SE9202077L - Komponentmodul - Google Patents

Komponentmodul

Info

Publication number
SE9202077L
SE9202077L SE9202077A SE9202077A SE9202077L SE 9202077 L SE9202077 L SE 9202077L SE 9202077 A SE9202077 A SE 9202077A SE 9202077 A SE9202077 A SE 9202077A SE 9202077 L SE9202077 L SE 9202077L
Authority
SE
Sweden
Prior art keywords
component module
carrier substrate
circuit
directly mounted
enclosing device
Prior art date
Application number
SE9202077A
Other languages
English (en)
Swedish (sv)
Other versions
SE9202077D0 (sv
Inventor
M O J Hedberg
Original Assignee
Ellemtel Utvecklings Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ellemtel Utvecklings Ab filed Critical Ellemtel Utvecklings Ab
Priority to SE9202077A priority Critical patent/SE9202077L/xx
Publication of SE9202077D0 publication Critical patent/SE9202077D0/xx
Priority to PCT/SE1993/000486 priority patent/WO1994001987A1/fr
Priority to EP93915044A priority patent/EP0649590A1/fr
Priority to AU45171/93A priority patent/AU4517193A/en
Priority to KR1019950700054A priority patent/KR950702790A/ko
Priority to JP6503208A priority patent/JPH08501657A/ja
Priority to BR9306685A priority patent/BR9306685A/pt
Priority to FI950058A priority patent/FI950058A0/fi
Priority to MXPA93003941A priority patent/MXPA93003941A/es
Priority to CN93108141A priority patent/CN1041479C/zh
Publication of SE9202077L publication Critical patent/SE9202077L/xx
Priority to NO950038A priority patent/NO950038L/no
Priority to AU46816/97A priority patent/AU4681697A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4285—Optical modules characterised by a connectorised pigtail
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4286—Optical modules with optical power monitoring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Transceivers (AREA)
  • Combinations Of Printed Boards (AREA)
  • Glass Compositions (AREA)
SE9202077A 1992-07-06 1992-07-06 Komponentmodul SE9202077L (sv)

Priority Applications (12)

Application Number Priority Date Filing Date Title
SE9202077A SE9202077L (sv) 1992-07-06 1992-07-06 Komponentmodul
FI950058A FI950058A0 (fi) 1992-07-06 1993-06-02 Komponenttimoduuli
KR1019950700054A KR950702790A (ko) 1992-07-06 1993-06-02 소자 모듈(component module)
EP93915044A EP0649590A1 (fr) 1992-07-06 1993-06-02 Module a composants
AU45171/93A AU4517193A (en) 1992-07-06 1993-06-02 Component module
PCT/SE1993/000486 WO1994001987A1 (fr) 1992-07-06 1993-06-02 Module a composants
JP6503208A JPH08501657A (ja) 1992-07-06 1993-06-02 構成モデュール
BR9306685A BR9306685A (pt) 1992-07-06 1993-06-02 Módulo componente e módulo transceptor
MXPA93003941A MXPA93003941A (es) 1992-07-06 1993-06-30 Modulo componente.
CN93108141A CN1041479C (zh) 1992-07-06 1993-07-05 元件模块
NO950038A NO950038L (no) 1992-07-06 1995-01-05 Komponentmodul
AU46816/97A AU4681697A (en) 1992-07-06 1997-12-01 Component module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9202077A SE9202077L (sv) 1992-07-06 1992-07-06 Komponentmodul

Publications (2)

Publication Number Publication Date
SE9202077D0 SE9202077D0 (sv) 1992-07-06
SE9202077L true SE9202077L (sv) 1994-01-07

Family

ID=20386708

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9202077A SE9202077L (sv) 1992-07-06 1992-07-06 Komponentmodul

Country Status (11)

Country Link
EP (1) EP0649590A1 (fr)
JP (1) JPH08501657A (fr)
KR (1) KR950702790A (fr)
CN (1) CN1041479C (fr)
AU (2) AU4517193A (fr)
BR (1) BR9306685A (fr)
FI (1) FI950058A0 (fr)
MX (1) MXPA93003941A (fr)
NO (1) NO950038L (fr)
SE (1) SE9202077L (fr)
WO (1) WO1994001987A1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0936485A1 (fr) * 1998-02-12 1999-08-18 Alcatel Elément optoélectronique
US6381283B1 (en) * 1998-10-07 2002-04-30 Controlnet, Inc. Integrated socket with chip carrier
DE10008340A1 (de) * 2000-02-23 2001-08-30 Siemens Ag Elektronische Flachbaugruppe für elektronische Geräte, insbesondere Kommunikationsendgeräte
US6862190B2 (en) 2001-01-17 2005-03-01 Honeywell International, Inc. Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers
US6894903B2 (en) 2001-02-28 2005-05-17 Sumitomo Electric Industries, Ltd. Optical data link
CA2373675A1 (fr) * 2001-02-28 2002-08-28 Sumitomo Electric Industries, Ltd. Liaison de donnees optique
FR2822246B1 (fr) * 2001-03-15 2003-05-16 Opsitech Optical Sys On A Chip Procede de fabrication d'un boitier optique et dispositif opto-electronique
GB2385914B (en) * 2001-10-19 2004-03-03 Visteon Global Tech Inc LCC-Based fluid-level detection sensor
US20040156149A1 (en) * 2002-09-05 2004-08-12 Odd Steijer Method of and apparatus for plastic optical-chip encapsulation
WO2004038599A1 (fr) 2002-09-06 2004-05-06 Pact Xpp Technologies Ag Structure de sequenceur reconfigurable
CN101378624B (zh) * 2007-08-29 2010-11-10 海华科技股份有限公司 整合周边电路的模块结构及其制造方法
CN101965104A (zh) * 2010-04-20 2011-02-02 力帆实业(集团)股份有限公司 一种电路封装装置
US20130230272A1 (en) * 2012-03-01 2013-09-05 Oracle International Corporation Chip assembly configuration with densely packed optical interconnects
CN103413797B (zh) * 2013-07-29 2015-10-14 中国科学院电工研究所 一种三维结构单元组装的功率半导体模块
CN103984065B (zh) * 2014-05-30 2015-07-15 武汉光迅科技股份有限公司 一种光传输模块
CN106298761A (zh) * 2016-09-24 2017-01-04 苏州捷研芯纳米科技有限公司 光电传感器封装件、半成品及批量封装方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4447857A (en) * 1981-12-09 1984-05-08 International Business Machines Corporation Substrate with multiple type connections
JPS59180514A (ja) * 1983-03-31 1984-10-13 Toshiba Corp 光受信モジユ−ル
US4911519A (en) * 1989-02-01 1990-03-27 At&T Bell Laboratories Packaging techniques for optical transmitters/receivers
JPH02306690A (ja) * 1989-05-22 1990-12-20 Toshiba Corp 表面実装用配線基板の製造方法
US5039194A (en) * 1990-01-09 1991-08-13 International Business Machines Corporation Optical fiber link card
US4979787A (en) * 1990-01-12 1990-12-25 Pco, Inc. Optical-electronic interface module

Also Published As

Publication number Publication date
FI950058L (fi) 1995-01-05
CN1041479C (zh) 1998-12-30
NO950038D0 (no) 1995-01-05
WO1994001987A1 (fr) 1994-01-20
AU4517193A (en) 1994-01-31
NO950038L (no) 1995-01-05
FI950058A7 (fi) 1995-01-05
SE9202077D0 (sv) 1992-07-06
EP0649590A1 (fr) 1995-04-26
KR950702790A (ko) 1995-07-29
FI950058A0 (fi) 1995-01-05
MXPA93003941A (es) 2010-11-12
CN1081297A (zh) 1994-01-26
BR9306685A (pt) 1998-12-08
JPH08501657A (ja) 1996-02-20
AU4681697A (en) 1998-02-05

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