SG52249A1 - Reducing tin sludge in acid tin plating - Google Patents

Reducing tin sludge in acid tin plating

Info

Publication number: SG52249A1
Authority: SG; Singapore
Prior art keywords: tin; acid; reducing; solution; sludge
Prior art date: 1993-05-19

Application number

SG1996001351A

Other languages

English (en)

Inventor

Donald Thomson

David A Luke

Claudia Mosher

Original Assignee

Learonal Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1993-05-19

Filing date

1994-05-19

Publication date

1998-09-28

1994-05-19 Application filed by Learonal Inc filed Critical Learonal Inc

1998-09-28 Publication of SG52249A1 publication Critical patent/SG52249A1/en

Links

ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title abstract 3
239000002253 acid Substances 0.000 title abstract 3
238000007747 plating Methods 0.000 title 1
239000010802 sludge Substances 0.000 title 1
229910001432 tin ion Inorganic materials 0.000 abstract 3
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
239000003963 antioxidant agent Substances 0.000 abstract 2
230000003078 antioxidant effect Effects 0.000 abstract 2
150000001875 compounds Chemical class 0.000 abstract 2
238000009713 electroplating Methods 0.000 abstract 2
238000000034 method Methods 0.000 abstract 2
LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 abstract 1
229910001128 Sn alloy Inorganic materials 0.000 abstract 1
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
238000011109 contamination Methods 0.000 abstract 1
229910052742 iron Inorganic materials 0.000 abstract 1
230000003647 oxidation Effects 0.000 abstract 1
238000007254 oxidation reaction Methods 0.000 abstract 1
229910052760 oxygen Inorganic materials 0.000 abstract 1
239000001301 oxygen Substances 0.000 abstract 1
230000000737 periodic effect Effects 0.000 abstract 1
150000003839 salts Chemical class 0.000 abstract 1
229910001174 tin-lead alloy Inorganic materials 0.000 abstract 1
229910052723 transition metal Inorganic materials 0.000 abstract 1
150000003624 transition metals Chemical class 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)
Manufacture And Refinement Of Metals (AREA)
Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

SG1996001351A 1993-05-19 1994-05-19 Reducing tin sludge in acid tin plating SG52249A1 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US08/065,104 US5378347A (en)	1993-05-19	1993-05-19	Reducing tin sludge in acid tin plating

Publications (1)

Publication Number	Publication Date
SG52249A1 true SG52249A1 (en)	1998-09-28

Family

ID=22060366

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SG1996001351A SG52249A1 (en)	1993-05-19	1994-05-19	Reducing tin sludge in acid tin plating

Country Status (6)

Country	Link
US (1)	US5378347A (fr)
EP (1)	EP0625593B1 (fr)
JP (1)	JP3450424B2 (fr)
AT (1)	ATE183249T1 (fr)
DE (1)	DE69419964T2 (fr)
SG (1)	SG52249A1 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5538617A (en) *	1995-03-08	1996-07-23	Bethlehem Steel Corporation	Ferrocyanide-free halogen tin plating process and bath
US5628893A (en)	1995-11-24	1997-05-13	Atotech Usa, Inc.	Halogen tin composition and electrolytic plating process
WO1997025454A2 (fr) *	1995-12-22	1997-07-17	Weirton Steel Corporation	Galvanoplastie de substrat en acier
JP2001262391A (ja) *	2000-03-14	2001-09-26	Ishihara Chem Co Ltd	スズ−銅系合金メッキ浴並びに当該皮膜を形成した電子部品
US7122108B2 (en) *	2001-10-24	2006-10-17	Shipley Company, L.L.C.	Tin-silver electrolyte
US20030159941A1 (en) *	2002-02-11	2003-08-28	Applied Materials, Inc.	Additives for electroplating solution
AU2003272790A1 (en) *	2002-10-08	2004-05-04	Honeywell International Inc.	Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials
JP4758614B2 (ja) *	2003-04-07	2011-08-31	ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー．	電気めっき組成物および方法
US20070037005A1 (en) *	2003-04-11	2007-02-15	Rohm And Haas Electronic Materials Llc	Tin-silver electrolyte
JP2005002368A (ja) *	2003-06-09	2005-01-06	Ishihara Chem Co Ltd	ホイスカー防止用スズメッキ浴
EP1712660A1 (fr)	2005-04-12	2006-10-18	Enthone Inc.	Anode insoluble
EP1717351A1 (fr) *	2005-04-27	2006-11-02	Enthone Inc.	Bain de galvanisation
JP5158303B2 (ja) *	2006-04-14	2013-03-06	上村工業株式会社	錫電気めっき浴、錫めっき皮膜、錫電気めっき方法及び電子機器構成部品
EP2194165A1 (fr) *	2008-10-21	2010-06-09	Rohm and Haas Electronic Materials LLC	Procédé de régénération d'étain et ses métaux d'alliage dans des solutions électrolytes
EP2221396A1 (fr)	2008-12-31	2010-08-25	Rohm and Haas Electronic Materials LLC	Compositions de dépôt électrique à l'alliage d'étain sans plomb et procédés
US11066753B2 (en)	2015-06-16	2021-07-20	3M Innovative Properties Company	Plated polymeric article including tin/copper tie/seed layer
CN107787378A (zh)	2015-06-16	2018-03-09	3M创新有限公司	在聚合物片材上镀覆青铜

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS50109139A (fr) *	1974-02-06	1975-08-28
JPS5242435A (en) *	1975-10-01	1977-04-02	Mitsui Keikinzoku Kako	Method of feeding and discharging water in surface treating apparatus
US4111760A (en) *	1976-10-29	1978-09-05	The United States Of America As Represented By The Secretary Of The Army	Method and electrolyte for the electrodeposition of cobalt and cobalt-base alloys in the presence of an insoluble anode
JPS5461041A (en) *	1977-10-26	1979-05-17	Hitachi Ltd	Stabilizing method for tin plating bath
JPS602396B2 (ja) *	1978-11-27	1985-01-21	東洋鋼鈑株式会社	酸性錫めつき浴
US5094726B1 (en) *	1981-09-11	1993-12-21	I. Nobel Fred	Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5066367B1 (en) *	1981-09-11	1993-12-21	I. Nobel Fred	Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4871429A (en) *	1981-09-11	1989-10-03	Learonal, Inc	Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5296128A (en) *	1993-02-01	1994-03-22	Technic Inc.	Gallic acid as a combination antioxidant, grain refiner, selective precipitant, and selective coordination ligand, in plating formulations
JP5242435B2 (ja)	2009-01-30	2013-07-24	株式会社コシイプレザービング	防蟻工法

1993
- 1993-05-19 US US08/065,104 patent/US5378347A/en not_active Expired - Lifetime
1994
- 1994-05-19 AT AT94107772T patent/ATE183249T1/de not_active IP Right Cessation
- 1994-05-19 JP JP10554194A patent/JP3450424B2/ja not_active Expired - Fee Related
- 1994-05-19 EP EP94107772A patent/EP0625593B1/fr not_active Expired - Lifetime
- 1994-05-19 SG SG1996001351A patent/SG52249A1/en unknown
- 1994-05-19 DE DE69419964T patent/DE69419964T2/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
EP0625593B1 (fr)	1999-08-11
DE69419964D1 (de)	1999-09-16
US5378347A (en)	1995-01-03
JP3450424B2 (ja)	2003-09-22
JPH0748692A (ja)	1995-02-21
EP0625593A2 (fr)	1994-11-23
ATE183249T1 (de)	1999-08-15
DE69419964T2 (de)	2000-01-20
EP0625593A3 (fr)	1995-05-10

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