SE512710C2 - Kapsel för högeffekttransistorchip för höga frekvenser innefattande en elektriskt och termiskt ledande fläns - Google Patents

Kapsel för högeffekttransistorchip för höga frekvenser innefattande en elektriskt och termiskt ledande fläns

Info

Publication number
SE512710C2
SE512710C2 SE9802453A SE9802453A SE512710C2 SE 512710 C2 SE512710 C2 SE 512710C2 SE 9802453 A SE9802453 A SE 9802453A SE 9802453 A SE9802453 A SE 9802453A SE 512710 C2 SE512710 C2 SE 512710C2
Authority
SE
Sweden
Prior art keywords
flange
electrically insulating
insulating substrates
transistor chip
electrically
Prior art date
Application number
SE9802453A
Other languages
English (en)
Swedish (sv)
Other versions
SE9802453D0 (sv
SE9802453L (sv
Inventor
Lars-Anders Olofsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9802453A priority Critical patent/SE512710C2/sv
Publication of SE9802453D0 publication Critical patent/SE9802453D0/xx
Priority to TW088110658A priority patent/TW441057B/zh
Priority to HK02100854.3A priority patent/HK1039403A1/zh
Priority to PCT/SE1999/001193 priority patent/WO2000003435A2/fr
Priority to AU49481/99A priority patent/AU4948199A/en
Priority to CNB998083313A priority patent/CN1192428C/zh
Priority to KR1020017000228A priority patent/KR20010071766A/ko
Priority to CA002336936A priority patent/CA2336936A1/fr
Priority to EP99933421A priority patent/EP1116271A2/fr
Priority to JP2000559595A priority patent/JP2002520855A/ja
Priority to US09/348,304 priority patent/US6465883B2/en
Publication of SE9802453L publication Critical patent/SE9802453L/xx
Publication of SE512710C2 publication Critical patent/SE512710C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
SE9802453A 1998-07-08 1998-07-08 Kapsel för högeffekttransistorchip för höga frekvenser innefattande en elektriskt och termiskt ledande fläns SE512710C2 (sv)

Priority Applications (11)

Application Number Priority Date Filing Date Title
SE9802453A SE512710C2 (sv) 1998-07-08 1998-07-08 Kapsel för högeffekttransistorchip för höga frekvenser innefattande en elektriskt och termiskt ledande fläns
TW088110658A TW441057B (en) 1998-07-08 1999-06-24 A capsule for semiconductor components
JP2000559595A JP2002520855A (ja) 1998-07-08 1999-06-30 半導体部品のためのカプセル
AU49481/99A AU4948199A (en) 1998-07-08 1999-06-30 A capsule for semiconductor components
PCT/SE1999/001193 WO2000003435A2 (fr) 1998-07-08 1999-06-30 Capsule destinee a des composants semi-conducteurs
HK02100854.3A HK1039403A1 (zh) 1998-07-08 1999-06-30 半导体元件的封壳
CNB998083313A CN1192428C (zh) 1998-07-08 1999-06-30 半导体元件的封壳
KR1020017000228A KR20010071766A (ko) 1998-07-08 1999-06-30 반도체 소자용 캡슐
CA002336936A CA2336936A1 (fr) 1998-07-08 1999-06-30 Capsule destinee a des composants semi-conducteurs
EP99933421A EP1116271A2 (fr) 1998-07-08 1999-06-30 Capsule destinee a des composants semi-conducteurs
US09/348,304 US6465883B2 (en) 1998-07-08 1999-07-07 Capsule for at least one high power transistor chip for high frequencies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9802453A SE512710C2 (sv) 1998-07-08 1998-07-08 Kapsel för högeffekttransistorchip för höga frekvenser innefattande en elektriskt och termiskt ledande fläns

Publications (3)

Publication Number Publication Date
SE9802453D0 SE9802453D0 (sv) 1998-07-08
SE9802453L SE9802453L (sv) 2000-01-09
SE512710C2 true SE512710C2 (sv) 2000-05-02

Family

ID=20412011

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9802453A SE512710C2 (sv) 1998-07-08 1998-07-08 Kapsel för högeffekttransistorchip för höga frekvenser innefattande en elektriskt och termiskt ledande fläns

Country Status (11)

Country Link
US (1) US6465883B2 (fr)
EP (1) EP1116271A2 (fr)
JP (1) JP2002520855A (fr)
KR (1) KR20010071766A (fr)
CN (1) CN1192428C (fr)
AU (1) AU4948199A (fr)
CA (1) CA2336936A1 (fr)
HK (1) HK1039403A1 (fr)
SE (1) SE512710C2 (fr)
TW (1) TW441057B (fr)
WO (1) WO2000003435A2 (fr)

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Also Published As

Publication number Publication date
TW441057B (en) 2001-06-16
US20020014694A1 (en) 2002-02-07
HK1039403A1 (zh) 2002-04-19
SE9802453D0 (sv) 1998-07-08
US6465883B2 (en) 2002-10-15
JP2002520855A (ja) 2002-07-09
CN1192428C (zh) 2005-03-09
CN1308773A (zh) 2001-08-15
AU4948199A (en) 2000-02-01
WO2000003435A2 (fr) 2000-01-20
SE9802453L (sv) 2000-01-09
WO2000003435A3 (fr) 2000-02-24
EP1116271A2 (fr) 2001-07-18
KR20010071766A (ko) 2001-07-31
CA2336936A1 (fr) 2000-01-20

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