SE7612062L - Lodningsanordning - Google Patents

Lodningsanordning

Info

Publication number
SE7612062L
SE7612062L SE7612062A SE7612062A SE7612062L SE 7612062 L SE7612062 L SE 7612062L SE 7612062 A SE7612062 A SE 7612062A SE 7612062 A SE7612062 A SE 7612062A SE 7612062 L SE7612062 L SE 7612062L
Authority
SE
Sweden
Prior art keywords
soldering device
soldering
Prior art date
Application number
SE7612062A
Other languages
English (en)
Inventor
R S Mason
R E Bible
J R Beach
Original Assignee
Singer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singer Co filed Critical Singer Co
Publication of SE7612062L publication Critical patent/SE7612062L/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SE7612062A 1976-03-08 1976-10-29 Lodningsanordning SE7612062L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/664,775 US4013208A (en) 1976-03-08 1976-03-08 Soldering mechanism for soldering electronic component leads to conductors on a printed circuit board, and the like

Publications (1)

Publication Number Publication Date
SE7612062L true SE7612062L (sv) 1977-09-09

Family

ID=24667399

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7612062A SE7612062L (sv) 1976-03-08 1976-10-29 Lodningsanordning

Country Status (9)

Country Link
US (1) US4013208A (sv)
JP (1) JPS52107572A (sv)
CA (1) CA1040744A (sv)
DE (1) DE2646758A1 (sv)
FR (1) FR2343551A1 (sv)
GB (1) GB1517247A (sv)
IL (1) IL50642A (sv)
NO (1) NO763702L (sv)
SE (1) SE7612062L (sv)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5621194Y2 (sv) * 1977-08-11 1981-05-19
US4224744A (en) * 1978-05-12 1980-09-30 Pace Incorporated Circuitry for teaching soldering and practice circuit board for use therewith
JPS58112390A (ja) * 1981-12-26 1983-07-04 富士通株式会社 リフロ−ボンデイング方法
US4828162A (en) * 1988-02-29 1989-05-09 Hughes Aircraft Company Moving jaw reflow soldering head
US5996434A (en) * 1997-07-29 1999-12-07 Swanson; David W. Pressure head with dual horns
US6119918A (en) * 1999-02-03 2000-09-19 Industrial Technology Research Institute Solder head control mechanism
US6629631B2 (en) * 2001-06-04 2003-10-07 Sony Corporation Solder iron pressure monitor and method of using same in manufacturing a cathode ray tube
US6831252B1 (en) 2003-01-27 2004-12-14 Dennis M. Crookshanks Electric soldering iron
CN114589511A (zh) * 2022-01-27 2022-06-07 青岛海润利得电子科技有限公司 一种引线对焊机
CN114340231B (zh) * 2022-03-14 2022-05-13 四川英创力电子科技股份有限公司 一种带厚铜阶梯铜导柱pcb板的制作装置及方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2486319A (en) * 1948-08-04 1949-10-25 Gen Motors Corp Apparatus for making closely spaced spot welds
US3275794A (en) * 1963-11-06 1966-09-27 Mcdonnell Aircraft Corp Apparatus for welding sheet material
US3504156A (en) * 1967-04-17 1970-03-31 Texas Instruments Inc Bonding apparatus
US3669333A (en) * 1970-02-02 1972-06-13 Western Electric Co Bonding with a compliant medium
US3905537A (en) * 1974-07-08 1975-09-16 Western Electric Co Method and apparatus for compensating for substance variations during lead frame bonding

Also Published As

Publication number Publication date
GB1517247A (en) 1978-07-12
IL50642A (en) 1978-07-31
JPS52107572A (en) 1977-09-09
US4013208A (en) 1977-03-22
DE2646758A1 (de) 1977-09-22
CA1040744A (en) 1978-10-17
FR2343551A1 (fr) 1977-10-07
IL50642A0 (en) 1976-12-31
NO763702L (no) 1977-09-09

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