SE 9801575A SE 9801575 A SE9801575 A SE 9801575A SE 512041 C3 SE512041 C3 SE 512041C3
Authority
SE
Sweden
Prior art keywords
etching
pit
protective layer
doped
silicon wafer
Prior art date
Application number
SE9801575A
Other languages
English (en)
Swedish (sv)
Other versions
SE9801575L (sv
SE512041C2 (sv
SE9801575D0 (sv
Inventor
Thomas Laurell
Johan Drott
Johan Nilsson
Lars Wallman
Original Assignee
Thomas Laurell
Johan Nilsson
Lars Wallman
Johan Drott
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomas Laurell, Johan Nilsson, Lars Wallman, Johan Drott filed Critical Thomas Laurell
Priority to SE9801575A priority Critical patent/SE512041C3/sv
Publication of SE9801575D0 publication Critical patent/SE9801575D0/xx
Priority to CA002330998A priority patent/CA2330998A1/en
Priority to PCT/SE1999/000757 priority patent/WO1999057332A1/en
Priority to EP99948557A priority patent/EP1076730A1/en
Priority to JP2000547281A priority patent/JP2002513857A/ja
Priority to US09/700,044 priority patent/US6620331B1/en
Priority to AU43054/99A priority patent/AU4305499A/en
Publication of SE9801575L publication Critical patent/SE9801575L/
Publication of SE512041C2 publication Critical patent/SE512041C2/sv
Publication of SE512041C3 publication Critical patent/SE512041C3/sv
Priority to NO20005478A priority patent/NO20005478L/no

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1628Manufacturing processes etching dry etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/162Manufacturing of the nozzle plates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1629Manufacturing processes etching wet etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1631Manufacturing processes photolithography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1632Manufacturing processes machining
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/60Wet etching
    • H10P50/64Wet etching of semiconductor materials
    • H10P50/642Chemical etching
    • H10P50/644Anisotropic liquid etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Weting (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
SE9801575A 1998-05-06 1998-05-06 Foerfarande foer etsning av oeppning SE512041C3 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE9801575A SE512041C3 (sv) 1998-05-06 1998-05-06 Foerfarande foer etsning av oeppning
AU43054/99A AU4305499A (en) 1998-05-06 1999-05-06 A method of etching an opening
CA002330998A CA2330998A1 (en) 1998-05-06 1999-05-06 A method of etching an opening
PCT/SE1999/000757 WO1999057332A1 (en) 1998-05-06 1999-05-06 A method of etching an opening
EP99948557A EP1076730A1 (en) 1998-05-06 1999-05-06 A method of etching an opening
JP2000547281A JP2002513857A (ja) 1998-05-06 1999-05-06 開口部のエッチング方法
US09/700,044 US6620331B1 (en) 1998-05-06 1999-05-06 Method of etching an opening
NO20005478A NO20005478L (no) 1998-05-06 2000-10-31 Fremgangsmåte for etsing av en åpning

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9801575A SE512041C3 (sv) 1998-05-06 1998-05-06 Foerfarande foer etsning av oeppning

Publications (4)

Publication Number Publication Date
SE9801575D0 SE9801575D0 (sv) 1998-05-06
SE9801575L SE9801575L (sv) 1999-11-07
SE512041C2 SE512041C2 (sv) 2000-01-17
SE512041C3 true SE512041C3 (sv) 2000-02-07

Family

ID=20411198

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9801575A SE512041C3 (sv) 1998-05-06 1998-05-06 Foerfarande foer etsning av oeppning

Country Status (8)

Country Link
US (1) US6620331B1 (no)
EP (1) EP1076730A1 (no)
JP (1) JP2002513857A (no)
AU (1) AU4305499A (no)
CA (1) CA2330998A1 (no)
NO (1) NO20005478L (no)
SE (1) SE512041C3 (no)
WO (1) WO1999057332A1 (no)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008126504A (ja) * 2006-11-20 2008-06-05 Canon Inc インクジェット記録ヘッドの製造方法、およびインクジェット記録ヘッド
KR101975928B1 (ko) * 2011-09-08 2019-05-09 삼성전자주식회사 프린팅 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5204690A (en) 1991-07-01 1993-04-20 Xerox Corporation Ink jet printhead having intergral silicon filter
US5392064A (en) 1991-12-19 1995-02-21 Xerox Corporation Liquid level control structure
US5332469A (en) * 1992-11-12 1994-07-26 Ford Motor Company Capacitive surface micromachined differential pressure sensor
US5726100A (en) * 1996-06-27 1998-03-10 Micron Technology, Inc. Method of forming contact vias and interconnect channels in a dielectric layer stack with a single mask
CA2327421A1 (en) * 1998-04-10 1999-10-21 Jeffrey T. Borenstein Silicon-germanium etch stop layer system
US6159385A (en) * 1998-05-08 2000-12-12 Rockwell Technologies, Llc Process for manufacture of micro electromechanical devices having high electrical isolation

Also Published As

Publication number Publication date
JP2002513857A (ja) 2002-05-14
CA2330998A1 (en) 1999-11-11
NO20005478D0 (no) 2000-10-31
US6620331B1 (en) 2003-09-16
WO1999057332A1 (en) 1999-11-11
SE9801575L (sv) 1999-11-07
AU4305499A (en) 1999-11-23
EP1076730A1 (en) 2001-02-21
NO20005478L (no) 2000-10-31
SE512041C2 (sv) 2000-01-17
SE9801575D0 (sv) 1998-05-06

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Legal Events

Date Code Title Description
NUG Patent has lapsed