SG11201606830WA - Composition and method for polishing glass - Google Patents

Composition and method for polishing glass

Info

Publication number
SG11201606830WA
SG11201606830WA SG11201606830WA SG11201606830WA SG11201606830WA SG 11201606830W A SG11201606830W A SG 11201606830WA SG 11201606830W A SG11201606830W A SG 11201606830WA SG 11201606830W A SG11201606830W A SG 11201606830WA SG 11201606830W A SG11201606830W A SG 11201606830WA
Authority
SG
Singapore
Prior art keywords
composition
polishing glass
polishing
glass
Prior art date
Application number
SG11201606830WA
Inventor
Hon Wu Lau
Haresh Siriwardane
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of SG11201606830WA publication Critical patent/SG11201606830WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG11201606830WA 2014-03-14 2014-03-14 Composition and method for polishing glass SG11201606830WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/029518 WO2015137982A1 (en) 2014-03-14 2014-03-14 Composition and method for polishing glass

Publications (1)

Publication Number Publication Date
SG11201606830WA true SG11201606830WA (en) 2016-09-29

Family

ID=54072240

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201606830WA SG11201606830WA (en) 2014-03-14 2014-03-14 Composition and method for polishing glass

Country Status (2)

Country Link
SG (1) SG11201606830WA (en)
WO (1) WO2015137982A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6821897B2 (en) * 2001-12-05 2004-11-23 Cabot Microelectronics Corporation Method for copper CMP using polymeric complexing agents
US6776810B1 (en) * 2002-02-11 2004-08-17 Cabot Microelectronics Corporation Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
KR100832993B1 (en) * 2006-04-14 2008-05-27 주식회사 엘지화학 Adjuvant for CPM Slurry
TW201038690A (en) * 2008-09-26 2010-11-01 Rhodia Operations Abrasive compositions for chemical mechanical polishing and methods for using same
WO2012103091A2 (en) * 2011-01-24 2012-08-02 Clarkson University Abrasive free silicon chemical mechanical planarization

Also Published As

Publication number Publication date
WO2015137982A1 (en) 2015-09-17

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