SG11201508564QA - Cleaning liquid composition - Google Patents

Cleaning liquid composition

Info

Publication number
SG11201508564QA
SG11201508564QA SG11201508564QA SG11201508564QA SG11201508564QA SG 11201508564Q A SG11201508564Q A SG 11201508564QA SG 11201508564Q A SG11201508564Q A SG 11201508564QA SG 11201508564Q A SG11201508564Q A SG 11201508564QA SG 11201508564Q A SG11201508564Q A SG 11201508564QA
Authority
SG
Singapore
Prior art keywords
cleaning liquid
liquid composition
composition
cleaning
liquid
Prior art date
Application number
SG11201508564QA
Inventor
Kikue Morita
Chiyoko Horike
Keisuke Fukaya
Takuo Ohwada
Original Assignee
Kanto Kagaku
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51731300&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG11201508564Q(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Kanto Kagaku filed Critical Kanto Kagaku
Publication of SG11201508564QA publication Critical patent/SG11201508564QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/28—Heterocyclic compounds containing nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/08—Liquid soap, e.g. for dispensers; capsuled
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/30—Amines; Substituted amines ; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/36—Organic compounds containing phosphorus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
SG11201508564QA 2013-04-19 2014-04-07 Cleaning liquid composition SG11201508564QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013088637A JP6203525B2 (en) 2013-04-19 2013-04-19 Cleaning liquid composition
PCT/JP2014/060060 WO2014171355A1 (en) 2013-04-19 2014-04-07 Cleaning liquid composition

Publications (1)

Publication Number Publication Date
SG11201508564QA true SG11201508564QA (en) 2015-11-27

Family

ID=51731300

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201508564QA SG11201508564QA (en) 2013-04-19 2014-04-07 Cleaning liquid composition

Country Status (8)

Country Link
US (2) US20160083675A1 (en)
EP (1) EP2988321B1 (en)
JP (1) JP6203525B2 (en)
KR (1) KR102226023B1 (en)
CN (1) CN105122429B (en)
SG (1) SG11201508564QA (en)
TW (1) TWI624541B (en)
WO (1) WO2014171355A1 (en)

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WO2015116818A1 (en) 2014-01-29 2015-08-06 Advanced Technology Materials, Inc. Post chemical mechanical polishing formulations and method of use
TWI726859B (en) * 2015-01-05 2021-05-11 美商恩特葛瑞斯股份有限公司 Post chemical mechanical polishing formulations and method of use
JP6991711B2 (en) * 2016-12-27 2022-01-12 関東化学株式会社 Cleaning liquid composition
WO2018174092A1 (en) * 2017-03-22 2018-09-27 三菱ケミカル株式会社 Washing solution for substrates for semiconductor devices, method for washing substrate for semiconductor devices, method for producing substrate for semiconductor devices, and substrate for semiconductor devices
WO2019044463A1 (en) * 2017-08-31 2019-03-07 富士フイルム株式会社 Processing liquid, kit, and method for cleaning substrate
KR20240167944A (en) * 2018-07-20 2024-11-28 엔테그리스, 아이엔씨. Cleaning composition with corrosion inhibitor
CN112292757B (en) 2018-08-24 2024-03-05 铠侠股份有限公司 Semiconductor device and manufacturing method thereof
JP7220040B2 (en) 2018-09-20 2023-02-09 関東化学株式会社 cleaning liquid composition
EP3950874B1 (en) * 2019-03-27 2024-01-31 Agc Inc. Method for producing gallium oxide substrate
WO2021054009A1 (en) * 2019-09-18 2021-03-25 富士フイルムエレクトロニクスマテリアルズ株式会社 Cleaning method
WO2022163350A1 (en) * 2021-01-29 2022-08-04 富士フイルム株式会社 Composition, and method for cleaning substrate
JP7609683B2 (en) * 2021-03-30 2025-01-07 株式会社フジミインコーポレーテッド Semiconductor substrate manufacturing method and semiconductor substrate obtained by said manufacturing method
JP7811855B2 (en) * 2022-02-02 2026-02-06 関東化学株式会社 Etching solution composition and etching method
KR20250138022A (en) * 2024-03-12 2025-09-19 주식회사 케이씨텍 post metal film chemical mechanical polishing cleaning solution

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US7547669B2 (en) * 1998-07-06 2009-06-16 Ekc Technology, Inc. Remover compositions for dual damascene system
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Also Published As

Publication number Publication date
KR20150144780A (en) 2015-12-28
TW201506152A (en) 2015-02-16
JP2014212262A (en) 2014-11-13
EP2988321A1 (en) 2016-02-24
TWI624541B (en) 2018-05-21
CN105122429B (en) 2019-11-26
CN105122429A (en) 2015-12-02
US20160083675A1 (en) 2016-03-24
WO2014171355A1 (en) 2014-10-23
US20210163856A1 (en) 2021-06-03
KR102226023B1 (en) 2021-03-09
JP6203525B2 (en) 2017-09-27
EP2988321A4 (en) 2016-11-02
EP2988321B1 (en) 2019-03-20

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