SG70637A1 - Thermally stable dielectric coatings - Google Patents

Thermally stable dielectric coatings

Info

Publication number
SG70637A1
SG70637A1 SG1998001161A SG1998001161A SG70637A1 SG 70637 A1 SG70637 A1 SG 70637A1 SG 1998001161 A SG1998001161 A SG 1998001161A SG 1998001161 A SG1998001161 A SG 1998001161A SG 70637 A1 SG70637 A1 SG 70637A1
Authority
SG
Singapore
Prior art keywords
thermally stable
dielectric coatings
stable dielectric
coatings
thermally
Prior art date
Application number
SG1998001161A
Other languages
English (en)
Inventor
Jeffrey Nicholas Bremmer
Kyuha Chung
Chandan Kumar Saha
Michael John Spaulding
Original Assignee
Dow Corning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning filed Critical Dow Corning
Publication of SG70637A1 publication Critical patent/SG70637A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • H10P14/6925—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material comprising hydrogen silsesquioxane, e.g. HSQ
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/662—Laminate layers, e.g. stacks of alternating high-k metal oxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0209—Multistage baking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
    • H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
    • H10P14/6684—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen
    • H10P14/6686—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
SG1998001161A 1997-06-06 1998-06-01 Thermally stable dielectric coatings SG70637A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US87056497A 1997-06-06 1997-06-06

Publications (1)

Publication Number Publication Date
SG70637A1 true SG70637A1 (en) 2000-02-22

Family

ID=25355666

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998001161A SG70637A1 (en) 1997-06-06 1998-06-01 Thermally stable dielectric coatings

Country Status (7)

Country Link
US (1) US6210749B1 (fr)
EP (1) EP0883164A3 (fr)
JP (1) JPH1116899A (fr)
KR (1) KR19990006686A (fr)
CA (1) CA2239347A1 (fr)
SG (1) SG70637A1 (fr)
TW (1) TW392288B (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054379A (en) * 1998-02-11 2000-04-25 Applied Materials, Inc. Method of depositing a low k dielectric with organo silane
US6440895B1 (en) * 1998-07-27 2002-08-27 Battelle Memorial Institute Catalyst, method of making, and reactions using the catalyst
JP3125781B2 (ja) * 1999-03-03 2001-01-22 ヤマハ株式会社 半導体装置の製法
US6472076B1 (en) * 1999-10-18 2002-10-29 Honeywell International Inc. Deposition of organosilsesquioxane films
US6573131B2 (en) 2000-07-13 2003-06-03 The Regents Of The University Of California Silica zeolite low-k dielectric thin films and methods for their production
US7368804B2 (en) * 2003-05-16 2008-05-06 Infineon Technologies Ag Method and apparatus of stress relief in semiconductor structures
US20080249275A1 (en) * 2003-12-18 2008-10-09 Lichtenhan Joseph D Radiation shielding with polyhedral oligomeric silsesquioxanes and metallized additives
EP1756858A1 (fr) * 2004-06-08 2007-02-28 Koninklijke Philips Electronics N.V. Reduction de fissures dans des films a dielectrique appliquee par rotation a faible k
FI20125989A7 (fi) * 2012-09-24 2014-03-25 Optitune Oy Menetelmä valosähköisen laitteen valmistamiseksi
US9123577B2 (en) * 2012-12-12 2015-09-01 Sandisk Technologies Inc. Air gap isolation in non-volatile memory using sacrificial films
TWI490254B (zh) 2013-12-31 2015-07-01 Ind Tech Res Inst 無機鈍化塗料、其形成方法、及所形成之無機鈍化保護膜

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615272A (en) 1968-11-04 1971-10-26 Dow Corning Condensed soluble hydrogensilsesquioxane resin
JPS59178749A (ja) 1983-03-30 1984-10-11 Fujitsu Ltd 配線構造体
JPS6086017A (ja) 1983-10-17 1985-05-15 Fujitsu Ltd ポリハイドロジエンシルセスキオキサンの製法
JPS63107122A (ja) 1986-10-24 1988-05-12 Fujitsu Ltd 凹凸基板の平坦化方法
US4756977A (en) * 1986-12-03 1988-07-12 Dow Corning Corporation Multilayer ceramics from hydrogen silsesquioxane
US4822697A (en) 1986-12-03 1989-04-18 Dow Corning Corporation Platinum and rhodium catalysis of low temperature formation multilayer ceramics
US4808653A (en) 1986-12-04 1989-02-28 Dow Corning Corporation Coating composition containing hydrogen silsesquioxane resin and other metal oxide precursors
US5008320A (en) 1986-12-04 1991-04-16 Dow Corning Corporation Platinum or rhodium catalyzed multilayer ceramic coatings from hydrogen silsesquioxane resin and metal oxides
NL8802047A (nl) 1988-08-18 1990-03-16 Philips Nv Werkwijze voor het selectief op een substraat aanbrengen van een metaal uit de vloeistoffase met behulp van een laser.
US4981724A (en) * 1988-10-27 1991-01-01 Hochberg Arthur K Deposition of silicon oxide films using alkylsilane liquid sources
US4999397A (en) 1989-07-28 1991-03-12 Dow Corning Corporation Metastable silane hydrolyzates and process for their preparation
US5010159A (en) 1989-09-01 1991-04-23 Dow Corning Corporation Process for the synthesis of soluble, condensed hydridosilicon resins containing low levels of silanol
CA2027031A1 (fr) 1989-10-18 1991-04-19 Loren A. Haluska Enduits d'hermetisation de substrats en atmosphere inerte
US4973526A (en) 1990-02-15 1990-11-27 Dow Corning Corporation Method of forming ceramic coatings and resulting articles
US5262201A (en) * 1990-06-04 1993-11-16 Dow Corning Corporation Low temperature process for converting silica precursor coatings to ceramic silica coatings by exposure to ammonium hydroxide or an environment to which water vapor and ammonia vapor have been added
US5063267A (en) 1990-11-28 1991-11-05 Dow Corning Corporation Hydrogen silsesquioxane resin fractions and their use as coating materials
US5145723A (en) 1991-06-05 1992-09-08 Dow Corning Corporation Process for coating a substrate with silica
US5436029A (en) * 1992-07-13 1995-07-25 Dow Corning Corporation Curing silicon hydride containing materials by exposure to nitrous oxide
JP3153367B2 (ja) 1992-11-24 2001-04-09 ダウ・コ−ニング・コ−ポレ−ション ポリハイドロジェンシルセスキオキサンの分子量分別方法
JP3174416B2 (ja) * 1992-12-10 2001-06-11 ダウ・コ−ニング・コ−ポレ−ション 酸化ケイ素膜の形成方法
JP3174417B2 (ja) 1992-12-11 2001-06-11 ダウ・コ−ニング・コ−ポレ−ション 酸化ケイ素膜の形成方法
US5387480A (en) 1993-03-08 1995-02-07 Dow Corning Corporation High dielectric constant coatings
JP2751820B2 (ja) * 1994-02-28 1998-05-18 日本電気株式会社 半導体装置の製造方法
US5456952A (en) * 1994-05-17 1995-10-10 Lsi Logic Corporation Process of curing hydrogen silsesquioxane coating to form silicon oxide layer
DE4417405A1 (de) * 1994-05-18 1995-11-23 Inst Neue Mat Gemein Gmbh Verfahren zur Herstellung von strukturierten anorganischen Schichten
US5607773A (en) * 1994-12-20 1997-03-04 Texas Instruments Incorporated Method of forming a multilevel dielectric
US5684356A (en) * 1996-03-29 1997-11-04 Texas Instruments Incorporated Hydrogen-rich, low dielectric constant gate insulator for field emission device

Also Published As

Publication number Publication date
KR19990006686A (ko) 1999-01-25
TW392288B (en) 2000-06-01
US6210749B1 (en) 2001-04-03
JPH1116899A (ja) 1999-01-22
EP0883164A2 (fr) 1998-12-09
CA2239347A1 (fr) 1998-12-06
EP0883164A3 (fr) 2000-08-09

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