SG66487A1 - Wafer polishing apparatus - Google Patents

Wafer polishing apparatus

Info

Publication number
SG66487A1
SG66487A1 SG1998001608A SG1998001608A SG66487A1 SG 66487 A1 SG66487 A1 SG 66487A1 SG 1998001608 A SG1998001608 A SG 1998001608A SG 1998001608 A SG1998001608 A SG 1998001608A SG 66487 A1 SG66487 A1 SG 66487A1
Authority
SG
Singapore
Prior art keywords
polishing apparatus
wafer polishing
wafer
polishing
Prior art date
Application number
SG1998001608A
Other languages
English (en)
Inventor
Takao Inaba
Minoru Numoto
Kenji Sakai
Manabu Satoh
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of SG66487A1 publication Critical patent/SG66487A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/06—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent requiring comparison of the workpiece with standard gauging plugs, rings or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG1998001608A 1997-07-11 1998-07-09 Wafer polishing apparatus SG66487A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP18645897 1997-07-11
JP19418597 1997-07-18
JP30035897 1997-10-31

Publications (1)

Publication Number Publication Date
SG66487A1 true SG66487A1 (en) 1999-07-20

Family

ID=27325752

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998001608A SG66487A1 (en) 1997-07-11 1998-07-09 Wafer polishing apparatus

Country Status (6)

Country Link
US (3) US6059636A (fr)
EP (1) EP0890416A3 (fr)
KR (1) KR100508529B1 (fr)
MY (1) MY120159A (fr)
SG (1) SG66487A1 (fr)
TW (1) TW436369B (fr)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW434096B (en) * 1997-08-11 2001-05-16 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
TW434095B (en) * 1997-08-11 2001-05-16 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
GB2380960B (en) * 1998-10-16 2003-06-04 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
US7069101B1 (en) * 1999-07-29 2006-06-27 Applied Materials, Inc. Computer integrated manufacturing techniques
US6628397B1 (en) 1999-09-15 2003-09-30 Kla-Tencor Apparatus and methods for performing self-clearing optical measurements
US6671051B1 (en) 1999-09-15 2003-12-30 Kla-Tencor Apparatus and methods for detecting killer particles during chemical mechanical polishing
US6287173B1 (en) * 2000-01-11 2001-09-11 Lucent Technologies, Inc. Longer lifetime warm-up wafers for polishing systems
US6616513B1 (en) 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
JP2001338901A (ja) * 2000-05-26 2001-12-07 Hitachi Ltd 平坦化加工方法及び、装置並びに，半導体装置の製造方法
US7481695B2 (en) * 2000-08-22 2009-01-27 Lam Research Corporation Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
US6585572B1 (en) 2000-08-22 2003-07-01 Lam Research Corporation Subaperture chemical mechanical polishing system
US6572444B1 (en) * 2000-08-31 2003-06-03 Micron Technology, Inc. Apparatus and methods of automated wafer-grinding using grinding surface position monitoring
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
JP3520916B2 (ja) * 2000-12-25 2004-04-19 株式会社東京精密 ウェーハ研磨装置
US20020128735A1 (en) * 2001-03-08 2002-09-12 Hawkins Parris C.M. Dynamic and extensible task guide
US7047099B2 (en) * 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US7082345B2 (en) * 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US20020192966A1 (en) * 2001-06-19 2002-12-19 Shanmugasundram Arulkumar P. In situ sensor based control of semiconductor processing procedure
US6913938B2 (en) 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7201936B2 (en) 2001-06-19 2007-04-10 Applied Materials, Inc. Method of feedback control of sub-atmospheric chemical vapor deposition processes
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US6910947B2 (en) * 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US6514775B2 (en) 2001-06-29 2003-02-04 Kla-Tencor Technologies Corporation In-situ end point detection for semiconductor wafer polishing
US7337019B2 (en) * 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6950716B2 (en) * 2001-08-13 2005-09-27 Applied Materials, Inc. Dynamic control of wafer processing paths in semiconductor manufacturing processes
US20030037090A1 (en) * 2001-08-14 2003-02-20 Koh Horne L. Tool services layer for providing tool service functions in conjunction with tool functions
US6984198B2 (en) * 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
US20030182015A1 (en) * 2002-03-19 2003-09-25 Domaille Michael D. Polisher
US7225047B2 (en) 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
US6937915B1 (en) * 2002-03-28 2005-08-30 Lam Research Corporation Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
JP2005535130A (ja) * 2002-08-01 2005-11-17 アプライド マテリアルズ インコーポレイテッド 最新のプロセス制御システム内で誤って表された計測データを取り扱う方法、システム、および媒体
US20040063224A1 (en) * 2002-09-18 2004-04-01 Applied Materials, Inc. Feedback control of a chemical mechanical polishing process for multi-layered films
US6776688B2 (en) * 2002-10-21 2004-08-17 Texas Instruments Incorporated Real-time polishing pad stiffness-control using magnetically controllable fluid
AU2003290932A1 (en) * 2002-11-15 2004-06-15 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US7333871B2 (en) 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
DE10305711B4 (de) * 2003-02-12 2005-09-01 Infineon Technologies Ag Gimpelhalter und chemisch-mechanische Polieranlage mit einem solchen Gimpelhalter
US7205228B2 (en) 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US7354332B2 (en) 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
JP3838572B2 (ja) * 2003-09-03 2006-10-25 松下電器産業株式会社 固体撮像装置およびその製造方法
US7356377B2 (en) 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US7264535B2 (en) * 2004-04-23 2007-09-04 Hitachi Global Storage Technologies Netherlands, B.V. Run-to-run control of backside pressure for CMP radial uniformity optimization based on center-to-edge model
US7096085B2 (en) 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
KR100716935B1 (ko) * 2005-11-25 2007-05-14 두산디앤디 주식회사 반도체 웨이퍼의 화학기계적 연마장치용 로딩디바이스
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
US8142261B1 (en) 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
US7473162B1 (en) * 2006-02-06 2009-01-06 Chien-Min Sung Pad conditioner dresser with varying pressure
US7846007B2 (en) * 2006-06-30 2010-12-07 Memc Electronic Materials, Inc. System and method for dressing a wafer polishing pad
US7846006B2 (en) * 2006-06-30 2010-12-07 Memc Electronic Materials, Inc. Dressing a wafer polishing pad
US20090127231A1 (en) * 2007-11-08 2009-05-21 Chien-Min Sung Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby
KR100862607B1 (ko) * 2008-01-22 2008-10-09 주식회사 엔티에스 사파이어 웨이퍼 후면 연마 장치
KR101240609B1 (ko) * 2010-06-15 2013-03-06 삼성중공업 주식회사 연마장치
KR20150085000A (ko) 2012-11-16 2015-07-22 어플라이드 머티어리얼스, 인코포레이티드 캐리어 헤드용 센서들에 의한 기록 측정들
JP6033751B2 (ja) * 2013-10-07 2016-11-30 株式会社荏原製作所 研磨方法
JP2015220402A (ja) * 2014-05-20 2015-12-07 株式会社荏原製作所 基板洗浄装置および基板洗浄装置で実行される方法
KR102668400B1 (ko) * 2017-01-05 2024-05-24 주식회사 케이씨텍 화학 기계적 연마장치
KR102677387B1 (ko) * 2018-03-13 2024-06-24 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마 동안 진동들의 모니터링

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4712334A (en) * 1985-09-05 1987-12-15 Toshiba Tungaloy Co., Inc. Anti-clogging device for grinding wheel
JPH03169265A (ja) * 1989-11-27 1991-07-22 Matsushita Electric Works Ltd インバータ装置
US5154021A (en) * 1991-06-26 1992-10-13 International Business Machines Corporation Pneumatic pad conditioner
US5205082A (en) * 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5607718A (en) * 1993-03-26 1997-03-04 Kabushiki Kaisha Toshiba Polishing method and polishing apparatus
US5658183A (en) * 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5820448A (en) * 1993-12-27 1998-10-13 Applied Materials, Inc. Carrier head with a layer of conformable material for a chemical mechanical polishing system
US5664987A (en) * 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization
JP3158934B2 (ja) * 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
US5609516A (en) * 1995-09-25 1997-03-11 Courson; Michael W. Rotating abrader with polygonal pad and dust evacuation
US5658190A (en) * 1995-12-15 1997-08-19 Micron Technology, Inc. Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers
DE69717510T2 (de) * 1996-01-24 2003-10-02 Lam Research Corp., Fremont Halbleiterscheiben-Polierkopf
US5762539A (en) * 1996-02-27 1998-06-09 Ebara Corporation Apparatus for and method for polishing workpiece
JP3663728B2 (ja) * 1996-03-28 2005-06-22 信越半導体株式会社 薄板の研磨機
JPH1015807A (ja) * 1996-07-01 1998-01-20 Canon Inc 研磨システム
JPH1071560A (ja) * 1996-08-27 1998-03-17 Speedfam Co Ltd ウエハ加圧装置
JP3788533B2 (ja) * 1996-09-30 2006-06-21 東京エレクトロン株式会社 研磨装置および研磨方法
JP3582554B2 (ja) * 1996-12-17 2004-10-27 株式会社東京精密 ウェーハ研磨量測定装置
KR100475845B1 (ko) * 1997-04-04 2005-06-17 도쿄 세이미츄 코퍼레이션 리미티드 연마장치
US5834377A (en) * 1997-04-07 1998-11-10 Industrial Technology Research Institute In situ method for CMP endpoint detection
US5882243A (en) * 1997-04-24 1999-03-16 Motorola, Inc. Method for polishing a semiconductor wafer using dynamic control
EP0881039B1 (fr) * 1997-05-28 2003-04-16 Tokyo Seimitsu Co.,Ltd. Dispositif de polissage de plaquette semiconductrice avec anneau de maintien

Also Published As

Publication number Publication date
US6059636A (en) 2000-05-09
EP0890416A2 (fr) 1999-01-13
MY120159A (en) 2005-09-30
TW436369B (en) 2001-05-28
KR19990013784A (ko) 1999-02-25
KR100508529B1 (ko) 2005-11-22
US6354914B1 (en) 2002-03-12
EP0890416A3 (fr) 2002-09-11
US6302762B1 (en) 2001-10-16

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