SE9700773L - Halvledarkomponent och tillverkningsförfarande förhalvledarkomponent - Google Patents

Halvledarkomponent och tillverkningsförfarande förhalvledarkomponent

Info

Publication number
SE9700773L
SE9700773L SE9700773A SE9700773A SE9700773L SE 9700773 L SE9700773 L SE 9700773L SE 9700773 A SE9700773 A SE 9700773A SE 9700773 A SE9700773 A SE 9700773A SE 9700773 L SE9700773 L SE 9700773L
Authority
SE
Sweden
Prior art keywords
semiconductor component
manufacturing process
area
areas
doped
Prior art date
Application number
SE9700773A
Other languages
Unknown language ( )
English (en)
Other versions
SE519628C2 (sv
SE9700773D0 (sv
Inventor
Haakan Sjoedin
Anders Soederbaerg
Nils Oegren
Ivar Hamberg
Dimitri Olofsson
Karin Anderson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9700773A priority Critical patent/SE519628C2/sv
Publication of SE9700773D0 publication Critical patent/SE9700773D0/sv
Priority to TW086103707A priority patent/TW364161B/zh
Priority to US09/033,714 priority patent/US6140194A/en
Priority to KR1019997007774A priority patent/KR20000075706A/ko
Priority to EP98908408A priority patent/EP0966757A1/en
Priority to CA002283396A priority patent/CA2283396A1/en
Priority to PCT/SE1998/000388 priority patent/WO1998039797A1/en
Priority to CN98802982A priority patent/CN1249848A/zh
Priority to AU66443/98A priority patent/AU6644398A/en
Priority to JP53844898A priority patent/JP2001513945A/ja
Publication of SE9700773L publication Critical patent/SE9700773L/sv
Priority to US09/236,619 priority patent/US6153919A/en
Publication of SE519628C2 publication Critical patent/SE519628C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00—Bipolar junction transistors [BJT]
    • H10D10/01—Manufacture or treatment
    • H10D10/051—Manufacture or treatment of vertical BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/22—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0112—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
    • H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
    • H10P76/4088—Processes for improving the resolution of the masks

Landscapes

  • Bipolar Transistors (AREA)
SE9700773A 1997-03-04 1997-03-04 Tillverkningsförfarande för halvledarkomponent med deponering av selektivt utformat material,vilket är ogenomträngligt för dopjoner SE519628C2 (sv)

Priority Applications (11)

Application Number Priority Date Filing Date Title
SE9700773A SE519628C2 (sv) 1997-03-04 1997-03-04 Tillverkningsförfarande för halvledarkomponent med deponering av selektivt utformat material,vilket är ogenomträngligt för dopjoner
TW086103707A TW364161B (en) 1997-03-04 1997-03-24 Semiconductor and method relating to semiconductors
US09/033,714 US6140194A (en) 1997-03-04 1998-03-03 Method relating to the manufacture of a semiconductor component
JP53844898A JP2001513945A (ja) 1997-03-04 1998-03-04 半導体及び半導体に関する方法
EP98908408A EP0966757A1 (en) 1997-03-04 1998-03-04 Semiconductor and method relating to semiconductors
KR1019997007774A KR20000075706A (ko) 1997-03-04 1998-03-04 반도체 및 반도체-관련 방법
CA002283396A CA2283396A1 (en) 1997-03-04 1998-03-04 Semiconductor and method relating to semiconductors
PCT/SE1998/000388 WO1998039797A1 (en) 1997-03-04 1998-03-04 Semiconductor and method relating to semiconductors
CN98802982A CN1249848A (zh) 1997-03-04 1998-03-04 半导体及其有关方法
AU66443/98A AU6644398A (en) 1997-03-04 1998-03-04 Semiconductor and method relating to semiconductors
US09/236,619 US6153919A (en) 1997-03-04 1999-01-26 Bipolar transistor with polysilicon dummy emitter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9700773A SE519628C2 (sv) 1997-03-04 1997-03-04 Tillverkningsförfarande för halvledarkomponent med deponering av selektivt utformat material,vilket är ogenomträngligt för dopjoner

Publications (3)

Publication Number Publication Date
SE9700773D0 SE9700773D0 (sv) 1997-03-04
SE9700773L true SE9700773L (sv) 1998-09-05
SE519628C2 SE519628C2 (sv) 2003-03-18

Family

ID=20406016

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9700773A SE519628C2 (sv) 1997-03-04 1997-03-04 Tillverkningsförfarande för halvledarkomponent med deponering av selektivt utformat material,vilket är ogenomträngligt för dopjoner

Country Status (10)

Country Link
US (2) US6140194A (sv)
EP (1) EP0966757A1 (sv)
JP (1) JP2001513945A (sv)
KR (1) KR20000075706A (sv)
CN (1) CN1249848A (sv)
AU (1) AU6644398A (sv)
CA (1) CA2283396A1 (sv)
SE (1) SE519628C2 (sv)
TW (1) TW364161B (sv)
WO (1) WO1998039797A1 (sv)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001127071A (ja) * 1999-08-19 2001-05-11 Hitachi Ltd 半導体装置及びその製造方法
US7432179B2 (en) * 2004-12-15 2008-10-07 Taiwan Semiconductor Manufacturing Company, Ltd. Controlling gate formation by removing dummy gate structures
US7701034B2 (en) * 2005-01-21 2010-04-20 Taiwan Semiconductor Manufacturing Company, Ltd. Dummy patterns in integrated circuit fabrication
US7939384B2 (en) * 2008-12-19 2011-05-10 Taiwan Semiconductor Manufacturing Company, Ltd. Eliminating poly uni-direction line-end shortening using second cut
TWI554710B (zh) * 2015-02-24 2016-10-21 蔡晉暉 手電筒改良結構
TWI655772B (zh) * 2017-05-05 2019-04-01 旺宏電子股份有限公司 半導體元件
US10256307B2 (en) 2017-05-08 2019-04-09 Macronix International Co., Ltd. Semiconductor device

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4110126A (en) * 1977-08-31 1978-08-29 International Business Machines Corporation NPN/PNP Fabrication process with improved alignment
GB2088626A (en) * 1980-02-22 1982-06-09 Mostek Corp Self-aligned buried contact and method of making
JPS5737870A (en) * 1980-08-20 1982-03-02 Toshiba Corp Semiconductor device
EP0122004A3 (en) * 1983-03-08 1986-12-17 Trw Inc. Improved bipolar transistor construction
US4573256A (en) * 1983-08-26 1986-03-04 International Business Machines Corporation Method for making a high performance transistor integrated circuit
GB2172744B (en) * 1985-03-23 1989-07-19 Stc Plc Semiconductor devices
US4962053A (en) * 1987-01-30 1990-10-09 Texas Instruments Incorporated Bipolar transistor fabrication utilizing CMOS techniques
US4866001A (en) * 1988-07-01 1989-09-12 Bipolar Integrated Technology, Inc. Very large scale bipolar integrated circuit process
EP0414013A3 (en) * 1989-08-23 1991-10-16 Texas Instruments Incorporated Method for forming bipolar transistor in conjunction with complementary metal oxide semiconductor transistors
US5212397A (en) * 1990-08-13 1993-05-18 Motorola, Inc. BiCMOS device having an SOI substrate and process for making the same
US5406113A (en) * 1991-01-09 1995-04-11 Fujitsu Limited Bipolar transistor having a buried collector layer
JP3798808B2 (ja) * 1991-09-27 2006-07-19 ハリス・コーポレーション 高いアーリー電壓，高周波性能及び高降伏電壓特性を具備した相補型バイポーラトランジスター及びその製造方法
US5389561A (en) * 1991-12-13 1995-02-14 Sony Corporation Method for making SOI type bipolar transistor
US5326710A (en) * 1992-09-10 1994-07-05 National Semiconductor Corporation Process for fabricating lateral PNP transistor structure and BICMOS IC
US5416031A (en) * 1992-09-30 1995-05-16 Sony Corporation Method of producing Bi-CMOS transistors
DE4308958A1 (de) * 1993-03-21 1994-09-22 Prema Paezisionselektronik Gmb Verfahren zur Herstellung von Bipolartransistoren
US5451532A (en) * 1994-03-15 1995-09-19 National Semiconductor Corp. Process for making self-aligned polysilicon base contact in a bipolar junction transistor
US5516708A (en) * 1994-11-17 1996-05-14 Northern Telecom Limited Method of making single polysilicon self-aligned bipolar transistor having reduced emitter-base junction
US5489541A (en) * 1995-04-14 1996-02-06 United Microelectronics Corporation Process of fabricating a bipolar junction transistor
US5708287A (en) * 1995-11-29 1998-01-13 Kabushiki Kaisha Toshiba Power semiconductor device having an active layer

Also Published As

Publication number Publication date
WO1998039797A1 (en) 1998-09-11
KR20000075706A (ko) 2000-12-26
CN1249848A (zh) 2000-04-05
EP0966757A1 (en) 1999-12-29
US6140194A (en) 2000-10-31
SE519628C2 (sv) 2003-03-18
SE9700773D0 (sv) 1997-03-04
JP2001513945A (ja) 2001-09-04
TW364161B (en) 1999-07-11
CA2283396A1 (en) 1998-09-11
US6153919A (en) 2000-11-28
AU6644398A (en) 1998-09-22

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Legal Events

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