SG143189A1 - Carrier ring for carrier head - Google Patents

Carrier ring for carrier head

Info

Publication number
SG143189A1
SG143189A1 SG200717954-2A SG2007179542A SG143189A1 SG 143189 A1 SG143189 A1 SG 143189A1 SG 2007179542 A SG2007179542 A SG 2007179542A SG 143189 A1 SG143189 A1 SG 143189A1
Authority
SG
Singapore
Prior art keywords
carrier
ring
head
carrier ring
annular
Prior art date
Application number
SG200717954-2A
Other languages
English (en)
Inventor
Steven M Zuniga
Andrew J Nagengast
Jeonghoon Oh
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG143189A1 publication Critical patent/SG143189A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG200717954-2A 2006-11-22 2007-11-21 Carrier ring for carrier head SG143189A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US86709006P 2006-11-22 2006-11-22
US89170507P 2007-02-26 2007-02-26
US11/741,677 US7699688B2 (en) 2006-11-22 2007-04-27 Carrier ring for carrier head

Publications (1)

Publication Number Publication Date
SG143189A1 true SG143189A1 (en) 2008-06-27

Family

ID=38982669

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200717954-2A SG143189A1 (en) 2006-11-22 2007-11-21 Carrier ring for carrier head

Country Status (7)

Country Link
US (2) US7699688B2 (de)
EP (1) EP1925400B1 (de)
JP (1) JP5324775B2 (de)
KR (1) KR100942624B1 (de)
CN (1) CN101293333B (de)
SG (1) SG143189A1 (de)
TW (2) TWI430870B (de)

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CN101934491B (zh) * 2004-11-01 2012-07-25 株式会社荏原制作所 抛光设备
US7699688B2 (en) * 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
US7727055B2 (en) * 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
CN103252711B (zh) * 2008-03-25 2016-06-29 应用材料公司 改良的承载头薄膜
US7749052B2 (en) * 2008-09-08 2010-07-06 Applied Materials, Inc. Carrier head using flexure restraints for retaining ring alignment
US8475231B2 (en) 2008-12-12 2013-07-02 Applied Materials, Inc. Carrier head membrane
JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
CN103252715B (zh) * 2010-08-06 2016-06-22 应用材料公司 内扣环和外扣环
USD711330S1 (en) 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
CN102172886B (zh) * 2011-02-16 2013-01-16 清华大学 抛光头
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US10052739B2 (en) * 2011-09-12 2018-08-21 Applied Materials, Inc. Carrier head with composite plastic portions
US9017138B2 (en) 2012-01-25 2015-04-28 Applied Materials, Inc. Retaining ring monitoring and control of pressure
US9050700B2 (en) * 2012-01-27 2015-06-09 Applied Materials, Inc. Methods and apparatus for an improved polishing head retaining ring
WO2013134075A1 (en) 2012-03-08 2013-09-12 Applied Materials, Inc. Detecting membrane breakage in a carrier head
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US10532441B2 (en) 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
US9381613B2 (en) 2013-03-13 2016-07-05 Applied Materials, Inc. Reinforcement ring for carrier head
US20140273756A1 (en) * 2013-03-14 2014-09-18 Chih Hung Chen Substrate precession mechanism for cmp polishing head
KR102173323B1 (ko) * 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
US10252397B2 (en) * 2014-10-30 2019-04-09 Applied Materials, Inc. Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
JP6392193B2 (ja) * 2015-10-14 2018-09-19 株式会社荏原製作所 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法
US10029346B2 (en) * 2015-10-16 2018-07-24 Applied Materials, Inc. External clamp ring for a chemical mechanical polishing carrier head
US10160091B2 (en) * 2015-11-16 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. CMP polishing head design for improving removal rate uniformity
JP6833591B2 (ja) * 2016-10-28 2021-02-24 株式会社荏原製作所 基板保持装置、弾性膜、研磨装置、および弾性膜の交換方法
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
CN108573887B (zh) * 2017-03-09 2021-02-09 台湾积体电路制造股份有限公司 支撑载具、泄漏测试系统与方法
CN107457686A (zh) * 2017-08-31 2017-12-12 覃幼洁 一种能减小夹紧变形的缸套珩磨夹具
CN107378745A (zh) * 2017-08-31 2017-11-24 覃幼洁 一种能够减小夹紧变形的薄壁缸套珩磨夹具
TWI783037B (zh) 2017-09-25 2022-11-11 美商應用材料股份有限公司 使用機器學習方式以產生製程控制參數的半導體製造
TWI794293B (zh) 2017-09-25 2023-03-01 美商應用材料股份有限公司 使用製程控制參數矩陣的半導體製造
JP7074606B2 (ja) * 2018-08-02 2022-05-24 株式会社荏原製作所 基板を保持するためのトップリングおよび基板処理装置
KR102637832B1 (ko) * 2018-11-09 2024-02-19 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
US11989492B2 (en) 2018-12-26 2024-05-21 Applied Materials, Inc. Preston matrix generator
CN110076694A (zh) * 2019-05-20 2019-08-02 江苏欣颍新材料科技有限公司 一种台球生产用的抛光装置
US11945073B2 (en) * 2019-08-22 2024-04-02 Applied Materials, Inc. Dual membrane carrier head for chemical mechanical polishing
CN111482893A (zh) * 2020-04-16 2020-08-04 华海清科股份有限公司 一种化学机械抛光保持环和化学机械抛光承载头
WO2022010687A1 (en) * 2020-07-08 2022-01-13 Applied Materials, Inc. Multi-toothed, magnetically controlled retaining ring
EP4301549A4 (de) 2021-03-05 2025-02-26 Applied Materials, Inc. Steuerung von verarbeitungsparametern während des polierens eines substrats unter verwendung einer kostenfunktion oder erwarteten zukünftigen parameteränderungen
US11931853B2 (en) 2021-03-05 2024-03-19 Applied Materials, Inc. Control of processing parameters for substrate polishing with angularly distributed zones using cost function
US20230023915A1 (en) * 2021-07-21 2023-01-26 Applied Materials, Inc. Interlocked stepped retaining ring
TWI791305B (zh) * 2021-10-18 2023-02-01 尚源股份有限公司 晶圓研磨嵌合結構
US20230356354A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Compliant inner ring for a chemical mechanical polishing system
US12539577B2 (en) 2022-10-03 2026-02-03 Applied Materials, Inc. System and method for detecting a membrane failure in a chemical mechanical polishing system

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Also Published As

Publication number Publication date
TW201414572A (zh) 2014-04-16
US20080119119A1 (en) 2008-05-22
KR20080046555A (ko) 2008-05-27
CN101293333A (zh) 2008-10-29
CN101293333B (zh) 2010-12-08
TWI430870B (zh) 2014-03-21
US7699688B2 (en) 2010-04-20
EP1925400B1 (de) 2012-06-06
TWI554360B (zh) 2016-10-21
JP2008131049A (ja) 2008-06-05
KR100942624B1 (ko) 2010-02-17
TW200833463A (en) 2008-08-16
EP1925400A1 (de) 2008-05-28
JP5324775B2 (ja) 2013-10-23
US7901273B2 (en) 2011-03-08
US20100151777A1 (en) 2010-06-17

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