SG64985A1 - Method and apparatus for moulding plastic packages - Google Patents

Method and apparatus for moulding plastic packages

Info

Publication number
SG64985A1
SG64985A1 SG1997001389A SG1997001389A SG64985A1 SG 64985 A1 SG64985 A1 SG 64985A1 SG 1997001389 A SG1997001389 A SG 1997001389A SG 1997001389 A SG1997001389 A SG 1997001389A SG 64985 A1 SG64985 A1 SG 64985A1
Authority
SG
Singapore
Prior art keywords
plastic packages
moulding plastic
moulding
packages
plastic
Prior art date
Application number
SG1997001389A
Other languages
English (en)
Inventor
Hwee Seng Jimmy Chew
Peng Hui Tan
Original Assignee
Advanced Systems Automation Li
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation Li filed Critical Advanced Systems Automation Li
Priority to SG1997001389A priority Critical patent/SG64985A1/en
Priority to TW087106204A priority patent/TW407097B/zh
Priority to MYPI98001933A priority patent/MY132795A/en
Priority to JP53235398A priority patent/JP4162720B2/ja
Priority to PCT/SG1998/000032 priority patent/WO1998050216A1/en
Priority to DE69828163T priority patent/DE69828163T2/de
Priority to CN98804825A priority patent/CN1255082A/zh
Priority to EP98920815A priority patent/EP0980305B1/de
Publication of SG64985A1 publication Critical patent/SG64985A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
SG1997001389A 1997-05-06 1997-05-06 Method and apparatus for moulding plastic packages SG64985A1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SG1997001389A SG64985A1 (en) 1997-05-06 1997-05-06 Method and apparatus for moulding plastic packages
TW087106204A TW407097B (en) 1997-05-06 1998-04-22 Method and apparatus for molding plastic packages
MYPI98001933A MY132795A (en) 1997-05-06 1998-04-29 Method and apparatus for molding plastic packages
JP53235398A JP4162720B2 (ja) 1997-05-06 1998-05-02 半導体装置をカプセル化するシステムおよび方法
PCT/SG1998/000032 WO1998050216A1 (en) 1997-05-06 1998-05-02 Method and apparatus for molding plastic packages
DE69828163T DE69828163T2 (de) 1997-05-06 1998-05-02 Gerät zum formen von kunststoffverpackungen
CN98804825A CN1255082A (zh) 1997-05-06 1998-05-02 塑胶封装的模制方法与设备
EP98920815A EP0980305B1 (de) 1997-05-06 1998-05-02 Gerät zum formen von kunststoffverpackungen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG1997001389A SG64985A1 (en) 1997-05-06 1997-05-06 Method and apparatus for moulding plastic packages

Publications (1)

Publication Number Publication Date
SG64985A1 true SG64985A1 (en) 1999-05-25

Family

ID=20429640

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997001389A SG64985A1 (en) 1997-05-06 1997-05-06 Method and apparatus for moulding plastic packages

Country Status (8)

Country Link
EP (1) EP0980305B1 (de)
JP (1) JP4162720B2 (de)
CN (1) CN1255082A (de)
DE (1) DE69828163T2 (de)
MY (1) MY132795A (de)
SG (1) SG64985A1 (de)
TW (1) TW407097B (de)
WO (1) WO1998050216A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6869556B2 (en) 2002-07-16 2005-03-22 Asm Technology Singapore Pte Ltd. Molding system for semiconductor packages
TWI384597B (zh) 2009-04-09 2013-02-01 日月光半導體製造股份有限公司 封裝結構及封裝其之封膠模組與封膠模具
CN101859690B (zh) * 2009-04-10 2012-09-05 日月光半导体制造股份有限公司 封装结构及封装其的封胶模块与封胶模具
CN102294781A (zh) * 2010-06-22 2011-12-28 禾晶能源科技股份有限公司 太阳能镜片多穴射出成型的方法
CN102285058B (zh) * 2011-05-24 2014-01-15 四川钟顺太阳能开发有限公司 玻璃基硅胶复眼聚光器生产工艺及其专用模具
CN103587033A (zh) * 2012-08-16 2014-02-19 汉达精密电子(昆山)有限公司 外观装饰效果处理方法及其产品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3650648A (en) * 1970-02-25 1972-03-21 Union Carbide Corp System for molding electronic components
US4332537A (en) * 1978-07-17 1982-06-01 Dusan Slepcevic Encapsulation mold with removable cavity plates
US4442056A (en) * 1980-12-06 1984-04-10 Dusan Slepcevic Encapsulation mold with gate plate and method of using same
FR2598258B1 (fr) * 1986-04-30 1988-10-07 Aix Les Bains Composants Procede d'encapsulation de circuits integres.
US5155578A (en) * 1991-04-26 1992-10-13 Texas Instruments Incorporated Bond wire configuration and injection mold for minimum wire sweep in plastic IC packages
DE69519259T2 (de) * 1994-01-13 2001-05-17 Citizen Watch Co., Ltd. Verfahren zum harzversiegeln von halbleiterbauteilen

Also Published As

Publication number Publication date
JP2001522526A (ja) 2001-11-13
MY132795A (en) 2007-10-31
TW407097B (en) 2000-10-01
DE69828163D1 (de) 2005-01-20
EP0980305B1 (de) 2004-12-15
EP0980305A1 (de) 2000-02-23
DE69828163T2 (de) 2005-12-29
EP0980305A4 (de) 2001-08-16
CN1255082A (zh) 2000-05-31
WO1998050216A1 (en) 1998-11-12
JP4162720B2 (ja) 2008-10-08

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