SG11201402191VA - Hipims layering - Google Patents
Hipims layeringInfo
- Publication number
- SG11201402191VA SG11201402191VA SG11201402191VA SG11201402191VA SG11201402191VA SG 11201402191V A SG11201402191V A SG 11201402191VA SG 11201402191V A SG11201402191V A SG 11201402191VA SG 11201402191V A SG11201402191V A SG 11201402191VA SG 11201402191V A SG11201402191V A SG 11201402191VA
- Authority
- SG
- Singapore
- Prior art keywords
- hipims
- layering
- hipims layering
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/345—Applying energy to the substrate during sputtering using substrate bias
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3485—Sputtering using pulsed power to the target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3464—Operating strategies
- H01J37/3467—Pulsed operation, e.g. HIPIMS
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Coating By Spraying Or Casting (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011117994A DE102011117994A1 (de) | 2011-11-09 | 2011-11-09 | HIPIMS-Schichten |
| PCT/EP2012/004498 WO2013068080A1 (fr) | 2011-11-09 | 2012-10-26 | Couches hipims |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201402191VA true SG11201402191VA (en) | 2014-08-28 |
Family
ID=47263219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201402191VA SG11201402191VA (en) | 2011-11-09 | 2012-10-26 | Hipims layering |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US9416441B2 (fr) |
| EP (1) | EP2777061B1 (fr) |
| JP (1) | JP6236613B2 (fr) |
| KR (1) | KR101929085B1 (fr) |
| CN (1) | CN103918054B (fr) |
| AR (1) | AR088700A1 (fr) |
| BR (1) | BR112014011141B1 (fr) |
| CA (1) | CA2854976C (fr) |
| DE (1) | DE102011117994A1 (fr) |
| MX (1) | MX364356B (fr) |
| MY (1) | MY168656A (fr) |
| RU (1) | RU2633672C2 (fr) |
| SG (1) | SG11201402191VA (fr) |
| TR (1) | TR201902881T4 (fr) |
| TW (1) | TWI582258B (fr) |
| WO (1) | WO2013068080A1 (fr) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102274981B1 (ko) * | 2013-06-26 | 2021-07-09 | 오를리콘 서피스 솔루션스 아크티엔게젤샤프트, 페피콘 | 장식적 hipims 경질층 |
| US10626493B2 (en) * | 2014-09-17 | 2020-04-21 | Oerlikon Surface Solutions Ag, Pfäffikon | Method for producing a double-layer coated cutting tool with improved wear resistance |
| EP3018233A1 (fr) | 2014-11-05 | 2016-05-11 | Walter Ag | Outil de coupe doté d'un revêtement en PVD multicouches |
| EP3056587B1 (fr) * | 2015-02-13 | 2020-11-18 | Walter AG | Fraise à queue VHM dotée d'un revêtement en TiAlN-ZrN |
| JP7292695B2 (ja) * | 2016-08-17 | 2023-06-19 | 地方独立行政法人東京都立産業技術研究センター | 機能性薄膜、その製造方法、積層構造体及びその製造方法 |
| EP3650584B1 (fr) * | 2018-11-08 | 2026-01-07 | Walter Ag | Procédé industriel de production d'un outil de coupe revêtu par pvd |
| TWI851279B (zh) | 2019-02-11 | 2024-08-01 | 美商應用材料股份有限公司 | 物理氣相沉積方法 |
| DE102020116157A1 (de) * | 2020-06-18 | 2021-12-23 | Cemecon Ag. | Verfahren und Vorrichtung zum Aufbringen einer Beschichtung sowie beschichteter Körper |
| DE102022003082A1 (de) * | 2022-08-23 | 2024-02-29 | Oerlikon Surface Solutions Ag, Pfäffikon | Beschichtungsverfahren zur Abscheidung eines Schichtsystems auf einem Substrat, sowie ein Substrat mit einem Schichtsystem |
| EP4624622A1 (fr) | 2024-03-28 | 2025-10-01 | Walter Ag | Outil de coupe à couche de tialn |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1580298A1 (fr) * | 2004-03-22 | 2005-09-28 | Materia Nova A.S.B.L | Dépôt par pulverisation cathodique magnétron en régime impulsionnel avec préionisation |
| DE102005033769B4 (de) * | 2005-07-15 | 2009-10-22 | Systec System- Und Anlagentechnik Gmbh & Co.Kg | Verfahren und Vorrichtung zur Mehrkathoden-PVD-Beschichtung und Substrat mit PVD-Beschichtung |
| US9605338B2 (en) * | 2006-10-11 | 2017-03-28 | Oerlikon Surface Solutions Ag, Pfaffikon | Method for depositing electrically insulating layers |
| RU2339735C1 (ru) * | 2007-02-12 | 2008-11-27 | Закрытое акционерное общество "Нано-Плазменные Технологии" (ЗАО "НАНПЛАТЕК") | Способ нанесения пленочного покрытия |
| US7966909B2 (en) * | 2007-07-25 | 2011-06-28 | The Gillette Company | Process of forming a razor blade |
| SE532505C2 (sv) * | 2007-12-12 | 2010-02-09 | Plasmatrix Materials Ab | Förfarande för plasmaaktiverad kemisk ångdeponering och plasmasönderdelningsenhet |
| EP2272080B1 (fr) * | 2008-04-28 | 2012-08-01 | CemeCon AG | Dispositif et procede de pretraitement et de revetement de corps |
| DE102008028140B3 (de) | 2008-06-13 | 2009-12-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung einer transparenten und leitfähigen Metalloxidschicht durch gepulstes, hochionisierendes Magnetronsputtern |
| US20100055826A1 (en) * | 2008-08-26 | 2010-03-04 | General Electric Company | Methods of Fabrication of Solar Cells Using High Power Pulsed Magnetron Sputtering |
| DE202010001497U1 (de) * | 2010-01-29 | 2010-04-22 | Hauzer Techno-Coating B.V. | Beschichtungsvorrichtung mit einer HIPIMS-Leistungsquelle |
-
2011
- 2011-11-09 DE DE102011117994A patent/DE102011117994A1/de not_active Withdrawn
-
2012
- 2012-10-26 US US14/357,003 patent/US9416441B2/en active Active
- 2012-10-26 EP EP12794175.5A patent/EP2777061B1/fr active Active
- 2012-10-26 BR BR112014011141-3A patent/BR112014011141B1/pt active IP Right Grant
- 2012-10-26 WO PCT/EP2012/004498 patent/WO2013068080A1/fr not_active Ceased
- 2012-10-26 CA CA2854976A patent/CA2854976C/fr active Active
- 2012-10-26 JP JP2014540343A patent/JP6236613B2/ja active Active
- 2012-10-26 TR TR2019/02881T patent/TR201902881T4/tr unknown
- 2012-10-26 CN CN201280054937.6A patent/CN103918054B/zh active Active
- 2012-10-26 MX MX2014005722A patent/MX364356B/es active IP Right Grant
- 2012-10-26 SG SG11201402191VA patent/SG11201402191VA/en unknown
- 2012-10-26 KR KR1020147015487A patent/KR101929085B1/ko active Active
- 2012-10-26 MY MYPI2014001366A patent/MY168656A/en unknown
- 2012-10-26 RU RU2014123354A patent/RU2633672C2/ru active
- 2012-11-06 TW TW101141112A patent/TWI582258B/zh active
- 2012-11-08 AR ARP120104202A patent/AR088700A1/es active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| MY168656A (en) | 2018-11-28 |
| RU2014123354A (ru) | 2015-12-20 |
| RU2633672C2 (ru) | 2017-10-16 |
| TW201329271A (zh) | 2013-07-16 |
| JP6236613B2 (ja) | 2017-11-29 |
| TR201902881T4 (tr) | 2019-03-21 |
| KR20140099898A (ko) | 2014-08-13 |
| TWI582258B (zh) | 2017-05-11 |
| MX2014005722A (es) | 2015-03-09 |
| JP2015501876A (ja) | 2015-01-19 |
| CA2854976A1 (fr) | 2013-05-16 |
| KR101929085B1 (ko) | 2018-12-13 |
| BR112014011141A2 (pt) | 2017-05-16 |
| EP2777061B1 (fr) | 2018-12-12 |
| CN103918054B (zh) | 2017-02-15 |
| AR088700A1 (es) | 2014-06-25 |
| WO2013068080A1 (fr) | 2013-05-16 |
| US20140305792A1 (en) | 2014-10-16 |
| EP2777061A1 (fr) | 2014-09-17 |
| DE102011117994A1 (de) | 2013-05-16 |
| CA2854976C (fr) | 2019-07-30 |
| CN103918054A (zh) | 2014-07-09 |
| BR112014011141B1 (pt) | 2021-08-10 |
| US9416441B2 (en) | 2016-08-16 |
| MX364356B (es) | 2019-04-08 |
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