SE8604627L - For halvledaranordning avsett enkristallsubstrat av kisel med hog syrehalt och framstellningssett for detta - Google Patents

For halvledaranordning avsett enkristallsubstrat av kisel med hog syrehalt och framstellningssett for detta

Info

Publication number
SE8604627L
SE8604627L SE8604627A SE8604627A SE8604627L SE 8604627 L SE8604627 L SE 8604627L SE 8604627 A SE8604627 A SE 8604627A SE 8604627 A SE8604627 A SE 8604627A SE 8604627 L SE8604627 L SE 8604627L
Authority
SE
Sweden
Prior art keywords
crystal body
silicon
silicon crystal
silicence
deviced
Prior art date
Application number
SE8604627A
Other languages
Unknown language ( )
English (en)
Swedish (sv)
Other versions
SE8604627D0 (sv
Inventor
T Suzuki
Y Kato
M Futagami
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of SE8604627D0 publication Critical patent/SE8604627D0/xx
Publication of SE8604627L publication Critical patent/SE8604627L/

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2902Materials being Group IVA materials
    • H10P14/2905Silicon, silicon germanium or germanium
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/30Mechanisms for rotating or moving either the melt or the crystal
    • C30B15/305Stirring of the melt
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
SE8604627A 1985-10-31 1986-10-30 For halvledaranordning avsett enkristallsubstrat av kisel med hog syrehalt och framstellningssett for detta SE8604627L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60244562A JPS62105998A (ja) 1985-10-31 1985-10-31 シリコン基板の製法

Publications (2)

Publication Number Publication Date
SE8604627D0 SE8604627D0 (sv) 1986-10-30
SE8604627L true SE8604627L (sv) 1987-05-01

Family

ID=17120560

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8604627A SE8604627L (sv) 1985-10-31 1986-10-30 For halvledaranordning avsett enkristallsubstrat av kisel med hog syrehalt och framstellningssett for detta

Country Status (14)

Country Link
JP (1) JPS62105998A (fr)
KR (1) KR870004498A (fr)
CN (1) CN1016191B (fr)
AT (1) ATA289086A (fr)
AU (1) AU597599B2 (fr)
CA (1) CA1336061C (fr)
DE (1) DE3637006A1 (fr)
DK (1) DK518486A (fr)
FR (1) FR2589489B1 (fr)
GB (1) GB2182262B (fr)
IT (1) IT1198454B (fr)
MY (1) MY100449A (fr)
NL (1) NL8602738A (fr)
SE (1) SE8604627L (fr)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5196085A (en) * 1990-12-28 1993-03-23 Massachusetts Institute Of Technology Active magnetic flow control in Czochralski systems
JP2613498B2 (ja) * 1991-03-15 1997-05-28 信越半導体株式会社 Si単結晶ウエーハの熱処理方法
JPH07247197A (ja) * 1994-03-09 1995-09-26 Fujitsu Ltd 半導体装置とその製造方法
JP3443822B2 (ja) * 1996-03-27 2003-09-08 信越半導体株式会社 シリコン単結晶の製造方法
DE19711922A1 (de) * 1997-03-21 1998-09-24 Wacker Siltronic Halbleitermat Vorrichtung und Verfahren zum Ziehen eines Einkristalls
EP1273684B1 (fr) 1997-04-09 2005-09-14 MEMC Electronic Materials, Inc. Silicium à taux de défauts réduits à lacunes prédominantes
US6379642B1 (en) 1997-04-09 2002-04-30 Memc Electronic Materials, Inc. Vacancy dominated, defect-free silicon
MY135749A (en) 1997-04-09 2008-06-30 Memc Electronic Materials Process for producing low defect density, ideal oxygen precipitating silicon
JPH11268987A (ja) * 1998-03-20 1999-10-05 Shin Etsu Handotai Co Ltd シリコン単結晶およびその製造方法
JP2003517412A (ja) 1998-06-26 2003-05-27 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 任意に大きい直径を有する無欠陥シリコン結晶の成長方法
KR100581305B1 (ko) 1998-09-02 2006-05-22 엠이엠씨 일렉트로닉 머티리얼즈 인코포레이티드 저결함 밀도 단결정 실리콘으로부터의 soi 구조체
US6312516B2 (en) 1998-10-14 2001-11-06 Memc Electronic Materials, Inc. Process for preparing defect free silicon crystals which allows for variability in process conditions
KR20010034789A (ko) 1998-10-14 2001-04-25 헨넬리 헬렌 에프 실질적으로 성장 결점이 없는 에피택시얼 실리콘 웨이퍼
US6416836B1 (en) 1998-10-14 2002-07-09 Memc Electronic Materials, Inc. Thermally annealed, low defect density single crystal silicon
UA70313C2 (en) * 2000-08-21 2004-10-15 Close Corp Pillar Close Corp P A method for growing silicon monocrystals of the ma method for growing silicon monocrystals of the melt elt
US6858307B2 (en) 2000-11-03 2005-02-22 Memc Electronic Materials, Inc. Method for the production of low defect density silicon
US7105050B2 (en) 2000-11-03 2006-09-12 Memc Electronic Materials, Inc. Method for the production of low defect density silicon
US6846539B2 (en) 2001-01-26 2005-01-25 Memc Electronic Materials, Inc. Low defect density silicon having a vacancy-dominated core substantially free of oxidation induced stacking faults
DE10103691A1 (de) * 2001-01-26 2002-08-08 Crystal Growing Systems Gmbh Elektrische Energieversorgung für eine elektrische Heizung
WO2007137182A2 (fr) 2006-05-19 2007-11-29 Memc Electronic Materials, Inc. Maîtrise du défaut ponctuel aggloméré et formation de grappe d'oxygène induite par la surface latérale d'un cristal monocristallin pendant une croissance par tirage czochralski (cz)
JP5974978B2 (ja) * 2013-05-29 2016-08-23 信越半導体株式会社 シリコン単結晶製造方法
CN105780113B (zh) * 2016-03-10 2017-11-28 江西赛维Ldk太阳能高科技有限公司 一种表征晶体硅生长界面和生长速度的方法
CN112095154B (zh) * 2019-06-18 2021-05-14 上海新昇半导体科技有限公司 一种半导体晶体生长装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5556098A (en) * 1978-10-17 1980-04-24 Chiyou Lsi Gijutsu Kenkyu Kumiai Method and apparatus for producing si single crystal rod
EP0042901B1 (fr) * 1980-06-26 1984-10-31 International Business Machines Corporation Procédé pour contrôler la teneur en oxygène des barreaux de silicium tirés selon la méthode de Czochralski
GB2084046B (en) * 1980-08-27 1984-07-25 Secr Defence Method and apparatus for crystal growth
CA1191075A (fr) * 1980-12-29 1985-07-30 Roger A. Frederick Methode pour regler la concentration et la repartition de l'oxygene dans des tiges de silicone epitaxie par la methode czochralski
NL8102102A (nl) * 1981-04-29 1982-11-16 Philips Nv Werkwijze voor het optrekken van een siliciumstaaf en halfgeleiderinrichting vervaardigd uit de siliciumstaaf.
JPH0244799B2 (ja) * 1981-10-26 1990-10-05 Sony Corp Ketsushoseichohoho
US4511428A (en) * 1982-07-09 1985-04-16 International Business Machines Corporation Method of controlling oxygen content and distribution in grown silicon crystals
JPS6027684A (ja) * 1983-07-26 1985-02-12 Fujitsu Ltd 単結晶製造装置
JPS6033289A (ja) * 1983-07-29 1985-02-20 Toshiba Corp シリコン単結晶の製造方法
JPS6094722A (ja) * 1983-08-16 1985-05-27 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション シリコン・ウエハ
JPS6153187A (ja) * 1984-08-24 1986-03-17 Sony Corp 単結晶成長装置
IT1207497B (it) * 1985-05-29 1989-05-25 Montedison Spa Monocristalli di arseniuro di gallio a bassa densita' di dislocazioni e di elevata purezza.

Also Published As

Publication number Publication date
GB8626074D0 (en) 1986-12-03
DK518486D0 (da) 1986-10-30
CN1016191B (zh) 1992-04-08
DK518486A (da) 1987-05-01
IT8648592A1 (it) 1988-04-28
SE8604627D0 (sv) 1986-10-30
CN86106346A (zh) 1987-06-17
IT1198454B (it) 1988-12-21
CA1336061C (fr) 1995-06-27
AU6455086A (en) 1987-05-07
KR870004498A (ko) 1987-05-09
JPS62105998A (ja) 1987-05-16
FR2589489A1 (fr) 1987-05-07
FR2589489B1 (fr) 1994-06-10
ATA289086A (de) 1996-01-15
GB2182262A (en) 1987-05-13
MY100449A (en) 1990-10-15
IT8648592A0 (it) 1986-10-28
GB2182262B (en) 1989-09-27
AU597599B2 (en) 1990-06-07
NL8602738A (nl) 1987-05-18
DE3637006A1 (de) 1987-05-07

Similar Documents

Publication Publication Date Title
SE8604627D0 (sv) For halvledaranordning avsett enkristallsubstrat av kisel med hog syrehalt och framstellningssett for detta
ATE242547T1 (de) Verfahren zur herstellung eines halbleitersubstrats
EP2037009A3 (fr) Procédé de production d'une plaquette SOI fixée
EP0389533A4 (en) Sublimation growth of silicon carbide single crystals
MY115099A (en) Process for producing silicon semiconductor wafers with low defect density
DE69434773D1 (de) Vorrichtung zur schnellen thermischen Behandlung zur Herstellung von Halbleiterwafern
JPS57126131A (en) Manufacture of semiconductor device
DE3377874D1 (en) Method of growing silicon crystals by the czochralski method
DE3478864D1 (en) Apparatus and method for growing doped monocrystalline silicon semiconductor crystals using the float zone technique
JPS5740940A (en) Semiconductor device
JPS641273A (en) Manufacture of polycrystalline silicon thin film transistor
JPS55130897A (en) Silicon single crystal
JPS6472999A (en) Heat treatment of compound semiconductor single crystal
JPS57167637A (en) Manufacture of semiconductor device
JPS6424098A (en) Heat treatment of compound semiconductor single crystal
JPS57170518A (en) Fabrication of semiconductor thin film
EP0284434A3 (fr) Procédé de préparation de cristaux
JPS648610A (en) Silicon wafer for semiconductor substrate and manufacture thereof
JPS6419715A (en) Growth method for semiconductor thin-film
JPS645992A (en) Method for growing crystal
JPS57188827A (en) Manufacture of semiconductor device
JPS6461381A (en) Method for growing single crystal
JPS5530865A (en) Selected oxidation process for making semiconductor device
JPS57153438A (en) Manufacture of semiconductor substrate
JPS5717496A (en) Liquid phase growing method for single crystal of compound semiconductor

Legal Events

Date Code Title Description
NAV Patent application has lapsed

Ref document number: 8604627-3

Format of ref document f/p: F