SE9203533L - Apparatus for cooling disc-shaped power electronics elements as well as disc-shaped power electronics elements intended to be mounted in such a cooling device - Google Patents

Apparatus for cooling disc-shaped power electronics elements as well as disc-shaped power electronics elements intended to be mounted in such a cooling device

Info

Publication number
SE9203533L
SE9203533L SE9203533A SE9203533A SE9203533L SE 9203533 L SE9203533 L SE 9203533L SE 9203533 A SE9203533 A SE 9203533A SE 9203533 A SE9203533 A SE 9203533A SE 9203533 L SE9203533 L SE 9203533L
Authority
SE
Sweden
Prior art keywords
substrate
disc
power electronics
shaped power
circuit pattern
Prior art date
Application number
SE9203533A
Other languages
Swedish (sv)
Other versions
SE500281C2 (en
SE9203533D0 (en
Inventor
Waldemar Belwon
Goesta Hesslow
Thomas Melberg
Original Assignee
Asea Brown Boveri
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Brown Boveri filed Critical Asea Brown Boveri
Priority to SE9203533A priority Critical patent/SE500281C2/en
Publication of SE9203533D0 publication Critical patent/SE9203533D0/en
Priority to PCT/SE1993/000824 priority patent/WO1994013012A1/en
Priority to PCT/SE1993/001004 priority patent/WO1994013014A1/en
Publication of SE9203533L publication Critical patent/SE9203533L/en
Publication of SE500281C2 publication Critical patent/SE500281C2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention relates to a heat-generating electronic circuit board, comprising a board substrate (12) of electrically non-conducting material with at least one circuit pattern (14) formed thereon, on which semiconductors are mounted. The circuit pattern (14) has a section (B) with terminals (16) for contacts. The substrate is divided into a substrate portion (24) supporting semiconductors and a substrate portion (22) separated therefrom and supporting terminals (16) of the circuit pattern, said substrate portions being flexibly held together by the circuit pattern (18) therebetween. The invention also relates to a process for manufacturing such an electronic circuit board, whereby a score (20) is made on one side of the substrate along a portion thereof separating the terminal portion (22) from the semiconductor portion (24), whereafter the substrate is broken along the score and the substrate portions are pulled apart with the portions held at an angle to each other so that freed bridges (18) are formed in the circuit pattern, said bridges flexibly connecting the terminal substrate portion (22) with the semiconductor substrate portion (24).
SE9203533A 1992-11-24 1992-11-24 Apparatus for cooling disc-shaped power electronics elements as well as disc-shaped power electronics elements intended to be mounted in such a cooling device SE500281C2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE9203533A SE500281C2 (en) 1992-11-24 1992-11-24 Apparatus for cooling disc-shaped power electronics elements as well as disc-shaped power electronics elements intended to be mounted in such a cooling device
PCT/SE1993/000824 WO1994013012A1 (en) 1992-11-24 1993-10-11 Device for cooling sheet elements for power electronics
PCT/SE1993/001004 WO1994013014A1 (en) 1992-11-24 1993-11-22 Disc-formed, heat producing electronic element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9203533A SE500281C2 (en) 1992-11-24 1992-11-24 Apparatus for cooling disc-shaped power electronics elements as well as disc-shaped power electronics elements intended to be mounted in such a cooling device

Publications (3)

Publication Number Publication Date
SE9203533D0 SE9203533D0 (en) 1992-11-24
SE9203533L true SE9203533L (en) 1994-05-24
SE500281C2 SE500281C2 (en) 1994-05-24

Family

ID=20387921

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9203533A SE500281C2 (en) 1992-11-24 1992-11-24 Apparatus for cooling disc-shaped power electronics elements as well as disc-shaped power electronics elements intended to be mounted in such a cooling device

Country Status (2)

Country Link
SE (1) SE500281C2 (en)
WO (2) WO1994013012A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19924960A1 (en) * 1999-05-31 2000-12-14 Siemens Ag Device for cooling semiconductor components
DE102005053396B4 (en) * 2005-11-09 2010-04-15 Semikron Elektronik Gmbh & Co. Kg Circuit device, in particular frequency converter
US10638643B2 (en) * 2017-11-14 2020-04-28 Canon Kabushiki Kaisha Electronic device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE547698A (en) * 1955-05-10 1900-01-01
NL260951A (en) * 1960-03-07
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4479140A (en) * 1982-06-28 1984-10-23 International Business Machines Corporation Thermal conduction element for conducting heat from semiconductor devices to a cold plate
JPH063831B2 (en) * 1987-04-08 1994-01-12 株式会社日立製作所 Cooling device and semiconductor device using the same
US5132875A (en) * 1990-10-29 1992-07-21 Compaq Computer Corporation Removable protective heat sink for electronic components

Also Published As

Publication number Publication date
SE500281C2 (en) 1994-05-24
SE9203533D0 (en) 1992-11-24
WO1994013014A1 (en) 1994-06-09
WO1994013012A1 (en) 1994-06-09

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