SG67441A1 - Processing system - Google Patents

Processing system

Info

Publication number
SG67441A1
SG67441A1 SG1997004074A SG1997004074A SG67441A1 SG 67441 A1 SG67441 A1 SG 67441A1 SG 1997004074 A SG1997004074 A SG 1997004074A SG 1997004074 A SG1997004074 A SG 1997004074A SG 67441 A1 SG67441 A1 SG 67441A1
Authority
SG
Singapore
Prior art keywords
processing system
processing
Prior art date
Application number
SG1997004074A
Other languages
English (en)
Inventor
Masami Akimoto
Issei Ueda
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG67441A1 publication Critical patent/SG67441A1/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/136Associated with semiconductor wafer handling including wafer orienting means
SG1997004074A 1996-11-19 1997-11-17 Processing system SG67441A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32340396A JP3774283B2 (ja) 1996-11-19 1996-11-19 処理システム

Publications (1)

Publication Number Publication Date
SG67441A1 true SG67441A1 (en) 1999-09-21

Family

ID=18154334

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997004074A SG67441A1 (en) 1996-11-19 1997-11-17 Processing system

Country Status (6)

Country Link
US (2) US6126703A (fr)
EP (1) EP0843343B1 (fr)
JP (1) JP3774283B2 (fr)
DE (1) DE69719151T2 (fr)
SG (1) SG67441A1 (fr)
TW (1) TW354406B (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3926890B2 (ja) * 1997-06-11 2007-06-06 東京エレクトロン株式会社 処理システム
US6533531B1 (en) * 1998-12-29 2003-03-18 Asml Us, Inc. Device for handling wafers in microelectronic manufacturing
US6293713B1 (en) * 1999-07-02 2001-09-25 Tokyo Electron Limited Substrate processing apparatus
JP3635214B2 (ja) * 1999-07-05 2005-04-06 東京エレクトロン株式会社 基板処理装置
SG185822A1 (en) 2000-02-01 2012-12-28 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
US6395648B1 (en) 2000-02-25 2002-05-28 Wafermasters, Inc. Wafer processing system
JP3943828B2 (ja) * 2000-12-08 2007-07-11 東京エレクトロン株式会社 塗布、現像装置及びパターン形成方法
JP3916473B2 (ja) * 2002-01-31 2007-05-16 東京エレクトロン株式会社 基板処理装置および基板処理方法
US20030168175A1 (en) * 2002-03-08 2003-09-11 Kim Kyung-Tae Substrate alignment apparatus
DE10217028C1 (de) * 2002-04-11 2003-11-20 Nanophotonics Ag Meßmodul für Waferfertigungsanlagen
WO2006124472A2 (fr) * 2005-05-12 2006-11-23 Applied Materials, Inc. Procede et appareil permettant le transport vertical de substrats semi-conducteurs dans un module de nettoyage
JP5132920B2 (ja) * 2006-11-22 2013-01-30 東京エレクトロン株式会社 塗布・現像装置および基板搬送方法、ならびにコンピュータプログラム
JP4853374B2 (ja) * 2007-04-27 2012-01-11 東京エレクトロン株式会社 塗布、現像装置及びその方法並びに記憶媒体
JP4464993B2 (ja) * 2007-06-29 2010-05-19 東京エレクトロン株式会社 基板の処理システム
JP4684268B2 (ja) * 2007-08-30 2011-05-18 株式会社アルバック 真空処理装置、基板搬送方法
KR101681185B1 (ko) * 2014-11-04 2016-12-02 세메스 주식회사 인터페이스 모듈 및 이를 포함하는 기판 처리 장치 및 방법
CN110817391B (zh) * 2019-11-24 2021-09-07 湖南凯通电子有限公司 基板装卸机

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584045A (en) * 1984-02-21 1986-04-22 Plasma-Therm, Inc. Apparatus for conveying a semiconductor wafer
JPS61123150A (ja) * 1985-10-23 1986-06-11 Hitachi Ltd 製造装置
JPS62213259A (ja) * 1986-03-14 1987-09-19 Shinkawa Ltd バツフア装置
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
US5030057A (en) * 1987-11-06 1991-07-09 Tel Sagami Limited Semiconductor wafer transferring method and apparatus and boat for thermal treatment of a semiconductor wafer
JPH0617295Y2 (ja) * 1987-11-27 1994-05-02 大日本スクリーン製造株式会社 基板受け渡し装置
KR970003907B1 (ko) * 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 기판처리 장치 및 기판처리 방법
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
US5024570A (en) * 1988-09-14 1991-06-18 Fujitsu Limited Continuous semiconductor substrate processing system
US5061144A (en) * 1988-11-30 1991-10-29 Tokyo Electron Limited Resist process apparatus
JPH04209110A (ja) * 1990-11-30 1992-07-30 Matsushita Electric Ind Co Ltd バッファー装置
KR970011065B1 (ko) * 1992-12-21 1997-07-05 다이닛뽕 스크린 세이조오 가부시키가이샤 기판처리장치와 기판처리장치에 있어서 기판교환장치 및 기판교환방법
JPH07164273A (ja) * 1993-12-16 1995-06-27 Deisuko Eng Service:Kk 2層テーブルを有する搬出入装置
JPH07297258A (ja) * 1994-04-26 1995-11-10 Tokyo Electron Ltd 板状体の搬送装置
US5826129A (en) * 1994-06-30 1998-10-20 Tokyo Electron Limited Substrate processing system
TW297910B (fr) * 1995-02-02 1997-02-11 Tokyo Electron Co Ltd
JP3734295B2 (ja) * 1995-09-04 2006-01-11 大日本スクリーン製造株式会社 基板搬送装置
US5788868A (en) * 1995-09-04 1998-08-04 Dainippon Screen Mfg. Co., Ltd. Substrate transfer method and interface apparatus

Also Published As

Publication number Publication date
JPH10150089A (ja) 1998-06-02
DE69719151T2 (de) 2003-12-04
EP0843343B1 (fr) 2003-02-19
EP0843343A2 (fr) 1998-05-20
US6126703A (en) 2000-10-03
DE69719151D1 (de) 2003-03-27
TW354406B (en) 1999-03-11
US6264705B1 (en) 2001-07-24
JP3774283B2 (ja) 2006-05-10
EP0843343A3 (fr) 2000-01-12

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