SG43247A1 - Thin film bonding method and apparatus having structure for removing wetting agents - Google Patents

Thin film bonding method and apparatus having structure for removing wetting agents

Info

Publication number
SG43247A1
SG43247A1 SG1996006411A SG1996006411A SG43247A1 SG 43247 A1 SG43247 A1 SG 43247A1 SG 1996006411 A SG1996006411 A SG 1996006411A SG 1996006411 A SG1996006411 A SG 1996006411A SG 43247 A1 SG43247 A1 SG 43247A1
Authority
SG
Singapore
Prior art keywords
thin film
wetting agents
bonding method
film bonding
removing wetting
Prior art date
Application number
SG1996006411A
Other languages
English (en)
Inventor
Hamamura Fumio
Sumi Shigeo
Original Assignee
Somar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Somar Corp filed Critical Somar Corp
Publication of SG43247A1 publication Critical patent/SG43247A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223One or more of the layers being plastic
    • B32B37/226Laminating sheets, panels or inserts between two continuous plastic layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0038Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving application of liquid to the layers prior to lamination, e.g. wet laminating
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/161Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425Printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1111Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19Delaminating means
    • Y10T156/1928Differential fluid pressure delaminating means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
SG1996006411A 1989-06-04 1990-05-04 Thin film bonding method and apparatus having structure for removing wetting agents SG43247A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1141968A JPH0651360B2 (ja) 1989-06-04 1989-06-04 薄膜の張付方法及びその装置

Publications (1)

Publication Number Publication Date
SG43247A1 true SG43247A1 (en) 1997-10-17

Family

ID=15304316

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996006411A SG43247A1 (en) 1989-06-04 1990-05-04 Thin film bonding method and apparatus having structure for removing wetting agents

Country Status (6)

Country Link
US (1) US5125999A (ja)
EP (1) EP0401513B1 (ja)
JP (1) JPH0651360B2 (ja)
CA (1) CA2015516A1 (ja)
DE (1) DE69031964T2 (ja)
SG (1) SG43247A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2637261B2 (ja) * 1990-05-22 1997-08-06 ソマール株式会社 ラミネータ
JPH05162205A (ja) * 1991-12-13 1993-06-29 Somar Corp フィルム張付装置
JPH0737071B2 (ja) * 1991-12-13 1995-04-26 ソマール株式会社 フィルム張付方法及び装置
US5389185A (en) * 1992-04-03 1995-02-14 Somar Corporation Film sticking apparatus
EP0646456B1 (en) * 1993-09-24 1998-01-21 CENTROPLAST SUD S.r.l. A plastic coating machine for the dustless joining of paper or cardboard with a transparent film by means of solvent-free adhesives (m)
US5372670A (en) * 1994-02-02 1994-12-13 International Business Machines Corporation System for wet application of a dry film to a panel
JP2000085011A (ja) * 1998-07-16 2000-03-28 Somar Corp フィルム張付装置
US6176286B1 (en) * 1998-07-16 2001-01-23 Somar Corporation Film applying apparatus
JP4805058B2 (ja) * 2006-08-08 2011-11-02 ナミックス株式会社 低圧熱圧着装置
US20090188105A1 (en) * 2008-01-28 2009-07-30 Ming-Chin Chien Slim battery packaging method
CN104307709B (zh) * 2014-09-22 2016-08-17 浙江西雅普康大制革有限公司 具有节能功效的合成革加工除气泡设备
CN105644112B (zh) * 2016-02-29 2018-04-03 广东思沃精密机械有限公司 非平整板材的贴膜方法
CN112172115A (zh) * 2020-07-20 2021-01-05 泉州台商投资区飞翔机械设计服务中心 一种贴膜玻璃生产用真空自动贴膜装置及其贴膜方法
CN113141735B (zh) * 2021-04-26 2022-05-31 鸿安(福建)机械有限公司 一种pcb板制作用稳压无缝压制层压机
CN117492329A (zh) * 2022-07-25 2024-02-02 成都高真科技有限公司 一种光刻机晶圆制造过程中的晶圆台除尘方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3029161A (en) * 1957-11-25 1962-04-10 Johns Manville Fiber Glass Inc Liquid recovery method and apparatus
US3672036A (en) * 1969-02-26 1972-06-27 Allegheny Ludlum Steel Method of making assemblies of stainless steel tubing
US3632371A (en) * 1970-04-24 1972-01-04 Evans Prod Co Method of making multilayer mat of particulate material
US3681039A (en) * 1970-06-09 1972-08-01 Owens Corning Fiberglass Corp Apparatus and method of removing excess liquid coating from glass filaments
US4069076A (en) * 1976-11-29 1978-01-17 E. I. Du Pont De Nemours And Company Liquid lamination process
BR8103187A (pt) * 1980-05-27 1982-02-09 Du Pont Processo para laminar uma camada fotossensivel de absorcao
US4378264A (en) * 1980-05-27 1983-03-29 E. I. Du Pont De Nemours And Company Integrated laminating process
US4405394A (en) * 1980-05-27 1983-09-20 E. I. Du Pont De Nemours And Company Laminating process
CA1167364A (en) * 1980-09-22 1984-05-15 Masayuki Oizumi Production of bubble-free electrical laminates
GB2121353B (en) * 1982-05-28 1985-09-11 Eurobond Coatings Limited Laminating
US4698294A (en) * 1986-09-12 1987-10-06 E. I. Du Pont De Nemours And Company Lamination of photopolymerizable film onto a substrate employing an intermediate nonphotosensitive liquid layer
US4714504A (en) * 1986-10-10 1987-12-22 Ibm Corporation Process of laminating a photosensitive layer of a substrate
JPH01160085A (ja) * 1987-12-16 1989-06-22 Somar Corp 薄膜の張付方法及びその実施装置
EP0336358B1 (en) * 1988-04-04 1995-12-20 Somar Corporation Thin film laminating apparatus
US4976817A (en) * 1988-12-09 1990-12-11 Morton International, Inc. Wet lamination process and apparatus
US5102491A (en) * 1988-12-09 1992-04-07 Morton International, Inc. Wet lamination process and apparatus

Also Published As

Publication number Publication date
CA2015516A1 (en) 1990-12-04
JPH037344A (ja) 1991-01-14
JPH0651360B2 (ja) 1994-07-06
EP0401513B1 (en) 1998-01-21
US5125999A (en) 1992-06-30
EP0401513A2 (en) 1990-12-12
DE69031964D1 (de) 1998-02-26
DE69031964T2 (de) 1998-08-13
EP0401513A3 (en) 1991-11-21

Similar Documents

Publication Publication Date Title
KR940009993B1 (en) Method and apparatus for bonding semiconductor substrates
GB2233121B (en) Work positioning method and apparatus
GB2218016B (en) Method and apparatus for bonding an article projection
ZA876494B (en) Method and apparatus for film coating seedmaterial
EP0429809A3 (en) Method and apparatus for etching semiconductor materials
SG46192A1 (en) Method and apparatus for positioning transducers
GB9014263D0 (en) Apparatus and method for spatially- and spectrally- resolvedmeasurements
EP0266178A3 (en) Method and apparatus for forming a thin film
GB8928917D0 (en) Method and apparatus for surface analysis
SG43247A1 (en) Thin film bonding method and apparatus having structure for removing wetting agents
EP0426931A3 (en) Film bonding method and apparatus for performing same
GB9014262D0 (en) Method and apparatus for diffusion bonding
EP0483880A3 (en) Method for forming thin film and apparatus therefor
GB2247295B (en) Method and apparatus for positioning components
AU5933690A (en) Method and apparatus for cleaning magnetic tapes
IL93612A0 (en) Method and apparatus for bonding sheet material
IL97149A0 (en) Method and apparatus for abrading
GB2236069B (en) Method and apparatus for use in micropropagation
EP0422525A3 (en) Exposing method and apparatus
EP0243621A3 (en) Bonding method and apparatus
EP0428391A3 (en) Method and apparatus for beautificating drawings
KR900011534A (ko) 다이어몬드류 박막의 제조방법 및 그 제조장치
EP0452552A3 (en) Film peeling method and apparatus for practicing same
EP0420766A3 (en) Blood cleaning apparatus and method for cleaning blood therewith
EP0250296A3 (en) Apparatus and method for tape bonding