SG148140A1 - Organometallic compounds - Google Patents

Organometallic compounds

Info

Publication number
SG148140A1
SG148140A1 SG200804267-3A SG2008042673A SG148140A1 SG 148140 A1 SG148140 A1 SG 148140A1 SG 2008042673 A SG2008042673 A SG 2008042673A SG 148140 A1 SG148140 A1 SG 148140A1
Authority
SG
Singapore
Prior art keywords
organometallic compounds
compounds
vapor deposition
deposition precursors
heteroleptic
Prior art date
Application number
SG200804267-3A
Other languages
English (en)
Inventor
Deodatta Vinayak Shenai Khatkhate
Huazhi Li
Qing Min Wang
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of SG148140A1 publication Critical patent/SG148140A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/405Oxides of refractory metals or yttrium

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Formation Of Insulating Films (AREA)
SG200804267-3A 2007-06-05 2008-06-05 Organometallic compounds SG148140A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US93328207P 2007-06-05 2007-06-05

Publications (1)

Publication Number Publication Date
SG148140A1 true SG148140A1 (en) 2008-12-31

Family

ID=39832419

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200804267-3A SG148140A1 (en) 2007-06-05 2008-06-05 Organometallic compounds

Country Status (7)

Country Link
US (1) US8012536B2 (de)
EP (1) EP2000561B1 (de)
JP (1) JP5437594B2 (de)
KR (1) KR101504939B1 (de)
CN (1) CN101348900B (de)
SG (1) SG148140A1 (de)
TW (1) TWI398541B (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007106788A2 (en) 2006-03-10 2007-09-20 Advanced Technology Materials, Inc. Precursor compositions for atomic layer deposition and chemical vapor deposition of titanate, lanthanate, and tantalate dielectric films
KR101629965B1 (ko) * 2007-04-09 2016-06-13 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 구리 배선용 코발트 질화물층 및 이의 제조방법
US8455049B2 (en) 2007-08-08 2013-06-04 Advanced Technology Materials, Inc. Strontium precursor for use in chemical vapor deposition, atomic layer deposition and rapid vapor deposition
US20120156373A1 (en) 2008-06-05 2012-06-21 American Air Liquide, Inc. Preparation of cerium-containing precursors and deposition of cerium-containing films
KR101711356B1 (ko) 2008-06-05 2017-02-28 레르 리키드 쏘시에떼 아노님 뿌르 레드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 란탄족 함유 전구체의 제조 및 란탄족 함유 필름의 증착 방법
TW201014926A (en) * 2008-10-15 2010-04-16 Nat Univ Tsing Hua Method for producing metallic oxide film having high dielectric constant
US8697486B2 (en) * 2009-04-15 2014-04-15 Micro Technology, Inc. Methods of forming phase change materials and methods of forming phase change memory circuitry
US20100290968A1 (en) * 2009-05-13 2010-11-18 Ce Ma Solution based lanthanide and group iii precursors for atomic layer deposition
EP2339048B1 (de) * 2009-09-14 2016-12-07 Rohm and Haas Electronic Materials, L.L.C. Verfahren zum Abscheiden von organometallischen Verbindungen
JPWO2011040385A1 (ja) * 2009-09-29 2013-02-28 東京エレクトロン株式会社 Ni膜の成膜方法
WO2012005957A2 (en) 2010-07-07 2012-01-12 Advanced Technology Materials, Inc. Doping of zro2 for dram applications
TWI551708B (zh) 2011-07-22 2016-10-01 應用材料股份有限公司 使用金屬前驅物之原子層沉積法
US8686138B2 (en) * 2011-07-22 2014-04-01 American Air Liquide, Inc. Heteroleptic pyrrolecarbaldimine precursors
EP2559681B1 (de) 2011-08-15 2016-06-22 Dow Global Technologies LLC Organometallische Verbindungszubereitung
EP2559682B1 (de) 2011-08-15 2016-08-03 Rohm and Haas Electronic Materials LLC Organometallische Verbindungszubereitung
WO2013177326A1 (en) 2012-05-25 2013-11-28 Advanced Technology Materials, Inc. Silicon precursors for low temperature ald of silicon-based thin-films
US10186570B2 (en) 2013-02-08 2019-01-22 Entegris, Inc. ALD processes for low leakage current and low equivalent oxide thickness BiTaO films
KR102326396B1 (ko) 2013-09-27 2021-11-12 레르 리키드 쏘시에떼 아노님 뿌르 레드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 아민 치환된 트리실릴아민 및 트리디실릴아민 화합물
KR101412256B1 (ko) * 2013-12-09 2014-06-25 주식회사 로드씰 맨홀 표층보수재의 시공 방법
US9099301B1 (en) 2013-12-18 2015-08-04 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Preparation of lanthanum-containing precursors and deposition of lanthanum-containing films
KR102461078B1 (ko) * 2014-10-02 2022-10-28 레르 리키드 쏘시에떼 아노님 뿌르 레드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 Ald/cvd 규소-함유 필름 응용을 위한 오르가노디실란 전구체
US9543144B2 (en) 2014-12-31 2017-01-10 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Vapor deposition of chalcogenide-containing films
US9777025B2 (en) 2015-03-30 2017-10-03 L'Air Liquide, Société pour l'Etude et l'Exploitation des Procédés Georges Claude Si-containing film forming precursors and methods of using the same
US11124876B2 (en) 2015-03-30 2021-09-21 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Si-containing film forming precursors and methods of using the same
US10913754B2 (en) 2015-07-07 2021-02-09 Samsung Electronics Co., Ltd. Lanthanum compound and methods of forming thin film and integrated circuit device using the lanthanum compound
KR102424961B1 (ko) 2015-07-07 2022-07-25 삼성전자주식회사 란타넘 화합물 및 그 제조 방법과 란타넘 전구체 조성물과 이를 이용한 박막 형성 방법 및 집적회로 소자의 제조 방법
US10023462B2 (en) * 2015-11-30 2018-07-17 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Niobium-Nitride film forming compositions and vapor deposition of Niobium-Nitride films
KR102442621B1 (ko) * 2015-11-30 2022-09-13 삼성전자주식회사 니오븀 화합물을 이용한 박막 형성 방법 및 집적회로 소자의 제조 방법
KR102727616B1 (ko) 2016-10-07 2024-11-07 삼성전자주식회사 유기 금속 전구체, 이를 이용한 막 형성 방법 및 이를 이용한 반도체 장치의 제조 방법
US10192734B2 (en) 2016-12-11 2019-01-29 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploration des Procédés Georges Claude Short inorganic trisilylamine-based polysilazanes for thin film deposition
US11760771B2 (en) * 2017-11-16 2023-09-19 Adeka Corporation Ruthenium compound, raw material for forming thin film, and method for producing thin film
KR102048884B1 (ko) * 2018-05-30 2019-11-26 한국기계연구원 양자점 박막의 제조 방법 및 태양 전지의 제조 방법
KR102879479B1 (ko) * 2020-06-15 2025-10-30 에스케이트리켐 주식회사 란탄족 전구체 및 이를 이용한 란탄족 함유 박막 및 상기 박막의 형성 방법 및 상기 란탄족 함유 박막을 포함하는 반도체 소자.
KR20230009793A (ko) 2021-07-09 2023-01-17 삼성전자주식회사 이트륨 화합물과 이를 이용한 집적회로 소자의 제조 방법

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE393967B (sv) 1974-11-29 1977-05-31 Sateko Oy Forfarande och for utforande av stroleggning mellan lagren i ett virkespaket
US4506815A (en) 1982-12-09 1985-03-26 Thiokol Corporation Bubbler cylinder and dip tube device
DE69027496T2 (de) 1989-09-26 1996-10-31 Canon Kk Gasversorgungsvorrichtung und ihre Verwendung für eine Filmabscheidungsanlage
GB9315975D0 (en) * 1993-08-02 1993-09-15 Ass Octel Organometallic complexes of gallium and indium
US5502128A (en) 1994-12-12 1996-03-26 University Of Massachusetts Group 4 metal amidinate catalysts and addition polymerization process using same
US6281124B1 (en) * 1998-09-02 2001-08-28 Micron Technology, Inc. Methods and systems for forming metal-containing films on substrates
US6444038B1 (en) 1999-12-27 2002-09-03 Morton International, Inc. Dual fritted bubbler
DE60106675T2 (de) 2000-05-31 2005-12-01 Shipley Co., L.L.C., Marlborough Verdampfer
DE60330896D1 (de) * 2002-11-15 2010-02-25 Harvard College Atomlagenabscheidung (ald) mit hilfe von metallamidinaten
US7396949B2 (en) * 2003-08-19 2008-07-08 Denk Michael K Class of volatile compounds for the deposition of thin films of metals and metal compounds
US7300873B2 (en) * 2004-08-13 2007-11-27 Micron Technology, Inc. Systems and methods for forming metal-containing layers using vapor deposition processes
WO2006023501A2 (en) 2004-08-16 2006-03-02 Aviza Technology, Inc. Direct liquid injection system and method for forming multi-component dielectric films
US7250367B2 (en) * 2004-09-01 2007-07-31 Micron Technology, Inc. Deposition methods using heteroleptic precursors
US7816550B2 (en) * 2005-02-10 2010-10-19 Praxair Technology, Inc. Processes for the production of organometallic compounds
WO2007015436A1 (ja) * 2005-08-04 2007-02-08 Tosoh Corporation 金属含有化合物、その製造方法、金属含有薄膜及びその形成方法
WO2007047020A2 (en) * 2005-10-11 2007-04-26 Meadwestvaco Corporation Acoustical fishing lure
WO2007147020A2 (en) 2006-06-15 2007-12-21 Advanced Technology Materials, Inc. Cobalt precursors useful for forming cobalt-containing films on substrates
US7638645B2 (en) * 2006-06-28 2009-12-29 President And Fellows Of Harvard University Metal (IV) tetra-amidinate compounds and their use in vapor deposition
CN102993050A (zh) * 2006-06-28 2013-03-27 哈佛学院院长等 四脒基金属(iv)化合物及其在气相沉积中的用途
US8142847B2 (en) * 2007-07-13 2012-03-27 Rohm And Haas Electronic Materials Llc Precursor compositions and methods
EP2339048B1 (de) * 2009-09-14 2016-12-07 Rohm and Haas Electronic Materials, L.L.C. Verfahren zum Abscheiden von organometallischen Verbindungen

Also Published As

Publication number Publication date
JP5437594B2 (ja) 2014-03-12
US8012536B2 (en) 2011-09-06
JP2009079285A (ja) 2009-04-16
CN101348900A (zh) 2009-01-21
CN101348900B (zh) 2012-10-17
EP2000561A1 (de) 2008-12-10
TW200907091A (en) 2009-02-16
KR101504939B1 (ko) 2015-03-23
KR20080107296A (ko) 2008-12-10
US20080305260A1 (en) 2008-12-11
TWI398541B (zh) 2013-06-11
EP2000561B1 (de) 2013-12-11

Similar Documents

Publication Publication Date Title
SG148140A1 (en) Organometallic compounds
SG139702A1 (en) Organometallic compounds
SG139703A1 (en) Organometallic compounds
SG139706A1 (en) Organometallic compounds
WO2009122361A3 (en) Preparation of lanthanide-containing precursors and deposition of lanthanide-containing films
EP4624625A3 (de) Funktionalisierte cyclosilazane als vorstufen für siliciumhaltige filme mit hoher wachstumsrate
Potts et al. Energy-enhanced atomic layer deposition for more process and precursor versatility
GB2479322A (en) Composition and method for low temperature deposition of ruthenium
SG135953A1 (en) Germanium compounds
ATE535534T1 (de) Metall-organische niobium- und vanadium-vorläufer zur dünnschichtablagerung
SG162706A1 (en) Static chemical vapor deposition of gamma-ni + gamma
WO2008128141A3 (en) Zirconium, hafnuim, titanium, and silicon precursors for ald/cvd
EP3929326A3 (de) Zusammensetzungen und verfahren zur ablagerung von kohlenstoffdotierten siliciumhaltigen filmen
WO2010027669A3 (en) In-situ chamber treatment and deposition process
WO2012124913A3 (ko) 신규한 4-비이 족 유기금속화합물 및 그 제조방법
WO2011020042A3 (en) Hafnium- and zirconium-containing precursors and methods of using the same
JP2016540038A5 (de)
WO2013046155A8 (en) Tungsten diazabutadiene molecules, their synthesis, and their use for tungsten containing film depositions
TW200606168A (en) Copper (I) compounds useful as deposition precursors of copper thin films
TW200940738A (en) Method for forming a titanium-containing layer on a substrate using an ALD process
TW200710267A (en) Method and apparatus for using solution based precursors for atomic layer deposition
WO2010055423A8 (en) Tellurium precursors for film deposition
WO2004070074A3 (en) Nanolayer deposition process
TW200706682A (en) Unsymmetrical ligand sources, reduced symmetry metal-containing compounds, and systems and methods including same
TW200801229A (en) Precursor compositions for atomic layer deposition and chemical vapor deposition of titanate, lanthanate, and tantalate dielectric films