SG68050A1 - Method of reforming a tip portion of a probe - Google Patents

Method of reforming a tip portion of a probe

Info

Publication number
SG68050A1
SG68050A1 SG1998001058A SG1998001058A SG68050A1 SG 68050 A1 SG68050 A1 SG 68050A1 SG 1998001058 A SG1998001058 A SG 1998001058A SG 1998001058 A SG1998001058 A SG 1998001058A SG 68050 A1 SG68050 A1 SG 68050A1
Authority
SG
Singapore
Prior art keywords
reforming
probe
tip portion
tip
Prior art date
Application number
SG1998001058A
Other languages
English (en)
Inventor
Masao Okubo
Kazumasa Okubo
Hiroshi Iwata
Original Assignee
Japan Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials filed Critical Japan Electronic Materials
Publication of SG68050A1 publication Critical patent/SG68050A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG1998001058A 1997-07-24 1998-05-15 Method of reforming a tip portion of a probe SG68050A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19833197A JP3164535B2 (ja) 1997-07-24 1997-07-24 プローブ先端部の改質方法

Publications (1)

Publication Number Publication Date
SG68050A1 true SG68050A1 (en) 1999-10-19

Family

ID=16389342

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998001058A SG68050A1 (en) 1997-07-24 1998-05-15 Method of reforming a tip portion of a probe

Country Status (5)

Country Link
US (1) US6013169A (de)
EP (1) EP0893694A3 (de)
JP (1) JP3164535B2 (de)
SG (1) SG68050A1 (de)
TW (1) TW440693B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6777966B1 (en) * 1999-07-30 2004-08-17 International Test Solutions, Inc. Cleaning system, device and method
JP2001074777A (ja) 1999-08-31 2001-03-23 Kanai Hiroaki プローブカード用プローブ針
JP2002131334A (ja) 2000-10-24 2002-05-09 Nec Yamaguchi Ltd プローブ針、プローブカード、及びプローブカードの作製方法
US6908364B2 (en) * 2001-08-02 2005-06-21 Kulicke & Soffa Industries, Inc. Method and apparatus for probe tip cleaning and shaping pad
US7182672B2 (en) * 2001-08-02 2007-02-27 Sv Probe Pte. Ltd. Method of probe tip shaping and cleaning
US7183779B2 (en) * 2004-12-28 2007-02-27 Spectrum Technologies, Inc. Soil probe device and method of making same
CN100504398C (zh) * 2005-12-22 2009-06-24 王志忠 安装在测试卡上的探针表面处理的方法
US20080122470A1 (en) * 2006-11-27 2008-05-29 Wen-Yu Lu Probe installed to a probe card
JP5036892B2 (ja) 2010-05-10 2012-09-26 株式会社神戸製鋼所 コンタクトプローブ
CN102485947B (zh) * 2010-12-06 2013-09-25 杭州韩世通信电子有限公司 溅射靶表面含氧量的控制系统、探针及镀ito膜的pet板制造方法
US9459282B2 (en) * 2011-06-15 2016-10-04 Kobe Steel, Ltd. Electrical contact member
CN113701799B (zh) * 2021-08-31 2025-02-14 宁波大学 多功能原位表征和测试装置
CN115312452B (zh) * 2022-07-27 2025-09-02 上海华力集成电路制造有限公司 改善钨金属研磨后缺陷的方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2772227A (en) * 1953-06-29 1956-11-27 Westinghouse Electric Corp Protection of molybdenum and tungsten at high temperatures
US4101386A (en) * 1971-05-07 1978-07-18 Siemens Aktiengesellschaft Methods of coating and surface finishing articles made of metals and their alloys
GB1517702A (en) * 1974-09-19 1978-07-12 Fujitsu Ltd Electrical contact
US4523144A (en) * 1980-05-27 1985-06-11 Japan Electronic Materials Corp. Complex probe card for testing a semiconductor wafer
US4840711A (en) * 1981-01-13 1989-06-20 Metafuse Limited Process for the fusion of one element into a second element
JPS5929151B2 (ja) * 1981-08-03 1984-07-18 日本電子材料株式会社 半導体ウエハ−試験装置
JPS58121635A (ja) * 1982-01-12 1983-07-20 Nippon Telegr & Teleph Corp <Ntt> 結晶欠陥の非破壊検出方法
JPS61219415A (ja) * 1985-03-26 1986-09-29 Fuji Xerox Co Ltd コロナ放電電極の熱処理方法
US5214375A (en) * 1989-02-06 1993-05-25 Giga Probe, Inc. Multi-point probe assembly for testing electronic device
JP2723589B2 (ja) * 1989-02-16 1998-03-09 田中貴金属工業株式会社 Ｐｔ複合線の製造方法
US5134365A (en) * 1989-07-11 1992-07-28 Nihon Denshizairyo Kabushiki Kaisha Probe card in which contact pressure and relative position of each probe end are correctly maintained
US5055778A (en) * 1989-10-02 1991-10-08 Nihon Denshizairyo Kabushiki Kaisha Probe card in which contact pressure and relative position of each probe end are correctly maintained
JPH0550134A (ja) * 1991-03-13 1993-03-02 Mitsubishi Materials Corp リードバーの製造方法
JP3117767B2 (ja) * 1991-12-27 2000-12-18 株式会社野毛電気工業 めっきタングステン線材および線引き方法

Also Published As

Publication number Publication date
JP3164535B2 (ja) 2001-05-08
EP0893694A3 (de) 2002-09-25
US6013169A (en) 2000-01-11
EP0893694A2 (de) 1999-01-27
TW440693B (en) 2001-06-16
JPH1138039A (ja) 1999-02-12

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