SG112971A1 - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method

Info

Publication number
SG112971A1
SG112971A1 SG200407392A SG200407392A SG112971A1 SG 112971 A1 SG112971 A1 SG 112971A1 SG 200407392 A SG200407392 A SG 200407392A SG 200407392 A SG200407392 A SG 200407392A SG 112971 A1 SG112971 A1 SG 112971A1
Authority
SG
Singapore
Prior art keywords
device manufacturing
lithographic apparatus
lithographic
manufacturing
Prior art date
Application number
SG200407392A
Other languages
English (en)
Inventor
Wilhelmus Josephus Box
Hendrik Jan Eggink
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG112971A1 publication Critical patent/SG112971A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG200407392A 2003-12-22 2004-12-15 Lithographic apparatus and device manufacturing method SG112971A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/740,832 US7489388B2 (en) 2003-12-22 2003-12-22 Lithographic apparatus and device manufacturing method

Publications (1)

Publication Number Publication Date
SG112971A1 true SG112971A1 (en) 2005-07-28

Family

ID=34552799

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200407392A SG112971A1 (en) 2003-12-22 2004-12-15 Lithographic apparatus and device manufacturing method

Country Status (8)

Country Link
US (1) US7489388B2 (de)
EP (1) EP1548503B1 (de)
JP (1) JP4628087B2 (de)
KR (1) KR100700368B1 (de)
CN (1) CN1637616A (de)
DE (1) DE602004017411D1 (de)
SG (1) SG112971A1 (de)
TW (1) TWI253674B (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4429023B2 (ja) * 2004-01-07 2010-03-10 キヤノン株式会社 露光装置及びデバイス製造方法
US7548303B2 (en) * 2004-09-04 2009-06-16 Nikon Corporation Cooling assembly for a stage
JP4784860B2 (ja) * 2006-01-31 2011-10-05 株式会社ニコン 処理装置及び処理方法、並びに露光装置
US8760621B2 (en) * 2007-03-12 2014-06-24 Asml Netherlands B.V. Lithographic apparatus and method
JP5164589B2 (ja) * 2008-01-30 2013-03-21 株式会社日立ハイテクノロジーズ インプリント装置
NL2003528A (en) * 2008-10-23 2010-04-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US10054754B2 (en) * 2009-02-04 2018-08-21 Nikon Corporation Thermal regulation of vibration-sensitive objects with conduit circuit having liquid metal, pump, and heat exchanger
NL2004242A (en) * 2009-04-13 2010-10-14 Asml Netherlands Bv Detector module, cooling arrangement and lithographic apparatus comprising a detector module.
KR101866719B1 (ko) 2010-12-20 2018-06-11 에베 그룹 에. 탈너 게엠베하 웨이퍼의 장착을 위한 수용 수단
DE102013201803A1 (de) * 2013-02-05 2014-02-27 Carl Zeiss Smt Gmbh Strahlungskühler und verfahren zur steuerung und regelung hierfür
DE102013201805A1 (de) * 2013-02-05 2013-11-28 Carl Zeiss Smt Gmbh Lithographieanlage mit kühlvorrichtung
US10054495B2 (en) 2013-07-02 2018-08-21 Exergen Corporation Infrared contrasting color temperature measurement system
WO2020051576A1 (en) * 2018-09-07 2020-03-12 Balma Jacob A Fine-grain dynamic solid-state cooling system
US11448955B2 (en) * 2018-09-27 2022-09-20 Taiwan Semiconductor Manufacturing Co., Ltd. Mask for lithography process and method for manufacturing the same
US12435931B2 (en) 2022-01-13 2025-10-07 Maxwell Labs Inc. Radiative heatsink
KR102899336B1 (ko) * 2023-08-18 2025-12-16 주식회사 애플티 웨이퍼 에지 노광장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69118315T2 (de) * 1990-11-01 1996-08-14 Canon Kk Waferhaltebefestigung für Belichtungsgerät
JP3173928B2 (ja) * 1992-09-25 2001-06-04 キヤノン株式会社 基板保持装置、基板保持方法および露光装置
JP3814359B2 (ja) 1996-03-12 2006-08-30 キヤノン株式会社 Ｘ線投影露光装置及びデバイス製造方法
JP3661291B2 (ja) * 1996-08-01 2005-06-15 株式会社ニコン 露光装置
EP1052548B1 (de) 1999-04-21 2005-06-08 ASML Netherlands B.V. Lithographischer Projektionsapparat
JP4745556B2 (ja) * 2001-08-20 2011-08-10 キヤノン株式会社 位置決め装置、露光装置、及びデバイス製造方法
JP2003068626A (ja) 2001-08-29 2003-03-07 Canon Inc 露光装置内ユニットの輻射冷却方法及び輻射冷却装置
US6677167B2 (en) * 2002-03-04 2004-01-13 Hitachi High-Technologies Corporation Wafer processing apparatus and a wafer stage and a wafer processing method
US7105836B2 (en) 2002-10-18 2006-09-12 Asml Holding N.V. Method and apparatus for cooling a reticle during lithographic exposure
JP4458333B2 (ja) 2003-02-13 2010-04-28 キヤノン株式会社 露光装置、およびデバイスの製造方法

Also Published As

Publication number Publication date
EP1548503B1 (de) 2008-10-29
US20050134827A1 (en) 2005-06-23
TW200527499A (en) 2005-08-16
EP1548503A2 (de) 2005-06-29
JP2005184000A (ja) 2005-07-07
TWI253674B (en) 2006-04-21
EP1548503A3 (de) 2006-10-04
CN1637616A (zh) 2005-07-13
KR20050063730A (ko) 2005-06-28
DE602004017411D1 (de) 2008-12-11
JP4628087B2 (ja) 2011-02-09
KR100700368B1 (ko) 2007-03-27
US7489388B2 (en) 2009-02-10

Similar Documents

Publication Publication Date Title
TWI347741B (en) Lithographic apparatus and device manufacturing method
SG118281A1 (en) Lithographic apparatus and device manufacturing method
SG109610A1 (en) Lithographic apparatus and device manufacturing method
SG118282A1 (en) Lithographic apparatus and device manufacturing method
SG109000A1 (en) Lithographic apparatus and device manufacturing method
SG109609A1 (en) Lithographic apparatus and device manufacturing method
SG109608A1 (en) Lithographic apparatus and device manufacturing method
SG108997A1 (en) Lithographic apparatus and device manufacturing method
SG112968A1 (en) Lithographic apparatus and device manufacturing method
SG111309A1 (en) Lithographic apparatus and device manufacturing method
SG2010050110A (en) Lithographic apparatus and device manufacturing method
SG121819A1 (en) Lithographic apparatus and device manufacturing method
SG121820A1 (en) Lithographic apparatus and device manufacturing method
SG130007A1 (en) Lithographic apparatus and device manufacturing method
SG121829A1 (en) Lithographic apparatus and device manufacturing method
SG108317A1 (en) Lithographic apparatus and device manufacturing method
SG112064A1 (en) Lithographic apparatus and device manufacturing method
SG110196A1 (en) Lithographic apparatus and device manufacturing method
SG116555A1 (en) Lithographic apparatus and device manufacturing method.
SG106138A1 (en) Lithographic apparatus and device manufacturing method
SG127713A1 (en) Lithographic apparatus and device manufacturing method
SG111313A1 (en) Lithographic apparatus and device manufacturing method
SG121780A1 (en) Lithographic apparatus and device manufacturing method
SG112954A1 (en) Lithographic apparatus and device manufacturing method
SG111314A1 (en) Lithographic apparatus and device manufacturing method