SG63754A1 - Apparatus for and method of cleaning objects to be processed - Google Patents
Apparatus for and method of cleaning objects to be processedInfo
- Publication number
- SG63754A1 SG63754A1 SG1997003596A SG1997003596A SG63754A1 SG 63754 A1 SG63754 A1 SG 63754A1 SG 1997003596 A SG1997003596 A SG 1997003596A SG 1997003596 A SG1997003596 A SG 1997003596A SG 63754 A1 SG63754 A1 SG 63754A1
- Authority
- SG
- Singapore
- Prior art keywords
- processed
- cleaning objects
- cleaning
- objects
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25663796 | 1996-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG63754A1 true SG63754A1 (en) | 1999-03-30 |
Family
ID=17295381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG1997003596A SG63754A1 (en) | 1996-09-27 | 1997-09-27 | Apparatus for and method of cleaning objects to be processed |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6413355B1 (fr) |
| EP (1) | EP0833376B1 (fr) |
| KR (1) | KR100407868B1 (fr) |
| DE (1) | DE69739083D1 (fr) |
| SG (1) | SG63754A1 (fr) |
| TW (1) | TW477006B (fr) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3772056B2 (ja) * | 1998-10-12 | 2006-05-10 | 株式会社東芝 | 半導体基板の洗浄方法 |
| US6609632B2 (en) * | 2001-01-17 | 2003-08-26 | Simplus Systems Corporation | Removable lid and floating pivot |
| KR100775201B1 (ko) * | 2001-06-01 | 2007-11-12 | 에스.이.에스 카부시키가이샤 | 기판세정시스템 |
| US6564469B2 (en) * | 2001-07-09 | 2003-05-20 | Motorola, Inc. | Device for performing surface treatment on semiconductor wafers |
| KR20030006245A (ko) * | 2001-07-12 | 2003-01-23 | 삼성전자 주식회사 | 웨이퍼 건조장치 |
| JP3725051B2 (ja) * | 2001-07-27 | 2005-12-07 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| US20040040660A1 (en) * | 2001-10-03 | 2004-03-04 | Biberger Maximilian Albert | High pressure processing chamber for multiple semiconductor substrates |
| DE10216786C5 (de) * | 2002-04-15 | 2009-10-15 | Ers Electronic Gmbh | Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden |
| KR100481858B1 (ko) * | 2002-07-22 | 2005-04-11 | 삼성전자주식회사 | 공비혼합 효과를 이용하여 반도체기판을 건조시키는 장비및 상기 장비를 사용하는 건조방법 |
| JP3560962B1 (ja) * | 2003-07-02 | 2004-09-02 | エス・イー・エス株式会社 | 基板処理法及び基板処理装置 |
| US7836900B2 (en) * | 2004-04-02 | 2010-11-23 | Tokyo Electron Limited | Substrate processing system, substrate processing method, recording medium and software |
| JP4545083B2 (ja) * | 2005-11-08 | 2010-09-15 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| KR100809592B1 (ko) * | 2006-09-12 | 2008-03-04 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
| JP5248058B2 (ja) * | 2006-09-26 | 2013-07-31 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| US10041169B2 (en) | 2008-05-27 | 2018-08-07 | Picosun Oy | System and method for loading a substrate holder carrying a batch of vertically placed substrates into an atomic layer deposition reactor |
| US8282334B2 (en) * | 2008-08-01 | 2012-10-09 | Picosun Oy | Atomic layer deposition apparatus and loading methods |
| JP5890198B2 (ja) | 2011-03-25 | 2016-03-22 | 株式会社Screenホールディングス | 基板処理装置及び基板処理方法 |
| KR102181480B1 (ko) * | 2018-12-07 | 2020-11-23 | 박일환 | 마스크 세척장치 |
| CN113649343B (zh) * | 2021-07-21 | 2022-06-10 | 深圳市旭龙光电有限公司 | 一种有机玻璃回收清洗设备 |
| CN114664709B (zh) * | 2022-04-02 | 2022-10-28 | 深圳市豪林电子有限公司 | 一种碳化硅二极管生产的刻蚀清洗装置 |
| CN115662922A (zh) * | 2022-11-09 | 2023-01-31 | 华海清科股份有限公司 | 一种竖直提拉装置 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6481230A (en) | 1987-09-24 | 1989-03-27 | Hitachi Ltd | Treatment device |
| JPH0824113B2 (ja) | 1988-05-30 | 1996-03-06 | 株式会社日立製作所 | 乾燥方法及び装置 |
| JPH0370134A (ja) * | 1989-08-09 | 1991-03-26 | Fujitsu Ltd | 溶剤蒸気乾燥装置および乾燥方法 |
| JPH03236232A (ja) | 1990-02-14 | 1991-10-22 | Hitachi Ltd | 湿式洗浄装置及びその操作方法 |
| JPH03246940A (ja) | 1990-02-23 | 1991-11-05 | Hitachi Ltd | 洗浄乾燥処理装置 |
| US5186192A (en) * | 1990-12-14 | 1993-02-16 | Shin-Etsu Handotai Co., Ltd. | Apparatus for cleaning silicon wafer |
| JPH04251930A (ja) | 1990-12-29 | 1992-09-08 | Dainippon Screen Mfg Co Ltd | 洗浄処理後の基板の乾燥処理方法並びに乾燥処理装置 |
| US5265632A (en) * | 1991-05-08 | 1993-11-30 | Tokyo Electron Limited | Cleaning apparatus |
| JP3246940B2 (ja) | 1992-03-09 | 2002-01-15 | 古河電気工業株式会社 | 高力アルミニウム合金の熱処理法 |
| JP2902222B2 (ja) | 1992-08-24 | 1999-06-07 | 東京エレクトロン株式会社 | 乾燥処理装置 |
| JP3003016B2 (ja) * | 1992-12-25 | 2000-01-24 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
| JPH06283496A (ja) | 1993-03-26 | 1994-10-07 | Dainippon Screen Mfg Co Ltd | 洗浄処理後の基板の乾燥処理装置 |
| JP3347814B2 (ja) | 1993-05-17 | 2002-11-20 | 大日本スクリーン製造株式会社 | 基板の洗浄・乾燥処理方法並びにその処理装置 |
| JPH0878381A (ja) | 1993-08-18 | 1996-03-22 | Tokyo Electron Ltd | 洗浄装置 |
| JP3126858B2 (ja) | 1993-10-29 | 2001-01-22 | 大日本スクリーン製造株式会社 | 基板の表面処理装置 |
| JP3102826B2 (ja) | 1993-11-08 | 2000-10-23 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JPH07153734A (ja) | 1993-11-30 | 1995-06-16 | Hitachi Ltd | 精密部品の乾燥装置 |
| JP3361187B2 (ja) | 1994-06-08 | 2003-01-07 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| US5634978A (en) * | 1994-11-14 | 1997-06-03 | Yieldup International | Ultra-low particle semiconductor method |
| JP3359494B2 (ja) | 1996-04-18 | 2002-12-24 | 大日本スクリーン製造株式会社 | 基板処理方法および基板処理装置 |
| US6045624A (en) * | 1996-09-27 | 2000-04-04 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
| JP3236232B2 (ja) | 1996-11-19 | 2001-12-10 | 河村電器産業株式会社 | 分電盤 |
-
1997
- 1997-09-24 US US08/936,121 patent/US6413355B1/en not_active Expired - Fee Related
- 1997-09-25 EP EP97307512A patent/EP0833376B1/fr not_active Expired - Lifetime
- 1997-09-25 DE DE69739083T patent/DE69739083D1/de not_active Expired - Lifetime
- 1997-09-26 TW TW086114100A patent/TW477006B/zh not_active IP Right Cessation
- 1997-09-27 SG SG1997003596A patent/SG63754A1/en unknown
- 1997-09-27 KR KR1019970049348A patent/KR100407868B1/ko not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US6413355B1 (en) | 2002-07-02 |
| DE69739083D1 (de) | 2008-12-18 |
| EP0833376A3 (fr) | 2001-03-07 |
| KR19980025068A (ko) | 1998-07-06 |
| EP0833376A2 (fr) | 1998-04-01 |
| KR100407868B1 (ko) | 2004-04-03 |
| EP0833376B1 (fr) | 2008-11-05 |
| TW477006B (en) | 2002-02-21 |
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