SE8002598L - SILVER AND SILVER / GOLD PLATING BATH - Google Patents

SILVER AND SILVER / GOLD PLATING BATH

Info

Publication number
SE8002598L
SE8002598L SE8002598A SE8002598A SE8002598L SE 8002598 L SE8002598 L SE 8002598L SE 8002598 A SE8002598 A SE 8002598A SE 8002598 A SE8002598 A SE 8002598A SE 8002598 L SE8002598 L SE 8002598L
Authority
SE
Sweden
Prior art keywords
silver
bath
plating bath
gold plating
stabilization
Prior art date
Application number
SE8002598A
Other languages
Unknown language ( )
Swedish (sv)
Inventor
K D Baker
Original Assignee
Engelhard Min & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Min & Chem filed Critical Engelhard Min & Chem
Publication of SE8002598L publication Critical patent/SE8002598L/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Stabilization of an aqueous alkaline bath for electrode-position of silver or suitable silver alloys on a substrate, said bath essentially lacking in free cyanides and containing an imine brightening agent, said stabilization being achieved upon addition of boric acid and an ammonium or alkali metal hydroxide to effect a pH range of 8.0 to about 9.5; and the corresponding bath.
SE8002598A 1979-04-04 1980-04-03 SILVER AND SILVER / GOLD PLATING BATH SE8002598L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2717779A 1979-04-04 1979-04-04

Publications (1)

Publication Number Publication Date
SE8002598L true SE8002598L (en) 1980-10-05

Family

ID=21836140

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8002598A SE8002598L (en) 1979-04-04 1980-04-03 SILVER AND SILVER / GOLD PLATING BATH

Country Status (11)

Country Link
JP (1) JPS55134191A (en)
AR (1) AR225759A1 (en)
AU (1) AU5717880A (en)
BR (1) BR8001854A (en)
DE (1) DE3013191A1 (en)
DK (1) DK146980A (en)
FR (1) FR2453226A1 (en)
GB (1) GB2046794A (en)
IT (1) IT1127414B (en)
NL (1) NL8001999A (en)
SE (1) SE8002598L (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3609309A1 (en) * 1986-03-20 1987-09-24 Duerrwaechter E Dr Doduco BATH FOR THE ELECTROLYTIC DEPOSITION OF SILVER-PALLADIUM ALLOYS
JPH051393A (en) * 1990-07-19 1993-01-08 Electroplating Eng Of Japan Co Silver-copper alloy plating bath and silver-copper alloy brazing filler metal
ES2117995T3 (en) * 1994-02-05 1998-09-01 Heraeus Gmbh W C BATH FOR GALVANIC DEPOSIT OF SILVER-TIN ALLOYS.
DE4406419C1 (en) * 1994-02-28 1995-04-13 Heraeus Gmbh W C Bath for the electrodeposition of silver-gold alloys
JP2000212763A (en) * 1999-01-19 2000-08-02 Shipley Far East Ltd Silver alloy plating bath and method for forming silver alloy coating film using the same
JP4919430B2 (en) * 1999-12-02 2012-04-18 株式会社日本キャリア工業 Meat shredding equipment
US20130023166A1 (en) * 2011-07-20 2013-01-24 Tyco Electronics Corporation Silver plated electrical contact
CN102560571B (en) * 2012-02-22 2015-08-05 江苏大学 Non-cyanide silver coating stable electrical plating solution, preparation method and silver-plated method thereof
CN103741178B (en) * 2014-01-20 2017-06-16 厦门大学 A kind of solution and electro-plating method for the smooth fine and close Ag films of silicon face Direct Electroplating
US20160145756A1 (en) * 2014-11-21 2016-05-26 Rohm And Haas Electronic Materials Llc Environmentally friendly gold electroplating compositions and methods
JP7353249B2 (en) * 2020-08-19 2023-09-29 Ｅｅｊａ株式会社 Cyan-based electrolytic silver alloy plating solution

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2410441C2 (en) * 1974-03-01 1982-11-11 Schering Ag, 1000 Berlin Und 4619 Bergkamen Cyanide-free bath and process for the electrodeposition of silver
JPS52105540A (en) * 1976-03-01 1977-09-05 Tech Inc Silver bath for lusterous plating of nonncyanide
US4088549A (en) * 1976-04-13 1978-05-09 Oxy Metal Industries Corporation Bright low karat silver gold electroplating
US4121982A (en) * 1978-02-03 1978-10-24 American Chemical & Refining Company Incorporated Gold alloy plating bath and method

Also Published As

Publication number Publication date
AR225759A1 (en) 1982-04-30
JPS55134191A (en) 1980-10-18
FR2453226A1 (en) 1980-10-31
NL8001999A (en) 1980-10-07
AU5717880A (en) 1980-10-09
DK146980A (en) 1980-10-05
BR8001854A (en) 1980-11-18
IT8048317A0 (en) 1980-04-02
GB2046794A (en) 1980-11-19
DE3013191A1 (en) 1980-10-23
IT1127414B (en) 1986-05-21

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