SG120071A1 - A mold - Google Patents

A mold

Info

Publication number
SG120071A1
SG120071A1 SG200204123A SG200204123A SG120071A1 SG 120071 A1 SG120071 A1 SG 120071A1 SG 200204123 A SG200204123 A SG 200204123A SG 200204123 A SG200204123 A SG 200204123A SG 120071 A1 SG120071 A1 SG 120071A1
Authority
SG
Singapore
Prior art keywords
mold
Prior art date
Application number
SG200204123A
Other languages
English (en)
Inventor
Shu Chuen Ho
Teng Hock Kuah
Man Ho Hui
Srikanth Narasimalu
Murali Sarangapani
Original Assignee
Asm Tech Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Tech Singapore Pte Ltd filed Critical Asm Tech Singapore Pte Ltd
Publication of SG120071A1 publication Critical patent/SG120071A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
SG200204123A 2001-07-09 2002-07-05 A mold SG120071A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/901,517 US6860731B2 (en) 2001-07-09 2001-07-09 Mold for encapsulating a semiconductor chip

Publications (1)

Publication Number Publication Date
SG120071A1 true SG120071A1 (en) 2006-03-28

Family

ID=25414343

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200204123A SG120071A1 (en) 2001-07-09 2002-07-05 A mold

Country Status (5)

Country Link
US (1) US6860731B2 (fr)
EP (1) EP1276143A3 (fr)
MY (1) MY129198A (fr)
SG (1) SG120071A1 (fr)
TW (1) TWI251287B (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7322287B2 (en) * 2000-07-18 2008-01-29 Nanonex Corporation Apparatus for fluid pressure imprint lithography
NL1019042C2 (nl) * 2001-09-26 2003-03-27 Europ Semiconductor Assembly E Werkwijze voor het inkapselen van een chip en/of ander voorwerp.
US6817854B2 (en) * 2002-05-20 2004-11-16 Stmicroelectronics, Inc. Mold with compensating base
US7641468B2 (en) * 2004-09-01 2010-01-05 Hewlett-Packard Development Company, L.P. Imprint lithography apparatus and method employing an effective pressure
JP5254616B2 (ja) * 2004-09-13 2013-08-07 クロノ セラピューティクス、インコーポレイテッド 生物学的同調性（ｂｉｏｓｙｎｃｈｒｏｎｏｕｓ）経皮的薬物送達
WO2007074352A1 (fr) * 2005-12-29 2007-07-05 Infineon Technologies Ag Composant électronique et procédé de fabrication d’un composant électronique
US9219051B2 (en) * 2013-06-05 2015-12-22 Globalfoundries Inc. Laminate peripheral clamping to control microelectronic module BSM warpage
US9305894B2 (en) 2013-06-05 2016-04-05 Globalfoundries Inc. Constrained die adhesion cure process
EP3207562B1 (fr) 2014-10-13 2019-08-28 Lumileds Holding B.V. Boîtier moulé et son procédé de fabrication

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5253663A (en) * 1975-10-29 1977-04-30 Hitachi Ltd Resin sealing mold
US4697784A (en) * 1985-05-15 1987-10-06 Texas Instruments Incorporated Injection mold for producing the housings of integrated circuits
US5059105A (en) * 1989-10-23 1991-10-22 Motorola, Inc. Resilient mold assembly
JP2705361B2 (ja) * 1991-05-30 1998-01-28 三菱電機株式会社 中空型樹脂封止半導体圧力センサ製造用金型
JPH07183317A (ja) * 1993-12-22 1995-07-21 Matsushita Electric Ind Co Ltd 電子部品の製造装置及び製造方法
KR970005706B1 (ko) * 1994-01-24 1997-04-19 금성일렉트론 주식회사 고체촬상소자 및 그 제조방법
SE514116C2 (sv) * 1994-10-19 2001-01-08 Ericsson Telefon Ab L M Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform
NL9500238A (nl) * 1995-02-09 1996-09-02 Fico Bv Omhulinrichting met compensatie-element.
JPH09304211A (ja) * 1996-05-15 1997-11-28 Omron Corp 静電容量型圧力センサのパッケージング構造およびパッケージング方法
NL1003315C2 (nl) * 1996-06-11 1997-12-17 Europ Semiconductor Assembly E Werkwijze voor het inkapselen van een geïntegreerde halfgeleiderschake- ling.
US5997798A (en) * 1997-06-27 1999-12-07 International Business Machines Corporation Biasing mold for integrated circuit chip assembly encapsulation
JP2000334760A (ja) * 1999-05-28 2000-12-05 Kumamoto Nippon Denki Kk 樹脂成形用の金型装置及びこれを備えた樹脂成形装置
EP1220309A1 (fr) * 2000-12-28 2002-07-03 STMicroelectronics S.r.l. Procédé de fabrication d'un empaquetage pour dispositif électronique

Also Published As

Publication number Publication date
TWI251287B (en) 2006-03-11
US6860731B2 (en) 2005-03-01
EP1276143A2 (fr) 2003-01-15
EP1276143A3 (fr) 2006-04-05
MY129198A (en) 2007-03-30
US20030006529A1 (en) 2003-01-09

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