SG66313A1 - Method and apparatus for reducing warpage in semiconductor - Google Patents

Method and apparatus for reducing warpage in semiconductor

Info

Publication number
SG66313A1
SG66313A1 SG1996010110A SG1996010110A SG66313A1 SG 66313 A1 SG66313 A1 SG 66313A1 SG 1996010110 A SG1996010110 A SG 1996010110A SG 1996010110 A SG1996010110 A SG 1996010110A SG 66313 A1 SG66313 A1 SG 66313A1
Authority
SG
Singapore
Prior art keywords
semiconductor
reducing warpage
warpage
reducing
Prior art date
Application number
SG1996010110A
Other languages
English (en)
Inventor
Tan Kok Ping
Wong Siew Kong
Original Assignee
Advanced Systems Automation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation filed Critical Advanced Systems Automation
Priority to SG1996010110A priority Critical patent/SG66313A1/en
Priority to EP97929665A priority patent/EP0907962A4/de
Priority to PCT/SG1997/000026 priority patent/WO1997049127A1/en
Priority to TW086108575A priority patent/TW420851B/zh
Priority to US08/878,652 priority patent/US6013541A/en
Publication of SG66313A1 publication Critical patent/SG66313A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
SG1996010110A 1996-06-20 1996-06-20 Method and apparatus for reducing warpage in semiconductor SG66313A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SG1996010110A SG66313A1 (en) 1996-06-20 1996-06-20 Method and apparatus for reducing warpage in semiconductor
EP97929665A EP0907962A4 (de) 1996-06-20 1997-06-18 Methode und vorrichtung zur reduktion der verwerfung von halbleitergehäusen
PCT/SG1997/000026 WO1997049127A1 (en) 1996-06-20 1997-06-18 Method and apparatus for reducing warpage in semiconductor packages
TW086108575A TW420851B (en) 1996-06-20 1997-06-19 Method and apparatus for reducing warpage in semiconductor packages
US08/878,652 US6013541A (en) 1996-06-20 1997-06-19 Method and apparatus for reducing warpage in semiconductor packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG1996010110A SG66313A1 (en) 1996-06-20 1996-06-20 Method and apparatus for reducing warpage in semiconductor

Publications (1)

Publication Number Publication Date
SG66313A1 true SG66313A1 (en) 2001-01-16

Family

ID=20429421

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996010110A SG66313A1 (en) 1996-06-20 1996-06-20 Method and apparatus for reducing warpage in semiconductor

Country Status (5)

Country Link
US (1) US6013541A (de)
EP (1) EP0907962A4 (de)
SG (1) SG66313A1 (de)
TW (1) TW420851B (de)
WO (1) WO1997049127A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6429385B1 (en) * 2000-08-08 2002-08-06 Micron Technology, Inc. Non-continuous conductive layer for laminated substrates
US6988879B2 (en) * 2002-10-18 2006-01-24 Asm Technology Singapore Pte Ltd Apparatus and method for reducing substrate warpage
US7172927B2 (en) * 2003-12-18 2007-02-06 Freescale Semiconductor, Inc. Warpage control of array packaging
US7214548B2 (en) * 2004-08-30 2007-05-08 International Business Machines Corporation Apparatus and method for flattening a warped substrate
US7803662B2 (en) * 2007-09-24 2010-09-28 Freescale Semiconductor, Inc. Warpage control using a package carrier assembly
CA2713422A1 (en) * 2010-09-09 2010-11-16 Ibm Canada Limited - Ibm Canada Limitee Characterizing laminate shape
US8444043B1 (en) 2012-01-31 2013-05-21 International Business Machines Corporation Uniform solder reflow fixture
KR101776449B1 (ko) * 2014-09-27 2017-09-07 인텔 코포레이션 단방향성 가열을 갖는 강화 유리를 이용한 기판 휘어짐 제어
CN105870043A (zh) * 2016-06-16 2016-08-17 苏州工业职业技术学院 一种用于防止引线框架翘曲的装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6457630A (en) * 1987-08-28 1989-03-03 Oki Electric Ind Co Ltd Method and device for preventing warpage of semiconductor device
JPH05226397A (ja) * 1992-02-14 1993-09-03 Toshiba Corp 半導体用熱硬化型自動モールド装置
KR970005713B1 (en) * 1992-07-31 1997-04-19 Nec Kk Process for correcting warped surface of plastic encapsulated semiconductor device
JP3139853B2 (ja) * 1992-09-05 2001-03-05 アピックヤマダ株式会社 樹脂モールドパッケージの徐冷装置
US5641997A (en) * 1993-09-14 1997-06-24 Kabushiki Kaisha Toshiba Plastic-encapsulated semiconductor device
US6388338B1 (en) * 1995-04-28 2002-05-14 Stmicroelectronics Plastic package for an integrated electronic semiconductor device
JPH08213418A (ja) * 1995-02-02 1996-08-20 Hitachi Ltd 半導体装置の製造方法およびその製造方法に用いるモールド金型
JP3099707B2 (ja) * 1995-11-30 2000-10-16 日本電気株式会社 半導体装置の樹脂封止装置
US5825623A (en) * 1995-12-08 1998-10-20 Vlsi Technology, Inc. Packaging assemblies for encapsulated integrated circuit devices

Also Published As

Publication number Publication date
WO1997049127A1 (en) 1997-12-24
EP0907962A1 (de) 1999-04-14
US6013541A (en) 2000-01-11
EP0907962A4 (de) 2000-02-02
TW420851B (en) 2001-02-01

Similar Documents

Publication Publication Date Title
GB2318998B (en) Apparatus and method for polishing semiconductor device
AU5005897A (en) Method and apparatus for improving wireability in chip modules
SG93851A1 (en) Method and apparatus for processing semiconductor substrates
EP0758941A4 (de) Verfahren und vorrichtung zum polieren einer halbleiterscheibe
GB2292254B (en) Method for polishing semiconductor substrate and apparatus for the same
GB2295923B (en) Method and apparatus for manufacturing semiconductor device
SG60162A1 (en) Method and device for polishing semiconductor wafers
AU3550597A (en) Apparatus and method for polishing semiconductor devices
SG64992A1 (en) Processing apparatus and processing method
PL318185A1 (en) Cooling method and apparatus
SG67439A1 (en) Apparatus and method for washing substrate
SG63826A1 (en) Substrate processing apparatus and method
GB2313954B (en) Semiconductor device and method for manufacturing same
SG72766A1 (en) Method and apparatus for processing resist
GB2319532B (en) Method and apparatus for treating a semiconductor wafer
GB9907854D0 (en) Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
SG53055A1 (en) Method and apparatus for manufacturing semiconductor devices
SG50841A1 (en) Apparatus and method for texturing rigid-disk substrates
SG67433A1 (en) Method and apparatus for processing substrate
GB2289982B (en) Apparatus and method for manufacturing wafer
SG49957A1 (en) Pick-up apparatus and method for semiconductor chips
GB9500996D0 (en) Semiconductor device and method for fabrication thereof
GB9608352D0 (en) Workpiece grinding method and apparatus
GB9509095D0 (en) Semiconductor device and method for fabrication thereof
GB2332637B (en) Apparatus and method for processing