SG119193A1 - Apparatus for processing wafers - Google Patents

Apparatus for processing wafers

Info

Publication number
SG119193A1
SG119193A1 SG200304037A SG200304037A SG119193A1 SG 119193 A1 SG119193 A1 SG 119193A1 SG 200304037 A SG200304037 A SG 200304037A SG 200304037 A SG200304037 A SG 200304037A SG 119193 A1 SG119193 A1 SG 119193A1
Authority
SG
Singapore
Prior art keywords
wafer
transporter
wafer processing
processing modules
coupled
Prior art date
Application number
SG200304037A
Other languages
English (en)
Inventor
Jae Heon Park
Original Assignee
Silicon Valley Group
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silicon Valley Group filed Critical Silicon Valley Group
Publication of SG119193A1 publication Critical patent/SG119193A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
SG200304037A 1998-12-30 1999-12-02 Apparatus for processing wafers SG119193A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/223,111 US6616394B1 (en) 1998-12-30 1998-12-30 Apparatus for processing wafers

Publications (1)

Publication Number Publication Date
SG119193A1 true SG119193A1 (en) 2006-02-28

Family

ID=22835091

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200304037A SG119193A1 (en) 1998-12-30 1999-12-02 Apparatus for processing wafers

Country Status (9)

Country Link
US (2) US6616394B1 (de)
EP (1) EP1142002B1 (de)
JP (3) JP4384817B2 (de)
KR (1) KR100567857B1 (de)
AT (1) ATE308798T1 (de)
AU (1) AU1933900A (de)
DE (1) DE69928126T2 (de)
SG (1) SG119193A1 (de)
WO (1) WO2000041222A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6616394B1 (en) * 1998-12-30 2003-09-09 Silicon Valley Group Apparatus for processing wafers
DE10143722C2 (de) * 2001-08-31 2003-07-03 Infineon Technologies Ag Verfahren und Vorrichtung zur Sortierung von Wafern
US7059817B2 (en) * 2001-11-29 2006-06-13 Axcelis Technologies, Inc. Wafer handling apparatus and method
US7022436B2 (en) 2003-01-14 2006-04-04 Asml Netherlands B.V. Embedded etch stop for phase shift masks and planar phase shift masks to reduce topography induced and wave guide effects
JP2004257980A (ja) * 2003-02-27 2004-09-16 Mire Kk 半導体素子テスト用ハンドラ
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7396412B2 (en) 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
KR100621775B1 (ko) * 2005-04-15 2006-09-15 삼성전자주식회사 기판 세정장치
US7489982B2 (en) * 2006-09-15 2009-02-10 Wafertech, Llc Method and software for conducting efficient lithography WPH / lost time analysis in semiconductor manufacturing
US7738987B2 (en) * 2006-11-28 2010-06-15 Tokyo Electron Limited Device and method for controlling substrate processing apparatus
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
US20080292433A1 (en) * 2007-05-11 2008-11-27 Bachrach Robert Z Batch equipment robots and methods of array to array work-piece transfer for photovoltaic factory
US20080279672A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods of stack to array work-piece transfer for photovoltaic factory
US20080279658A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory
US8322300B2 (en) * 2008-02-07 2012-12-04 Sunpower Corporation Edge coating apparatus with movable roller applicator for solar cell substrates
US8795032B2 (en) * 2008-06-04 2014-08-05 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US8535968B1 (en) * 2011-01-31 2013-09-17 Miasole High speed aligning of photovoltaic cells
US9606532B2 (en) * 2014-01-29 2017-03-28 Taiwan Semiconductor Manufacturing Company Limited Method and manufacturing system

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1009462A (en) * 1963-03-05 1965-11-10 Short Brothers & Harland Ltd Improvements in apparatus for classifying and otherwise handling articles
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
US5177514A (en) 1988-02-12 1993-01-05 Tokyo Electron Limited Apparatus for coating a photo-resist film and/or developing it after being exposed
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
KR970003907B1 (ko) 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 기판처리 장치 및 기판처리 방법
US5061144A (en) 1988-11-30 1991-10-29 Tokyo Electron Limited Resist process apparatus
JP2849458B2 (ja) * 1990-07-03 1999-01-20 キヤノン株式会社 半導体装置の製造方法および製造装置
NL9200446A (nl) 1992-03-10 1993-10-01 Tempress B V Inrichting voor het behandelen van microschakeling-schijven (wafers).
US5766824A (en) 1993-07-16 1998-06-16 Semiconductor Systems, Inc. Method and apparatus for curing photoresist
EP0634699A1 (de) 1993-07-16 1995-01-18 Semiconductor Systems, Inc. Gruppiertes fotolithografisches System
US5626675A (en) 1993-11-18 1997-05-06 Tokyo Electron Limited Resist processing apparatus, substrate processing apparatus and method of transferring a processed article
JPH07245285A (ja) 1994-03-03 1995-09-19 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH07297258A (ja) 1994-04-26 1995-11-10 Tokyo Electron Ltd 板状体の搬送装置
US5826129A (en) 1994-06-30 1998-10-20 Tokyo Electron Limited Substrate processing system
JP3213748B2 (ja) * 1994-08-04 2001-10-02 東京エレクトロン株式会社 処理システム
JP3033009B2 (ja) 1994-09-09 2000-04-17 東京エレクトロン株式会社 処理装置
JP3592771B2 (ja) * 1994-12-07 2004-11-24 大日本スクリーン製造株式会社 基板処理装置
TW297910B (de) 1995-02-02 1997-02-11 Tokyo Electron Co Ltd
JP3069945B2 (ja) 1995-07-28 2000-07-24 東京エレクトロン株式会社 処理装置
US5788868A (en) 1995-09-04 1998-08-04 Dainippon Screen Mfg. Co., Ltd. Substrate transfer method and interface apparatus
TW317644B (de) 1996-01-26 1997-10-11 Tokyo Electron Co Ltd
JP3571471B2 (ja) 1996-09-03 2004-09-29 東京エレクトロン株式会社 処理方法，塗布現像処理システム及び処理システム
JP3779393B2 (ja) * 1996-09-06 2006-05-24 東京エレクトロン株式会社 処理システム
TW353772B (en) 1996-09-09 1999-03-01 Tokyo Electron Ltd Workpiece relaying apparatus
US5928389A (en) 1996-10-21 1999-07-27 Applied Materials, Inc. Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
TW466579B (en) 1996-11-01 2001-12-01 Tokyo Electron Ltd Method and apparatus for processing substrate
TW353777B (en) 1996-11-08 1999-03-01 Tokyo Electron Ltd Treatment device
JPH10144599A (ja) 1996-11-11 1998-05-29 Tokyo Electron Ltd 回転処理装置およびその洗浄方法
JP3579228B2 (ja) 1997-01-24 2004-10-20 大日本スクリーン製造株式会社 基板処理装置
SG71082A1 (en) 1997-01-30 2000-03-21 Tokyo Electron Ltd Method and apparatus for coating resist and developing the coated resist
JPH10261692A (ja) * 1997-03-19 1998-09-29 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4080021B2 (ja) * 1997-03-19 2008-04-23 大日本スクリーン製造株式会社 基板処理装置
JP3600710B2 (ja) * 1997-05-28 2004-12-15 大日本スクリーン製造株式会社 基板処理装置
JPH113851A (ja) 1997-06-11 1999-01-06 Tokyo Electron Ltd 液処理装置及び液処理方法
US6616394B1 (en) * 1998-12-30 2003-09-09 Silicon Valley Group Apparatus for processing wafers

Also Published As

Publication number Publication date
WO2000041222A1 (en) 2000-07-13
JP2007088487A (ja) 2007-04-05
KR20010103544A (ko) 2001-11-23
JP2002534802A (ja) 2002-10-15
US20040107014A1 (en) 2004-06-03
US6616394B1 (en) 2003-09-09
JP4384817B2 (ja) 2009-12-16
EP1142002B1 (de) 2005-11-02
AU1933900A (en) 2000-07-24
US7004708B2 (en) 2006-02-28
ATE308798T1 (de) 2005-11-15
DE69928126D1 (de) 2005-12-08
JP2008022023A (ja) 2008-01-31
EP1142002A1 (de) 2001-10-10
KR100567857B1 (ko) 2006-04-05
JP4823012B2 (ja) 2011-11-24
DE69928126T2 (de) 2006-07-13

Similar Documents

Publication Publication Date Title
AU1933900A (en) Apparatus for processing wafers
TW352453B (en) Method and apparatus for priority based scheduling of wafer processing with a multiple chamber semiconductor wafer processing tool
CA2283185A1 (en) Assay device processing instrument
DE60024424D1 (de) Halbleiter-wafer etwicklungsgerät mit vertikal gestapelteentwicklungsraüme und einachsiges dual-wafer transfer system
TW333518B (en) Apparatus and method for transferring objects, apparatus for receiving articles, apparatus for transferring semiconductor wafers and apparatus for processing semiconductor wafers
TW376376B (en) A system and method for processing semiconductor wafers and a stored program for controlling such a system
GB2354844A (en) Distributed control system for a semiconductor wafer processing machine
SG53015A1 (en) Shop-floor dispatching system based on voting scheme for semiconductor wafer fabrication
EP1898447A3 (de) Produktionsanlage für Halbleiterbauelemente
TW368678B (en) Method for controlling process conditions of a semiconductor fabricating equipments management system
EP0377464A3 (de) Plättchenbehandlungssystem
GB2343672B (en) Wafer Handler and Multi-Station Processing System and Method for Handling Wafers
TW283783B (en) Semiconductor processing systems
EP0798762A3 (de) Automatisiertes Halbleiter-Behandlungsverfahren
WO2003070610A3 (en) Local store for a wafer processing station
FI935854L (fi) Puolijohteen, kuten piikiekon, prosessoinnissa käytettävä laitteisto ja menetelmä
AU5537098A (en) Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
AU4652993A (en) Transport system for wafer processing line
WO1998027650A3 (en) Method and apparatus for n choose m device selection
TW362255B (en) Compact apparatus and method for storing and loading semiconductor wafer carriers
AU5290098A (en) Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
CA2376736A1 (fr) Machine de traitement d'objets
WO2000068971A3 (de) Anlage zur bearbeitung von wafern
AU2002365591A1 (en) Wafer handling apparatus and method
US6328768B1 (en) Semiconductor device manufacturing line