SG52364A1 - Plastic cavity package lid seal process - Google Patents

Plastic cavity package lid seal process

Info

Publication number
SG52364A1
SG52364A1 SG1996003479A SG1996003479A SG52364A1 SG 52364 A1 SG52364 A1 SG 52364A1 SG 1996003479 A SG1996003479 A SG 1996003479A SG 1996003479 A SG1996003479 A SG 1996003479A SG 52364 A1 SG52364 A1 SG 52364A1
Authority
SG
Singapore
Prior art keywords
seal process
lid seal
package lid
cavity package
plastic cavity
Prior art date
Application number
SG1996003479A
Other languages
English (en)
Inventor
Bruce D Bohon
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of SG52364A1 publication Critical patent/SG52364A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
SG1996003479A 1990-08-08 1991-08-08 Plastic cavity package lid seal process SG52364A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56448790A 1990-08-08 1990-08-08

Publications (1)

Publication Number Publication Date
SG52364A1 true SG52364A1 (en) 1998-09-28

Family

ID=24254671

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996003479A SG52364A1 (en) 1990-08-08 1991-08-08 Plastic cavity package lid seal process

Country Status (6)

Country Link
EP (1) EP0471507B1 (fr)
JP (1) JPH06132410A (fr)
KR (1) KR920005287A (fr)
DE (1) DE69122699T2 (fr)
SG (1) SG52364A1 (fr)
TW (1) TW211538B (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4588837B2 (ja) * 2000-04-11 2010-12-01 浜松ホトニクス株式会社 半導体受光装置
TWI385738B (zh) * 2007-11-09 2013-02-11 印能科技有限公司 Method for Eliminating Bubble of Adhesive Adhesive Layer in Semiconductor Packaging
CN112407375B (zh) * 2020-12-02 2022-03-25 安徽信息工程学院 一种纸盒自动封口装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4874722A (en) * 1987-04-16 1989-10-17 Texas Instruments Incorporated Process of packaging a semiconductor device with reduced stress forces
MY104152A (en) * 1988-08-12 1994-02-28 Mitsui Chemicals Inc Processes for producing semiconductor devices.

Also Published As

Publication number Publication date
KR920005287A (ko) 1992-03-28
EP0471507A3 (en) 1993-02-03
JPH06132410A (ja) 1994-05-13
TW211538B (fr) 1993-08-21
EP0471507A2 (fr) 1992-02-19
DE69122699T2 (de) 1997-02-27
DE69122699D1 (de) 1996-11-21
EP0471507B1 (fr) 1996-10-16

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