SE7809290L - COUPLING COMPONENT EQUIPPED WITH COUPLING COMPONENTS AND PROCEDURE FOR ITS MANUFACTURE - Google Patents

COUPLING COMPONENT EQUIPPED WITH COUPLING COMPONENTS AND PROCEDURE FOR ITS MANUFACTURE

Info

Publication number
SE7809290L
SE7809290L SE7809290A SE7809290A SE7809290L SE 7809290 L SE7809290 L SE 7809290L SE 7809290 A SE7809290 A SE 7809290A SE 7809290 A SE7809290 A SE 7809290A SE 7809290 L SE7809290 L SE 7809290L
Authority
SE
Sweden
Prior art keywords
conductor pattern
board
circuit board
perforations
conductor
Prior art date
Application number
SE7809290A
Other languages
Swedish (sv)
Other versions
SE443276B (en
Inventor
F Stahl
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of SE7809290L publication Critical patent/SE7809290L/en
Publication of SE443276B publication Critical patent/SE443276B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A circuit board having a conductor pattern fixed to one surface and having its opposite surface free of conductor patterns. Spaced perforations having metal walls extending through the circuit board and being connected to the conductor pattern at the one surface. At least one component mounted at the conductor pattern surface side of the circuit board and having component wires extending through the perforations and projection from the conductor pattern free surface of the board. A solder joint filling the space between the component wire and the metal hole wall and extending upwardly in the perforations from the conductor pattern free surface of the board and being substantially flush with such surface. The method of forming such board by heating the projecting ends of the conductor wires in a hot, molten solder bath and causing the hot metal to flow upwardly on the wire into the perforation.
SE7809290A 1978-02-28 1978-09-04 PROCEDURE FOR MANUFACTURING A CONNECTOR CONNECTED WITH CONNECTOR COMPONENTS SE443276B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2809013A DE2809013C2 (en) 1978-02-28 1978-02-28 Method of manufacturing a printed circuit board loaded with components

Publications (2)

Publication Number Publication Date
SE7809290L true SE7809290L (en) 1979-08-29
SE443276B SE443276B (en) 1986-02-17

Family

ID=6033380

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7809290A SE443276B (en) 1978-02-28 1978-09-04 PROCEDURE FOR MANUFACTURING A CONNECTOR CONNECTED WITH CONNECTOR COMPONENTS

Country Status (9)

Country Link
JP (2) JPS54118573A (en)
AT (1) AT377889B (en)
AU (1) AU531356B2 (en)
CA (1) CA1131746A (en)
DE (1) DE2809013C2 (en)
DK (1) DK152480C (en)
IL (1) IL56306A (en)
IT (1) IT7947865A0 (en)
SE (1) SE443276B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144535A (en) * 1989-04-20 1992-09-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components of a printed circuit board
JPH0468198A (en) * 1990-07-09 1992-03-03 Tekken Constr Co Ltd Construction method of tunnel
DE4028978C2 (en) * 1990-09-12 1993-10-14 Siemens Ag Solder contact element for printed circuit boards for soldering surface-mountable SMD components, and preferred use of the same for soldering superimposed components
US20040108130A1 (en) * 2002-12-09 2004-06-10 Yazaki Corporation Mounting structure for electronic component

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3143484A (en) * 1959-12-29 1964-08-04 Gen Electric Method of making plated circuit boards
DE1246840B (en) * 1963-09-30 1967-08-10 Siemens Ag Printed circuit
CA939831A (en) * 1969-03-27 1974-01-08 Frederick W. Schneble (Jr.) Plated through hole printed circuit boards
JPS48100660A (en) * 1972-04-04 1973-12-19
JPS5629805Y2 (en) * 1974-08-02 1981-07-15

Also Published As

Publication number Publication date
AU4445479A (en) 1979-09-06
JPS58103163U (en) 1983-07-13
AT377889B (en) 1985-05-10
DK152480C (en) 1988-07-25
DK152480B (en) 1988-02-29
IL56306A (en) 1982-07-30
AU531356B2 (en) 1983-08-18
DK385578A (en) 1979-08-29
IL56306A0 (en) 1979-03-12
ATA704878A (en) 1984-09-15
JPS639396B2 (en) 1988-02-29
JPS54118573A (en) 1979-09-14
IT7947865A0 (en) 1979-02-02
DE2809013C2 (en) 1985-08-01
DE2809013A1 (en) 1979-08-30
SE443276B (en) 1986-02-17
CA1131746A (en) 1982-09-14

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