SG111194G - Area-bonding tape - Google Patents

Area-bonding tape

Info

Publication number
SG111194G
SG111194G SG111194A SG111194A SG111194G SG 111194 G SG111194 G SG 111194G SG 111194 A SG111194 A SG 111194A SG 111194 A SG111194 A SG 111194A SG 111194 G SG111194 G SG 111194G
Authority
SG
Singapore
Prior art keywords
area
bonding tape
tape
bonding
Prior art date
Application number
SG111194A
Other languages
English (en)
Inventor
Robert R Rochloff
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Priority to SG111194A priority Critical patent/SG111194G/en
Publication of SG111194G publication Critical patent/SG111194G/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
SG111194A 1984-08-09 1994-08-12 Area-bonding tape SG111194G (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG111194A SG111194G (en) 1984-08-09 1994-08-12 Area-bonding tape

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63949384A 1984-08-09 1984-08-09
SG111194A SG111194G (en) 1984-08-09 1994-08-12 Area-bonding tape

Publications (1)

Publication Number Publication Date
SG111194G true SG111194G (en) 1994-11-25

Family

ID=24564327

Family Applications (1)

Application Number Title Priority Date Filing Date
SG111194A SG111194G (en) 1984-08-09 1994-08-12 Area-bonding tape

Country Status (7)

Country Link
EP (1) EP0171232B1 (de)
JP (1) JPS6170743A (de)
KR (1) KR930002909B1 (de)
CA (1) CA1238959A (de)
DE (1) DE3587244T2 (de)
HK (1) HK95894A (de)
SG (1) SG111194G (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1271819A (en) * 1986-08-05 1990-07-17 Walter Phelps Kern Electrically shielding
GB8719075D0 (en) * 1987-08-12 1987-09-16 Bicc Plc Surface mounted component adaptor
GB2212343A (en) * 1987-11-12 1989-07-19 Peter Elliott Electrical junction
US5631447A (en) * 1988-02-05 1997-05-20 Raychem Limited Uses of uniaxially electrically conductive articles
JP2758053B2 (ja) * 1988-02-05 1998-05-25 レイケム・リミテッド 単一軸状電気伝導部品の使用
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
EP0327399B1 (de) * 1988-02-05 1996-04-17 Raychem Limited Verfahren zum Herstellen eines uniaxial elektrisch leitenden Artikels
WO1990003662A1 (en) * 1988-09-30 1990-04-05 Raychem Limited Hybrid microchip bonding article
JPH0810744B2 (ja) * 1989-08-28 1996-01-31 三菱電機株式会社 半導体装置
US5557505A (en) * 1994-07-22 1996-09-17 Ast Research, Inc. Dual pattern microprocessor package footprint
US5777853A (en) * 1996-05-03 1998-07-07 Ast Research, Inc. Printed circuit board having a dual square pattern footprints for receiving one of two electronic components having equal printouts per size
US5764488A (en) * 1996-06-11 1998-06-09 Ast Research, Inc. Printed circuit board having a dual pattern footprint for receiving one of two component packages
US5751557A (en) * 1996-06-21 1998-05-12 Ast Research, Inc. Printed circuit board having a triple pattern footprint for receiving one of three component packages
US6407450B1 (en) 1999-07-15 2002-06-18 Altera Corporation Semiconductor package with universal substrate for electrically interfacing with different sized chips that have different logic functions
GB2356287B (en) * 1999-07-15 2004-03-24 Altera Corp Apparatus and method for packaging different sized semiconductor chips on a common substrate
EP1796443A1 (de) * 2005-12-09 2007-06-13 Delphi Technologies, Inc. Kontaktelement und elektrisches Verbindungssystem

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4731066U (de) * 1971-04-20 1972-12-08
US4048438A (en) * 1974-10-23 1977-09-13 Amp Incorporated Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips
JPS55138794U (de) * 1979-03-23 1980-10-03
US4472876A (en) * 1981-08-13 1984-09-25 Minnesota Mining And Manufacturing Company Area-bonding tape
FR2518813A1 (fr) * 1981-12-22 1983-06-24 Socapex Support d'interconnexion d'un boitier de circuit integre sur un circuit imprime et systeme d'interconnexion utilisant un tel support
KR900001273B1 (ko) * 1983-12-23 1990-03-05 후지쑤 가부시끼가이샤 반도체 집적회로 장치

Also Published As

Publication number Publication date
EP0171232A2 (de) 1986-02-12
JPH0325021B2 (de) 1991-04-04
KR860002143A (ko) 1986-03-26
EP0171232B1 (de) 1993-04-07
DE3587244T2 (de) 1993-09-02
KR930002909B1 (ko) 1993-04-15
HK95894A (en) 1994-09-16
EP0171232A3 (en) 1987-12-02
DE3587244D1 (de) 1993-05-13
CA1238959A (en) 1988-07-05
JPS6170743A (ja) 1986-04-11

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