SG60093G - A method of making ohmic low resistance w-sb contacts to iii-v semiconductor materials - Google Patents

A method of making ohmic low resistance w-sb contacts to iii-v semiconductor materials

Info

Publication number
SG60093G
SG60093G SG60093A SG60093A SG60093G SG 60093 G SG60093 G SG 60093G SG 60093 A SG60093 A SG 60093A SG 60093 A SG60093 A SG 60093A SG 60093 G SG60093 G SG 60093G
Authority
SG
Singapore
Prior art keywords
contacts
iii
low resistance
semiconductor materials
making ohmic
Prior art date
Application number
SG60093A
Other languages
English (en)
Original Assignee
American Telephone & Telegraph
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone & Telegraph filed Critical American Telephone & Telegraph
Publication of SG60093G publication Critical patent/SG60093G/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/01Manufacture or treatment
    • H10D64/011Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H10D64/0116Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group III-V semiconductors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/62Electrodes ohmically coupled to a semiconductor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/02Contacts, special
SG60093A 1990-02-12 1993-05-07 A method of making ohmic low resistance w-sb contacts to iii-v semiconductor materials SG60093G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/478,875 US5011792A (en) 1990-02-12 1990-02-12 Method of making ohmic resistance WSb, contacts to III-V semiconductor materials

Publications (1)

Publication Number Publication Date
SG60093G true SG60093G (en) 1993-07-09

Family

ID=23901726

Family Applications (1)

Application Number Title Priority Date Filing Date
SG60093A SG60093G (en) 1990-02-12 1993-05-07 A method of making ohmic low resistance w-sb contacts to iii-v semiconductor materials

Country Status (6)

Country Link
US (1) US5011792A (fr)
EP (1) EP0442203B1 (fr)
JP (1) JP2898423B2 (fr)
DE (1) DE69001016T2 (fr)
HK (1) HK117693A (fr)
SG (1) SG60093G (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
JP3654037B2 (ja) * 1999-03-25 2005-06-02 住友電気工業株式会社 オーミック電極とその製造方法、および半導体装置
JP7271166B2 (ja) * 2018-12-21 2023-05-11 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL92060C (fr) * 1953-10-26
US3768151A (en) * 1970-11-03 1973-10-30 Ibm Method of forming ohmic contacts to semiconductors
JPS567304B2 (fr) * 1972-08-28 1981-02-17
US4186410A (en) * 1978-06-27 1980-01-29 Bell Telephone Laboratories, Incorporated Nonalloyed ohmic contacts to n-type Group III(a)-V(a) semiconductors
CA1138795A (fr) * 1980-02-19 1983-01-04 Goodrich (B.F.) Company (The) Glissoire d'evacuation et embarcation de sauvetage gonflables combinees
US4361718A (en) * 1980-12-19 1982-11-30 E. I. Du Pont De Nemours And Company Silicon solar cell N-region metallizations comprising a nickel-antimony alloy
JPS586143A (ja) * 1981-07-02 1983-01-13 Matsushita Electronics Corp 半導体装置
US4523212A (en) * 1982-03-12 1985-06-11 The United States Of America As Represented By The Secretary Of The Air Force Simultaneous doped layers for semiconductor devices
JPS61111525A (ja) * 1984-11-06 1986-05-29 Nec Corp 半導体素子の電極形成方法
JPH071813B2 (ja) * 1985-05-31 1995-01-11 古河電気工業株式会社 半導体発光装置の製造方法
US4662060A (en) * 1985-12-13 1987-05-05 Allied Corporation Method of fabricating semiconductor device having low resistance non-alloyed contact layer
US4662063A (en) * 1986-01-28 1987-05-05 The United States Of America As Represented By The Department Of The Navy Generation of ohmic contacts on indium phosphide
JPS63503583A (ja) * 1986-06-24 1988-12-22 アメリカン テレフォン アンド テレグラフ カムパニー 3‐5半導体基板にデバイスを製作する方法及びそれによって形成されたデバイス
US4850357A (en) * 1988-01-12 1989-07-25 Cardiac Pacemakers, Inc. Biphasic pulse generator for an implantable defibrillator
JPH01261204A (ja) * 1988-04-11 1989-10-18 Fujikura Ltd 酸化物系超電導体の製造方法

Also Published As

Publication number Publication date
JPH04357827A (ja) 1992-12-10
DE69001016D1 (de) 1993-04-08
HK117693A (en) 1993-11-05
EP0442203A1 (fr) 1991-08-21
DE69001016T2 (de) 1993-07-15
EP0442203B1 (fr) 1993-03-03
JP2898423B2 (ja) 1999-06-02
US5011792A (en) 1991-04-30

Similar Documents

Publication Publication Date Title
EP0283278A3 (en) Compound semiconductor device having nonalloyed ohmic contacts
DE3476141D1 (en) Method of forming ohmic contacts
EP0181457A3 (en) Method for making contacts to integrated circuits
SG95891G (en) Retention article for electrical contacts
EP0266050A3 (en) Improved photovoltaic heterojunction structures
IL90456A0 (en) Improved method of fabricating contacts for solar cells
DE3474610D1 (en) A process for making an ohmic contact to an n-type conductivity group iii-v semiconductor compound and a semiconductor device having such an ohmic contact
EP0426380A3 (en) Non-alloyed ohmic contact to iii-v semiconductors-on-silicon
DE3572256D1 (en) Ohmic contact for iii-v semiconductor and method of forming it
GB2021858A (en) Ohmic contact to group iii-v semiconductors
GB2226446B (en) Method of forming low-resistance contacts to doped regions in very large scale integrated devices
GB2210503B (en) Method of making semiconductor devices having ohmic contact
EP0151309A3 (en) Heterojunction semiconductor device
EP0200059A3 (en) A method of forming an ohmic contact to a group iii-v semiconductor and a semiconductor intermediate manufacturing product
EP0444893A3 (en) Method of making ohmic contacts between semiconductors and oxide superconductors
DE3374102D1 (en) Method of making ohmic contacts regions and device manufactured by the method
GB9015871D0 (en) Ohmic contact for p-type gaas
DE3264643D1 (en) Compound material for electrical contacts, and method for its manufacture
GB8709718D0 (en) Switching method & circuit
EP0296380A3 (en) Method of enhancing the critical current density of copper-based superconductors
EP0504365A4 (en) Processing method for fabricating electrical contacts to mesa structures in semiconductor devices
EP0508618A3 (en) Method of making ohmic contact to a iii-v semiconductor device
DE3574075D1 (en) Nickel-based electrical contact
EP0165538A3 (en) A resistor for a group iii-v intermetallic compound semiconductor integrated circuit
EP0260232A3 (en) Process for making metal-semiconductor ohmic contacts