SG11202001663XA - Method and apparatus for cleaning semiconductor wafer - Google Patents

Method and apparatus for cleaning semiconductor wafer

Info

Publication number
SG11202001663XA
SG11202001663XA SG11202001663XA SG11202001663XA SG11202001663XA SG 11202001663X A SG11202001663X A SG 11202001663XA SG 11202001663X A SG11202001663X A SG 11202001663XA SG 11202001663X A SG11202001663X A SG 11202001663XA SG 11202001663X A SG11202001663X A SG 11202001663XA
Authority
SG
Singapore
Prior art keywords
semiconductor wafer
cleaning semiconductor
cleaning
wafer
semiconductor
Prior art date
Application number
SG11202001663XA
Other languages
English (en)
Inventor
Hui Wang
Xi Wang
Fuping Chen
Original Assignee
Acm Research Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Research Shanghai Inc filed Critical Acm Research Shanghai Inc
Publication of SG11202001663XA publication Critical patent/SG11202001663XA/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/80—Cleaning only by supercritical fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3312—Vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2240/00—Type of materials or objects being cleaned
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
SG11202001663XA 2017-09-08 2017-09-08 Method and apparatus for cleaning semiconductor wafer SG11202001663XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/100983 WO2019047140A1 (en) 2017-09-08 2017-09-08 METHOD AND APPARATUS FOR CLEANING A SEMICONDUCTOR WAFER

Publications (1)

Publication Number Publication Date
SG11202001663XA true SG11202001663XA (en) 2020-03-30

Family

ID=65634707

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202001663XA SG11202001663XA (en) 2017-09-08 2017-09-08 Method and apparatus for cleaning semiconductor wafer

Country Status (6)

Country Link
US (2) US11335550B2 (ko)
JP (1) JP7055467B2 (ko)
KR (1) KR102414340B1 (ko)
CN (1) CN111095512B (ko)
SG (1) SG11202001663XA (ko)
WO (1) WO2019047140A1 (ko)

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US11682567B2 (en) 2020-06-30 2023-06-20 Applied Materials, Inc. Cleaning system with in-line SPM processing
JP7583651B2 (ja) * 2021-03-11 2024-11-14 キオクシア株式会社 基板洗浄装置および基板洗浄方法
CN113695308B (zh) * 2021-07-20 2023-01-13 山东力冠微电子装备有限公司 一种半导体晶圆前处理系统
EP4300556A1 (de) * 2022-06-27 2024-01-03 Siltronic AG Abdeckung für ein reinigungsmodul zum reinigen einer halbleiterscheibe und verfahren zum reinigen einer halbleiterscheibe in einer reinigungsstrasse
CN117457571B (zh) * 2023-11-16 2024-04-19 江苏星辉半导体有限公司 一种半导体电器元件晶圆加工酸洗装置
CN119076509B (zh) * 2024-11-08 2025-04-08 青岛华芯晶电科技有限公司 一种晶圆清洁装置及清洁方法

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Also Published As

Publication number Publication date
CN111095512B (zh) 2024-01-26
JP2020533789A (ja) 2020-11-19
KR20200047597A (ko) 2020-05-07
JP7055467B2 (ja) 2022-04-18
US20210166933A1 (en) 2021-06-03
US11955328B2 (en) 2024-04-09
US20220246420A1 (en) 2022-08-04
US11335550B2 (en) 2022-05-17
KR102414340B1 (ko) 2022-06-29
CN111095512A (zh) 2020-05-01
WO2019047140A1 (en) 2019-03-14

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