SG71683G - Outsert moulded substrate device - Google Patents

Outsert moulded substrate device

Info

Publication number
SG71683G
SG71683G SG71683A SG71683A SG71683G SG 71683 G SG71683 G SG 71683G SG 71683 A SG71683 A SG 71683A SG 71683 A SG71683 A SG 71683A SG 71683 G SG71683 G SG 71683G
Authority
SG
Singapore
Prior art keywords
outsert
substrate device
moulded substrate
moulded
substrate
Prior art date
Application number
SG71683A
Other languages
English (en)
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Publication of SG71683G publication Critical patent/SG71683G/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336Coating a portion of the article, e.g. the edge of the article
    • B29C45/14344Moulding in or through a hole in the article, e.g. outsert moulding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/005Compensating volume or shape change during moulding, in general
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0078Measures or configurations for obtaining anchoring effects in the contact areas between layers
    • B29C37/0082Mechanical anchoring
    • B29C37/0085Mechanical anchoring by means of openings in the layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/74Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
SG71683A 1977-09-21 1983-11-17 Outsert moulded substrate device SG71683G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12720577U JPS583346Y2 (ja) 1977-09-21 1977-09-21 基板装置

Publications (1)

Publication Number Publication Date
SG71683G true SG71683G (en) 1984-08-03

Family

ID=14954310

Family Applications (1)

Application Number Title Priority Date Filing Date
SG71683A SG71683G (en) 1977-09-21 1983-11-17 Outsert moulded substrate device

Country Status (3)

Country Link
JP (1) JPS583346Y2 (ja)
GB (1) GB2004492B (ja)
SG (1) SG71683G (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5836411A (ja) * 1981-08-26 1983-03-03 Hitachi Ltd アウトサ−ト成形品
DE3911746A1 (de) * 1989-04-11 1990-10-18 Philips Patentverwaltung Technisches geraet, insbesondere elektromechanisches laufwerk zum bewegen von informationstraegern, und verfahren zur herstellung von funktionsteilen an einer tragenden platte des geraetes
GB2311748B (en) * 1996-04-04 1999-10-06 Dewhurst Plc Improvements in or relating to indicating devices

Also Published As

Publication number Publication date
GB2004492A (en) 1979-04-04
JPS5452664U (ja) 1979-04-11
GB2004492B (en) 1982-05-26
JPS583346Y2 (ja) 1983-01-20

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