SG10202000335VA - Manufacturing method for multiple MEMS sound transducers - Google Patents

Manufacturing method for multiple MEMS sound transducers

Info

Publication number
SG10202000335VA
SG10202000335VA SG10202000335VA SG10202000335VA SG10202000335VA SG 10202000335V A SG10202000335V A SG 10202000335VA SG 10202000335V A SG10202000335V A SG 10202000335VA SG 10202000335V A SG10202000335V A SG 10202000335VA SG 10202000335V A SG10202000335V A SG 10202000335VA
Authority
SG
Singapore
Prior art keywords
manufacturing
sound transducers
mems sound
multiple mems
transducers
Prior art date
Application number
SG10202000335VA
Other languages
English (en)
Inventor
Rusconi Clerici Beltrami Andrea
Bottoni Ferruccio
Renaud-Bezot Nick
Original Assignee
USound GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USound GmbH filed Critical USound GmbH
Publication of SG10202000335VA publication Critical patent/SG10202000335VA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261Processes for packaging MEMS devices
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • H04R17/005Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021Transducers for transforming electrical into mechanical energy or vice versa
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/02Microstructural systems ; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865Multistep processes for the separation of wafers into individual elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00Assembling of devices or systems from individually processed components
    • B81C3/001Bonding of two components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/02Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006Interconnection of transducer parts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0257Microphones or microspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003Mems transducers or their use

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Micromachines (AREA)
SG10202000335VA 2019-01-17 2020-01-14 Manufacturing method for multiple MEMS sound transducers SG10202000335VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019101227 2019-01-17
DE102019101325.9A DE102019101325A1 (de) 2019-01-17 2019-01-18 Herstellungsverfahren für mehrere MEMS-Schallwandler

Publications (1)

Publication Number Publication Date
SG10202000335VA true SG10202000335VA (en) 2020-08-28

Family

ID=71402642

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202000335VA SG10202000335VA (en) 2019-01-17 2020-01-14 Manufacturing method for multiple MEMS sound transducers

Country Status (9)

Country Link
US (1) US11375317B2 (ko)
EP (1) EP3684081B1 (ko)
KR (1) KR20200090124A (ko)
CN (1) CN111439719B (ko)
AU (1) AU2020200291A1 (ko)
CA (1) CA3068717A1 (ko)
DE (1) DE102019101325A1 (ko)
SG (1) SG10202000335VA (ko)
TW (1) TW202104067A (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11591371B2 (en) 2018-04-02 2023-02-28 University Of Maryland, College Park FcRn-targeted mucosal vaccination against influenza infections
DE102023111777A1 (de) 2023-05-05 2024-11-07 Technische Universität Chemnitz, Körperschaft des öffentlichen Rechts Verfahren zur Herstellung eines mikromechanischen Ultraschallwandlers und zugehöriger Ultraschallwandler
DE202023102447U1 (de) 2023-05-05 2023-06-23 Technische Universität Chemnitz, Körperschaft des öffentlichen Rechts Mikromechanischer Ultraschallwandler
DE102024207848A1 (de) 2024-08-19 2026-02-19 Robert Bosch Gesellschaft mit beschränkter Haftung Einzelmembran als Fluidpumpensystem

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US6953977B2 (en) * 2000-02-08 2005-10-11 Boston Microsystems, Inc. Micromechanical piezoelectric device
US7420317B2 (en) * 2004-10-15 2008-09-02 Fujifilm Dimatix, Inc. Forming piezoelectric actuators
JP2006245098A (ja) * 2005-03-01 2006-09-14 Seiko Epson Corp 電子部品及びその製造方法、並びに電子機器
DE102006032925B8 (de) * 2006-07-15 2008-11-06 Schott Ag Elektronische Baugruppe und Verfahren zur Verkapselung elektronischer Bauelemente und integrierter Schaltungen
US8215176B2 (en) * 2009-05-27 2012-07-10 Continental Automotive Systems, Inc. Pressure sensor for harsh media sensing and flexible packaging
US8585187B2 (en) * 2011-04-29 2013-11-19 Xerox Corporation High density electrical interconnect for printing devices using flex circuits and dielectric underfill
US8811636B2 (en) * 2011-11-29 2014-08-19 Qualcomm Mems Technologies, Inc. Microspeaker with piezoelectric, metal and dielectric membrane
CN105122488B (zh) * 2013-03-14 2018-01-26 火山公司 晶片级换能器涂覆和方法
US9584889B2 (en) 2013-08-27 2017-02-28 Infineon Technologies Ag System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille
US9584886B2 (en) 2014-07-16 2017-02-28 Htc Corporation Micro-speaker
US10306372B2 (en) * 2014-08-26 2019-05-28 Goertek Inc. Fully wafer-level-packaged MEMS microphone and method for manufacturing the same
US20170288123A1 (en) * 2014-09-19 2017-10-05 Nihon Dempa Kogyo Co., Ltd. Piezoelectric device and method for manufacturing the same
US9701534B2 (en) * 2015-01-28 2017-07-11 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming MEMS package
DE102015107560A1 (de) * 2015-05-13 2016-11-17 USound GmbH Schallwandleranordnung mit MEMS-Schallwandler
DE102015107557A1 (de) * 2015-05-13 2016-11-17 USound GmbH Leiterplattenmodul mit durchgehender Aussparung sowie diesbezügliche Schallwandleranordnung sowie Herstellungsverfahren
US9761571B2 (en) * 2015-09-17 2017-09-12 Deca Technologies Inc. Thermally enhanced fully molded fan-out module
DE102015116640B4 (de) 2015-10-01 2024-09-05 USound GmbH MEMS-Leiterplattenmodul mit integrierter piezoelektrischer Struktur sowie Schallwandleranordnung
US20170133334A1 (en) * 2015-11-09 2017-05-11 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US10840430B2 (en) * 2016-06-30 2020-11-17 Intel Corporation Piezoelectric package-integrated sensing devices
US10163834B2 (en) * 2016-09-09 2018-12-25 Powertech Technology Inc. Chip package structure comprising encapsulant having concave surface
TWI756311B (zh) * 2016-11-29 2022-03-01 新加坡商Pep創新私人有限公司 晶片封裝方法及封裝結構
DE102017207887B3 (de) 2017-05-10 2018-10-31 Infineon Technologies Ag Verfahren zur Herstellung von gehäusten MEMS-Bausteinen auf Waferebene
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CN208300025U (zh) * 2018-06-25 2018-12-28 歌尔股份有限公司 Mems压电麦克风

Also Published As

Publication number Publication date
AU2020200291A1 (en) 2020-08-06
TW202104067A (zh) 2021-02-01
CN111439719A (zh) 2020-07-24
EP3684081B1 (de) 2022-04-27
CN111439719B (zh) 2024-08-16
US20200236467A1 (en) 2020-07-23
DE102019101325A1 (de) 2020-07-23
CA3068717A1 (en) 2020-07-17
EP3684081A1 (de) 2020-07-22
KR20200090124A (ko) 2020-07-28
US11375317B2 (en) 2022-06-28

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