SG43864A1 - Methods of applying substance to intergrated circuit die and lead frames to improve adhesion to mold compound apparatus and devices - Google Patents

Methods of applying substance to intergrated circuit die and lead frames to improve adhesion to mold compound apparatus and devices

Info

Publication number
SG43864A1
SG43864A1 SG1996003257A SG1996003257A SG43864A1 SG 43864 A1 SG43864 A1 SG 43864A1 SG 1996003257 A SG1996003257 A SG 1996003257A SG 1996003257 A SG1996003257 A SG 1996003257A SG 43864 A1 SG43864 A1 SG 43864A1
Authority
SG
Singapore
Prior art keywords
adhesion promoting
promoting substance
methods
devices
integrated circuit
Prior art date
Application number
SG1996003257A
Other languages
English (en)
Inventor
Robert G Mckenna
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of SG43864A1 publication Critical patent/SG43864A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/08—Plant for applying liquids or other fluent materials to objects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
SG1996003257A 1991-01-08 1992-01-07 Methods of applying substance to intergrated circuit die and lead frames to improve adhesion to mold compound apparatus and devices SG43864A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US63877691A 1991-01-08 1991-01-08

Publications (1)

Publication Number Publication Date
SG43864A1 true SG43864A1 (en) 1997-11-14

Family

ID=24561374

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996003257A SG43864A1 (en) 1991-01-08 1992-01-07 Methods of applying substance to intergrated circuit die and lead frames to improve adhesion to mold compound apparatus and devices

Country Status (6)

Country Link
EP (2) EP0572043A1 (th)
JP (1) JP3363467B2 (th)
KR (1) KR920015524A (th)
DE (1) DE69218630T2 (th)
SG (1) SG43864A1 (th)
TW (1) TW207586B (th)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10127894B4 (de) * 2001-06-08 2004-08-12 Mühlbauer Ag Verfahren, Vorrichtung und Produktionsanlage zum Aufbringen von kleinen Kunststoffmengen auf elektrische Bauteile, wie Mikrochips oder deren Träger

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900580A (en) * 1987-10-22 1990-02-13 Klaus Grah Process for the electrostatic lacquering of printed circuit boards
JPH0244738A (ja) * 1988-08-05 1990-02-14 Semiconductor Energy Lab Co Ltd 電子装置作製方法

Also Published As

Publication number Publication date
DE69218630D1 (de) 1997-05-07
JPH06104296A (ja) 1994-04-15
JP3363467B2 (ja) 2003-01-08
EP0572043A1 (en) 1993-12-01
DE69218630T2 (de) 1997-09-11
KR920015524A (ko) 1992-08-27
EP0494634A3 (en) 1992-09-02
TW207586B (th) 1993-06-11
EP0494634A2 (en) 1992-07-15
EP0494634B1 (en) 1997-04-02

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