SE8302798L - Vattenhaltigt bad for stromlos utfellning av guld och sett att pa stromlos veg utfella guld med anvendning av badet - Google Patents

Vattenhaltigt bad for stromlos utfellning av guld och sett att pa stromlos veg utfella guld med anvendning av badet

Info

Publication number: SE8302798L
Authority: SE; Sweden
Prior art keywords: gold; alkali metal; bath; electroless; water
Prior art date: 1982-06-07

Application number

SE8302798A

Other languages

Unknown language ( )

English (en)

Swedish (sv)

Other versions

SE8302798D0 (sv

Inventor

M F El-Shazly

A Halecky

K D Baker

Original Assignee

Occidental Chem Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1982-06-07

Filing date

1983-05-18

Publication date

1983-12-08

1983-05-18 Application filed by Occidental Chem Co filed Critical Occidental Chem Co

1983-05-18 Publication of SE8302798D0 publication Critical patent/SE8302798D0/xx

1983-12-08 Publication of SE8302798L publication Critical patent/SE8302798L/

Links

PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract 7
229910052737 gold Inorganic materials 0.000 title abstract 7
239000010931 gold Substances 0.000 title abstract 7
238000003287 bathing Methods 0.000 title 1
229910052783 alkali metal Inorganic materials 0.000 abstract 6
150000001340 alkali metals Chemical class 0.000 abstract 5
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 4
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 abstract 2
229910052802 copper Inorganic materials 0.000 abstract 2
239000010949 copper Substances 0.000 abstract 2
229910052759 nickel Inorganic materials 0.000 abstract 2
238000007747 plating Methods 0.000 abstract 2
239000000758 substrate Substances 0.000 abstract 2
229910000881 Cu alloy Inorganic materials 0.000 abstract 1
229910000990 Ni alloy Inorganic materials 0.000 abstract 1
-1 alkali metal cyanoborohydride Chemical class 0.000 abstract 1
150000008044 alkali metal hydroxides Chemical class 0.000 abstract 1
TVJORGWKNPGCDW-UHFFFAOYSA-N aminoboron Chemical compound N[B] TVJORGWKNPGCDW-UHFFFAOYSA-N 0.000 abstract 1
239000006172 buffering agent Substances 0.000 abstract 1
239000003638 chemical reducing agent Substances 0.000 abstract 1
239000003795 chemical substances by application Substances 0.000 abstract 1
238000000151 deposition Methods 0.000 abstract 1
239000004615 ingredient Substances 0.000 abstract 1
238000000034 method Methods 0.000 abstract 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Electroplating And Plating Baths Therefor (AREA)
Cosmetics (AREA)

SE8302798A 1982-06-07 1983-05-18 Vattenhaltigt bad for stromlos utfellning av guld och sett att pa stromlos veg utfella guld med anvendning av badet SE8302798L (sv)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US38561782A	1982-06-07	1982-06-07

Publications (2)

Publication Number	Publication Date
SE8302798D0 SE8302798D0 (sv)	1983-05-18
SE8302798L true SE8302798L (sv)	1983-12-08

Family

ID=23522165

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SE8302798A SE8302798L (sv)	1982-06-07	1983-05-18	Vattenhaltigt bad for stromlos utfellning av guld och sett att pa stromlos veg utfella guld med anvendning av badet

Country Status (14)

Country	Link
JP (1)	JPS591668A (de)
AT (1)	AT380902B (de)
AU (1)	AU541923B2 (de)
BE (1)	BE896977A (de)
CA (1)	CA1188458A (de)
CH (1)	CH655132A5 (de)
DE (1)	DE3320308C2 (de)
DK (1)	DK231783A (de)
ES (1)	ES523032A0 (de)
FR (1)	FR2528073B1 (de)
GB (1)	GB2121444B (de)
IT (1)	IT1171818B (de)
NL (1)	NL8302029A (de)
SE (1)	SE8302798L (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4050719A (en) *	1976-08-24	1977-09-27	Cunningham Walter F	Color coded indexing system
WO1986001477A1 (fr) *	1984-08-27	1986-03-13	Toyota Jidosha Kabushiki Kaisha	Structure de support du tube d'une colonne de direction
JPS6299477A (ja) *	1985-10-25	1987-05-08	C Uyemura & Co Ltd	無電解金めつき液
US4863766A (en) *	1986-09-02	1989-09-05	General Electric Company	Electroless gold plating composition and method for plating
DE3640028C1 (de) *	1986-11-24	1987-10-01	Heraeus Gmbh W C	Saures Bad fuer das stromlose Abscheiden von Goldschichten
JPS6452082A (en) *	1987-06-22	1989-02-28	Gen Electric	Electroless gold plating composition and method
US5130168A (en) *	1988-11-22	1992-07-14	Technic, Inc.	Electroless gold plating bath and method of using same
US4979988A (en) *	1989-12-01	1990-12-25	General Electric Company	Autocatalytic electroless gold plating composition
JP2538461B2 (ja) *	1991-02-22	1996-09-25	奥野製薬工業株式会社	無電解金めっき方法
DE10101375A1 (de) *	2001-01-13	2002-07-18	Forschungszentrum Juelich Gmbh	Punktkontakte für Halbleiter und deren Herstellung
JP5526458B2 (ja) *	2006-12-06	2014-06-18	上村工業株式会社	無電解金めっき浴及び無電解金めっき方法
JP5526459B2 (ja) *	2006-12-06	2014-06-18	上村工業株式会社	無電解金めっき浴及び無電解金めっき方法
JP5526440B2 (ja) *	2007-01-17	2014-06-18	奥野製薬工業株式会社	パラジウム皮膜用還元析出型無電解金めっき液を用いて形成されたプリント配線板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS52151637A (en) *	1976-04-29	1977-12-16	Trw Inc	Aqueous solution for gold plating and method of applying gold film onto nickel surface at room temperature
US4337091A (en) *	1981-03-23	1982-06-29	Hooker Chemicals & Plastics Corp.	Electroless gold plating

1983
- 1983-05-18 SE SE8302798A patent/SE8302798L/ not_active Application Discontinuation
- 1983-05-19 AU AU14860/83A patent/AU541923B2/en not_active Ceased
- 1983-05-24 DK DK231783A patent/DK231783A/da not_active Application Discontinuation
- 1983-05-26 AT AT0193183A patent/AT380902B/de not_active IP Right Cessation
- 1983-05-30 CA CA000429183A patent/CA1188458A/en not_active Expired
- 1983-06-02 FR FR8309198A patent/FR2528073B1/fr not_active Expired
- 1983-06-03 JP JP58099286A patent/JPS591668A/ja active Pending
- 1983-06-03 IT IT48420/83A patent/IT1171818B/it active
- 1983-06-04 DE DE3320308A patent/DE3320308C2/de not_active Expired
- 1983-06-06 BE BE0/210948A patent/BE896977A/fr not_active IP Right Cessation
- 1983-06-06 ES ES523032A patent/ES523032A0/es active Granted
- 1983-06-07 NL NL8302029A patent/NL8302029A/nl not_active Application Discontinuation
- 1983-06-07 GB GB08315556A patent/GB2121444B/en not_active Expired
- 1983-06-07 CH CH3122/83A patent/CH655132A5/de not_active IP Right Cessation

Also Published As

Publication number	Publication date
FR2528073B1 (fr)	1986-02-14
DK231783D0 (da)	1983-05-24
BE896977A (fr)	1983-12-06
FR2528073A1 (fr)	1983-12-09
DE3320308A1 (de)	1983-12-08
ES8407520A1 (es)	1984-09-16
ES523032A0 (es)	1984-09-16
GB2121444B (en)	1986-03-12
CH655132A5 (de)	1986-03-27
DE3320308C2 (de)	1985-05-15
SE8302798D0 (sv)	1983-05-18
AU1486083A (en)	1983-12-15
IT8348420A0 (it)	1983-06-03
DK231783A (da)	1983-12-08
IT1171818B (it)	1987-06-10
GB2121444A (en)	1983-12-21
AU541923B2 (en)	1985-01-31
GB8315556D0 (en)	1983-07-13
JPS591668A (ja)	1984-01-07
ATA193183A (de)	1985-12-15
CA1188458A (en)	1985-06-11
AT380902B (de)	1986-07-25
NL8302029A (nl)	1984-01-02

Legal Events

Date

Code

Title

Description

1995-02-28

NAV

Patent application has lapsed

Ref document number: 8302798-7

Effective date: 19880519

Publication	Publication Date	Title
ES8305853A1 (es)	1983-04-16	Un metodo de disposicion no electrolitico para depositar oro sobre un sustrato.
SE8302798L (sv)	1983-12-08	Vattenhaltigt bad for stromlos utfellning av guld och sett att pa stromlos veg utfella guld med anvendning av badet
US4169171A (en)	1979-09-25	Bright electroless plating process and plated articles produced thereby
GB1121282A (en)	1968-07-24	Process for stabilizing autocatalytic metal plating solutions
AU1150397A (en)	1997-07-14	Use of palladium immersion deposition to selectively initiate electroless plating on ti and w alloys for wafer fabrication
AU574823B2 (en)	1988-07-14	Metallization of electronic interconnection boards
GB2093485A (en)	1982-09-02	Electroless alloy plating
GB924049A (en)	1963-04-18	Electroless plating of copper
US5035744A (en)	1991-07-30	Electroless gold plating solution
JPS56156749A (en)	1981-12-03	Chemical copper plating solution
CA2076088C (en)	2002-10-29	Method for enhancing the uniform electroless deposition of gold onto a palladium substrate
GB1194625A (en)	1970-06-10	Boron Containing Composite Metallic Films and Plating Baths for their Electroless Deposition
US4474838A (en)	1984-10-02	Electroless direct deposition of gold on metallized ceramics
US4552787A (en)	1985-11-12	Deposition of a metal from an electroless plating composition
JPS53134759A (en)	1978-11-24	Production of copmosite metal powder
JP2010180467A (ja)	2010-08-19	非シアン無電解金めっき液及び導体パターンのめっき方法
Mallory	1979	The electroless nickel plating bath
Baker et al.	1980	Electroless Gold Plating
GB1058915A (en)	1967-02-15	Autocatalytic metal plating
FR2359215A1 (fr)	1978-02-17	Solutions de revetement non electrolytique de cuivre, renfermant un agent tensio-actif a groupe perfluorocarbone aliphatique
JPS575856A (en)	1982-01-12	Plating method
JPS57120664A (en)	1982-07-27	Formation of nickel film
GB1266729A (de)	1972-03-15
JPS59226170A (ja)	1984-12-19	無電解ニツケルめつき液
El-Shazly et al.	1982	Electroless Gold Plating