SG67441A1 - Processing system - Google Patents
Processing systemInfo
- Publication number
- SG67441A1 SG67441A1 SG1997004074A SG1997004074A SG67441A1 SG 67441 A1 SG67441 A1 SG 67441A1 SG 1997004074 A SG1997004074 A SG 1997004074A SG 1997004074 A SG1997004074 A SG 1997004074A SG 67441 A1 SG67441 A1 SG 67441A1
- Authority
- SG
- Singapore
- Prior art keywords
- processing system
- processing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32340396A JP3774283B2 (ja) | 1996-11-19 | 1996-11-19 | 処理システム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG67441A1 true SG67441A1 (en) | 1999-09-21 |
Family
ID=18154334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG1997004074A SG67441A1 (en) | 1996-11-19 | 1997-11-17 | Processing system |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6126703A (fr) |
| EP (1) | EP0843343B1 (fr) |
| JP (1) | JP3774283B2 (fr) |
| DE (1) | DE69719151T2 (fr) |
| SG (1) | SG67441A1 (fr) |
| TW (1) | TW354406B (fr) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3926890B2 (ja) * | 1997-06-11 | 2007-06-06 | 東京エレクトロン株式会社 | 処理システム |
| US6533531B1 (en) * | 1998-12-29 | 2003-03-18 | Asml Us, Inc. | Device for handling wafers in microelectronic manufacturing |
| US6293713B1 (en) * | 1999-07-02 | 2001-09-25 | Tokyo Electron Limited | Substrate processing apparatus |
| JP3635214B2 (ja) * | 1999-07-05 | 2005-04-06 | 東京エレクトロン株式会社 | 基板処理装置 |
| SG185822A1 (en) | 2000-02-01 | 2012-12-28 | Tokyo Electron Ltd | Substrate processing apparatus and substrate processing method |
| US6395648B1 (en) | 2000-02-25 | 2002-05-28 | Wafermasters, Inc. | Wafer processing system |
| JP3943828B2 (ja) * | 2000-12-08 | 2007-07-11 | 東京エレクトロン株式会社 | 塗布、現像装置及びパターン形成方法 |
| JP3916473B2 (ja) * | 2002-01-31 | 2007-05-16 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| US20030168175A1 (en) * | 2002-03-08 | 2003-09-11 | Kim Kyung-Tae | Substrate alignment apparatus |
| DE10217028C1 (de) * | 2002-04-11 | 2003-11-20 | Nanophotonics Ag | Meßmodul für Waferfertigungsanlagen |
| WO2006124472A2 (fr) * | 2005-05-12 | 2006-11-23 | Applied Materials, Inc. | Procede et appareil permettant le transport vertical de substrats semi-conducteurs dans un module de nettoyage |
| JP5132920B2 (ja) * | 2006-11-22 | 2013-01-30 | 東京エレクトロン株式会社 | 塗布・現像装置および基板搬送方法、ならびにコンピュータプログラム |
| JP4853374B2 (ja) * | 2007-04-27 | 2012-01-11 | 東京エレクトロン株式会社 | 塗布、現像装置及びその方法並びに記憶媒体 |
| JP4464993B2 (ja) * | 2007-06-29 | 2010-05-19 | 東京エレクトロン株式会社 | 基板の処理システム |
| JP4684268B2 (ja) * | 2007-08-30 | 2011-05-18 | 株式会社アルバック | 真空処理装置、基板搬送方法 |
| KR101681185B1 (ko) * | 2014-11-04 | 2016-12-02 | 세메스 주식회사 | 인터페이스 모듈 및 이를 포함하는 기판 처리 장치 및 방법 |
| CN110817391B (zh) * | 2019-11-24 | 2021-09-07 | 湖南凯通电子有限公司 | 基板装卸机 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4584045A (en) * | 1984-02-21 | 1986-04-22 | Plasma-Therm, Inc. | Apparatus for conveying a semiconductor wafer |
| JPS61123150A (ja) * | 1985-10-23 | 1986-06-11 | Hitachi Ltd | 製造装置 |
| JPS62213259A (ja) * | 1986-03-14 | 1987-09-19 | Shinkawa Ltd | バツフア装置 |
| US4917556A (en) * | 1986-04-28 | 1990-04-17 | Varian Associates, Inc. | Modular wafer transport and processing system |
| US5030057A (en) * | 1987-11-06 | 1991-07-09 | Tel Sagami Limited | Semiconductor wafer transferring method and apparatus and boat for thermal treatment of a semiconductor wafer |
| JPH0617295Y2 (ja) * | 1987-11-27 | 1994-05-02 | 大日本スクリーン製造株式会社 | 基板受け渡し装置 |
| KR970003907B1 (ko) * | 1988-02-12 | 1997-03-22 | 도오교오 에레구토론 가부시끼 가이샤 | 기판처리 장치 및 기판처리 방법 |
| US5202716A (en) * | 1988-02-12 | 1993-04-13 | Tokyo Electron Limited | Resist process system |
| US5024570A (en) * | 1988-09-14 | 1991-06-18 | Fujitsu Limited | Continuous semiconductor substrate processing system |
| US5061144A (en) * | 1988-11-30 | 1991-10-29 | Tokyo Electron Limited | Resist process apparatus |
| JPH04209110A (ja) * | 1990-11-30 | 1992-07-30 | Matsushita Electric Ind Co Ltd | バッファー装置 |
| KR970011065B1 (ko) * | 1992-12-21 | 1997-07-05 | 다이닛뽕 스크린 세이조오 가부시키가이샤 | 기판처리장치와 기판처리장치에 있어서 기판교환장치 및 기판교환방법 |
| JPH07164273A (ja) * | 1993-12-16 | 1995-06-27 | Deisuko Eng Service:Kk | 2層テーブルを有する搬出入装置 |
| JPH07297258A (ja) * | 1994-04-26 | 1995-11-10 | Tokyo Electron Ltd | 板状体の搬送装置 |
| US5826129A (en) * | 1994-06-30 | 1998-10-20 | Tokyo Electron Limited | Substrate processing system |
| TW297910B (fr) * | 1995-02-02 | 1997-02-11 | Tokyo Electron Co Ltd | |
| JP3734295B2 (ja) * | 1995-09-04 | 2006-01-11 | 大日本スクリーン製造株式会社 | 基板搬送装置 |
| US5788868A (en) * | 1995-09-04 | 1998-08-04 | Dainippon Screen Mfg. Co., Ltd. | Substrate transfer method and interface apparatus |
-
1996
- 1996-11-19 JP JP32340396A patent/JP3774283B2/ja not_active Expired - Fee Related
-
1997
- 1997-11-11 TW TW086116851A patent/TW354406B/zh not_active IP Right Cessation
- 1997-11-17 SG SG1997004074A patent/SG67441A1/en unknown
- 1997-11-17 US US08/972,150 patent/US6126703A/en not_active Expired - Fee Related
- 1997-11-18 DE DE69719151T patent/DE69719151T2/de not_active Expired - Lifetime
- 1997-11-18 EP EP97120153A patent/EP0843343B1/fr not_active Expired - Lifetime
-
1999
- 1999-12-27 US US09/472,199 patent/US6264705B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10150089A (ja) | 1998-06-02 |
| DE69719151T2 (de) | 2003-12-04 |
| EP0843343B1 (fr) | 2003-02-19 |
| EP0843343A2 (fr) | 1998-05-20 |
| US6126703A (en) | 2000-10-03 |
| DE69719151D1 (de) | 2003-03-27 |
| TW354406B (en) | 1999-03-11 |
| US6264705B1 (en) | 2001-07-24 |
| JP3774283B2 (ja) | 2006-05-10 |
| EP0843343A3 (fr) | 2000-01-12 |
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