SE9704719L - Komponentmonteringsarrangemang, klämma och sammansättning - Google Patents

Komponentmonteringsarrangemang, klämma och sammansättning

Info

Publication number
SE9704719L
SE9704719L SE9704719A SE9704719A SE9704719L SE 9704719 L SE9704719 L SE 9704719L SE 9704719 A SE9704719 A SE 9704719A SE 9704719 A SE9704719 A SE 9704719A SE 9704719 L SE9704719 L SE 9704719L
Authority
SE
Sweden
Prior art keywords
clamp
box
assembly
component mounting
metal box
Prior art date
Application number
SE9704719A
Other languages
English (en)
Swedish (sv)
Other versions
SE9704719D0 (sv
Inventor
Michael Persson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9704719A priority Critical patent/SE9704719L/xx
Publication of SE9704719D0 publication Critical patent/SE9704719D0/xx
Priority to US09/212,428 priority patent/US6075208A/en
Priority to CA002256141A priority patent/CA2256141A1/fr
Priority to TW087121044A priority patent/TW410538B/zh
Priority to NO985940A priority patent/NO985940L/no
Priority to EP98850196A priority patent/EP0930814A3/fr
Publication of SE9704719L publication Critical patent/SE9704719L/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641—Snap-on arrangements, e.g. clips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SE9704719A 1997-12-17 1997-12-17 Komponentmonteringsarrangemang, klämma och sammansättning SE9704719L (sv)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SE9704719A SE9704719L (sv) 1997-12-17 1997-12-17 Komponentmonteringsarrangemang, klämma och sammansättning
US09/212,428 US6075208A (en) 1997-12-17 1998-12-16 Component mounting arrangement and assembly
CA002256141A CA2256141A1 (fr) 1997-12-17 1998-12-16 Systeme d'installation, pince et assemblage d'un element
TW087121044A TW410538B (en) 1997-12-17 1998-12-17 Component mounting arrangement, clip and assembly
NO985940A NO985940L (no) 1997-12-17 1998-12-17 Komponentmonteringsanordning, klemme og montasje
EP98850196A EP0930814A3 (fr) 1997-12-17 1998-12-17 Dispositif de montage des composants, clip de serrage et assemblage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9704719A SE9704719L (sv) 1997-12-17 1997-12-17 Komponentmonteringsarrangemang, klämma och sammansättning

Publications (2)

Publication Number Publication Date
SE9704719D0 SE9704719D0 (sv) 1997-12-17
SE9704719L true SE9704719L (sv) 1999-06-18

Family

ID=20409435

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9704719A SE9704719L (sv) 1997-12-17 1997-12-17 Komponentmonteringsarrangemang, klämma och sammansättning

Country Status (6)

Country Link
US (1) US6075208A (fr)
EP (1) EP0930814A3 (fr)
CA (1) CA2256141A1 (fr)
NO (1) NO985940L (fr)
SE (1) SE9704719L (fr)
TW (1) TW410538B (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302704B1 (en) * 1999-04-22 2001-10-16 Ford Global Tech. Method and apparatus for selectively connecting flexible circuits
US6757179B2 (en) 2002-08-29 2004-06-29 Hewlett-Packard Development Company, L.P. Circuit board support assembly
US6842345B2 (en) 2002-08-29 2005-01-11 Hewlett-Packard Development Company, L.P. Circuit board support assembly
US7129577B2 (en) * 2003-02-27 2006-10-31 Power-One, Inc. Power supply packaging system
US7056144B2 (en) 2004-02-19 2006-06-06 Hewlett-Packard Development Company, L.P. Offset compensation system
GB2425147B (en) * 2005-12-23 2007-02-28 Christopher Charles Brindle Retaining clip
US7742310B2 (en) * 2006-09-29 2010-06-22 Hewlett-Packard Development Company, L.P. Sequencer
US7397666B2 (en) * 2006-10-25 2008-07-08 Hewlett-Packard Development Company, L.P. Wedge lock

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5138524A (en) * 1991-09-19 1992-08-11 Thermalloy Incorporated Apparatus for securing electronic device packages to heat sinks
JP3256370B2 (ja) * 1994-03-17 2002-02-12 新キャタピラー三菱株式会社 油圧ショベルのポンプ制御装置
US5870287A (en) * 1997-10-07 1999-02-09 Aavid Thermal Technologies, Inc. Spring clip for mounting a heat sink to an electronic component

Also Published As

Publication number Publication date
US6075208A (en) 2000-06-13
EP0930814A3 (fr) 1999-09-15
EP0930814A2 (fr) 1999-07-21
NO985940D0 (no) 1998-12-17
CA2256141A1 (fr) 1999-06-17
TW410538B (en) 2000-11-01
NO985940L (no) 1999-06-18
SE9704719D0 (sv) 1997-12-17

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Legal Events

Date Code Title Description
NAV Patent application has lapsed