SG152245A1 - Sheet peeling apparatus and sheet peeling method - Google Patents

Sheet peeling apparatus and sheet peeling method

Info

Publication number
SG152245A1
SG152245A1 SG200902586-7A SG2009025867A SG152245A1 SG 152245 A1 SG152245 A1 SG 152245A1 SG 2009025867 A SG2009025867 A SG 2009025867A SG 152245 A1 SG152245 A1 SG 152245A1
Authority
SG
Singapore
Prior art keywords
peeling
sheet
sheet peeling
roll
tape
Prior art date
Application number
SG200902586-7A
Other languages
English (en)
Inventor
Masaki Tsujimoto
Takahisa Yoshioka
Kenji Kobayashi
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004133068A external-priority patent/JP4485248B2/ja
Priority claimed from JP2004218483A external-priority patent/JP4550510B2/ja
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG152245A1 publication Critical patent/SG152245A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H10P72/7446—Separation by peeling using a peeling wheel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1174—Using roller for delamination [e.g., roller pairs operating at differing speeds or directions, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/195—Delaminating roller means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200902586-7A 2004-04-28 2005-04-27 Sheet peeling apparatus and sheet peeling method SG152245A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004133068A JP4485248B2 (ja) 2004-04-28 2004-04-28 剥離装置及び剥離方法
JP2004218483A JP4550510B2 (ja) 2004-07-27 2004-07-27 シート剥離装置及び剥離方法

Publications (1)

Publication Number Publication Date
SG152245A1 true SG152245A1 (en) 2009-05-29

Family

ID=35241928

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200902586-7A SG152245A1 (en) 2004-04-28 2005-04-27 Sheet peeling apparatus and sheet peeling method

Country Status (7)

Country Link
US (1) US7846289B2 (fr)
EP (1) EP1742255B1 (fr)
KR (1) KR101265993B1 (fr)
MY (1) MY139623A (fr)
SG (1) SG152245A1 (fr)
TW (1) TW200539296A (fr)
WO (1) WO2005106937A1 (fr)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200539357A (en) * 2004-04-28 2005-12-01 Lintec Corp Adhering apparatus and adhering method
JP2006100728A (ja) * 2004-09-30 2006-04-13 Nitto Denko Corp 保護テープ剥離方法およびこれを用いた装置
JP4953764B2 (ja) 2005-11-29 2012-06-13 株式会社東京精密 剥離テープ貼付方法および剥離テープ貼付装置
JP4666514B2 (ja) * 2006-07-20 2011-04-06 リンテック株式会社 シート剥離装置及び剥離方法
TWI335899B (en) * 2006-11-03 2011-01-11 Kodak Graphic Comm Canada Co Methods and apparatus for peeling a flexible sheet from a substrate
WO2008112660A1 (fr) 2007-03-09 2008-09-18 Nexus Biosystems, Inc. Dispositif et procédé de retrait d'une pellicule de fermeture
JP4740296B2 (ja) * 2008-08-28 2011-08-03 リンテック株式会社 シート剥離装置及び剥離方法
JP4740298B2 (ja) * 2008-09-04 2011-08-03 リンテック株式会社 シート剥離装置及び剥離方法
JP5149122B2 (ja) * 2008-10-22 2013-02-20 リンテック株式会社 シート剥離装置及び剥離方法
US8623763B2 (en) * 2011-06-01 2014-01-07 Texas Instruments Incorporated Protective layer for protecting TSV tips during thermo-compressive bonding
KR101857288B1 (ko) * 2011-08-26 2018-05-14 삼성디스플레이 주식회사 기판으로부터 도너 필름을 분리하기 위한 방법 및 장치
KR101277325B1 (ko) * 2011-09-16 2013-06-20 주식회사 아이.엠.텍 필름의 보호시트 분리장치
KR101869930B1 (ko) * 2011-11-29 2018-06-22 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
KR101989484B1 (ko) * 2012-07-09 2019-06-17 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
KR102006876B1 (ko) * 2012-09-04 2019-08-05 삼성디스플레이 주식회사 필름 박리장치 및 그것을 이용한 필름 박리방법
KR101981639B1 (ko) * 2012-11-13 2019-05-27 삼성디스플레이 주식회사 시트 커팅 장치 및 그것을 이용한 시트 커팅 방법
KR102069851B1 (ko) * 2013-03-26 2020-01-28 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
KR101969092B1 (ko) * 2013-04-10 2019-04-16 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
US9613845B2 (en) * 2014-01-17 2017-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion de-taping
KR101842967B1 (ko) 2016-10-18 2018-03-29 (주)에스에스피 반도체패키지 보호테이프용 디테이핑 모듈
TWI685905B (zh) * 2017-07-12 2020-02-21 日商新川股份有限公司 接合裝置和接合方法
KR102048747B1 (ko) * 2018-04-16 2019-11-26 한국기계연구원 마이크로 소자 전사방법
TWI685908B (zh) * 2019-01-31 2020-02-21 鴻勁精密股份有限公司 卸膜裝置及其應用之作業設備
KR102812431B1 (ko) * 2019-06-17 2025-05-27 삼성디스플레이 주식회사 표시장치의 제조설비 및 표시장치의 제조방법
US11390061B2 (en) * 2020-05-09 2022-07-19 Nps Co., Ltd. Curl removing apparatus for multi-layer film
KR102158450B1 (ko) * 2020-06-08 2020-09-22 (주)네온테크 전자부품 분리장치 및 분리방법
US12202094B2 (en) * 2021-07-09 2025-01-21 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for chemical mechanical polishing pad replacement
DE102022134515A1 (de) * 2022-12-22 2024-06-27 Advanced Engineering Industrie Automation GmbH Vorrichtung und Verfahren zum Abziehen von Schutzfolien von plattenförmigen Gegenständen
CN115876689B (zh) * 2022-12-30 2024-04-05 浙江京华激光科技股份有限公司 一种剥离性能检测设备及剥离检测方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2157193B (en) * 1984-04-10 1987-08-19 Nitto Electric Ind Co Process for peeling protective film off a thin article
JPS639122A (ja) * 1986-06-30 1988-01-14 Teikoku Seiki Kk シリコンウエハ−保護用マスキングシ−トの剥離方法
JPH0691153B2 (ja) * 1987-11-28 1994-11-14 日東電工株式会社 保護フイルムの剥離方法
KR19990028523A (ko) * 1995-08-31 1999-04-15 야마모토 히데키 반도체웨이퍼의 보호점착테이프의 박리방법 및 그 장치
DE69933072T2 (de) * 1998-01-27 2006-12-21 Kitano Co., Ltd., Komatsushima Verfahren und Vorrichtung zum Laminieren plattenförmiger Substrate
JP2994356B1 (ja) 1998-09-11 1999-12-27 山形日本電気株式会社 ウエハ表面保護テープ剥離装置
JP4166920B2 (ja) * 2000-02-24 2008-10-15 リンテック株式会社 シート剥離装置および方法
JP2001319906A (ja) * 2000-05-11 2001-11-16 Takatori Corp ウエハ表面保護テープの剥離装置
JP4502547B2 (ja) * 2000-08-07 2010-07-14 日東電工株式会社 半導体ウエハの保護テープ除去方法およびその装置
JP3753012B2 (ja) * 2001-05-10 2006-03-08 セイコーエプソン株式会社 剥取装置、その装置を備えた剥取機および剥取方法
JP2003338474A (ja) 2002-05-21 2003-11-28 Lintec Corp 脆質部材の加工方法

Also Published As

Publication number Publication date
EP1742255A1 (fr) 2007-01-10
EP1742255A4 (fr) 2009-12-09
KR101265993B1 (ko) 2007-01-24
TW200539296A (en) 2005-12-01
US20070235131A1 (en) 2007-10-11
KR20070011372A (ko) 2007-01-24
WO2005106937A1 (fr) 2005-11-10
TWI349952B (fr) 2011-10-01
MY139623A (en) 2009-10-30
EP1742255B1 (fr) 2012-10-31
US7846289B2 (en) 2010-12-07

Similar Documents

Publication Publication Date Title
SG152245A1 (en) Sheet peeling apparatus and sheet peeling method
TW200739816A (en) Method of transferring a laminate and method of manufacturing a semiconductor device
EP1128415A3 (fr) Appareil et méthode d'enlèvement de pellicule
JP2005500133A5 (fr)
EP1672044A3 (fr) Procédé de production de bandes ou feuilles autoadhésives double face
JP2012533454A5 (fr)
WO2003069586A3 (fr) Etiquette en film mince revetue d'un adhesif
CA2381311A1 (fr) Structure de micro-pont
TW200631887A (en) Peeling apparatus and peeling method
JP4550510B2 (ja) シート剥離装置及び剥離方法
JP2007158037A (ja) シート貼付装置およびシート貼付方法
DE502004004750D1 (de) Vorrichtung zum auf- und abziehen einer stützwalzen-lagereinheit
TW200719394A (en) Method and device for peeling off film
JP6904193B2 (ja) 薄膜剥離方法および薄膜の製造方法
JP4376250B2 (ja) 多層構造体の形成方法
EP1167050A3 (fr) Rouleau, dispositif et méthode de fabrication d'un rouleau
JP6406942B2 (ja) 保護テープ剥離方法および保護テープ剥離装置
JP4583920B2 (ja) テープ剥離方法と装置
CA2508908A1 (fr) Machine d'emballage avec systeme support de film a centrage automatique
PT1422174E (pt) Processo e dispositivo para preparacao de um rolo de papel para substituicao rapida
AU2003252094A1 (en) Method and apparatus for forming a thin film on a tape substrate
JP5928857B1 (ja) 保護シート材における保護フィルムの貼付方法
JP2013144590A (ja) シート巻取用コア、ロール状シート、及び、ロール状シート製造方法
JP5350343B2 (ja) フィルムの前処理装置
TH83517A (th) เครื่องลอกแผ่นและวิธีการลอกแผ่น