SG80589A1 - Detergent for semiconductor circuit and method for manufacturing semiconductor circuit by use of same - Google Patents

Detergent for semiconductor circuit and method for manufacturing semiconductor circuit by use of same

Info

Publication number
SG80589A1
SG80589A1 SG9800702A SG1998000702A SG80589A1 SG 80589 A1 SG80589 A1 SG 80589A1 SG 9800702 A SG9800702 A SG 9800702A SG 1998000702 A SG1998000702 A SG 1998000702A SG 80589 A1 SG80589 A1 SG 80589A1
Authority
SG
Singapore
Prior art keywords
semiconductor circuit
detergent
same
manufacturing semiconductor
manufacturing
Prior art date
Application number
SG9800702A
Other languages
English (en)
Inventor
Aoyama Tetsuo
Hasemi Ryuji
Ikeda Hidetoshi
Hada Mayumi
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of SG80589A1 publication Critical patent/SG80589A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/273—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a delineation of conductive layers, e.g. by RIE
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/268—Carbohydrates or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Molecular Biology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Drying Of Semiconductors (AREA)
SG9800702A 1997-04-11 1998-04-06 Detergent for semiconductor circuit and method for manufacturing semiconductor circuit by use of same SG80589A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9094045A JPH10289891A (ja) 1997-04-11 1997-04-11 半導体回路用洗浄剤及びそれを用いた半導体回路の製造方法

Publications (1)

Publication Number Publication Date
SG80589A1 true SG80589A1 (en) 2001-05-22

Family

ID=14099605

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9800702A SG80589A1 (en) 1997-04-11 1998-04-06 Detergent for semiconductor circuit and method for manufacturing semiconductor circuit by use of same

Country Status (5)

Country Link
EP (1) EP0875926A3 (fr)
JP (1) JPH10289891A (fr)
KR (1) KR100509582B1 (fr)
SG (1) SG80589A1 (fr)
TW (1) TW432524B (fr)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6348239B1 (en) 2000-04-28 2002-02-19 Simon Fraser University Method for depositing metal and metal oxide films and patterned films
US6417112B1 (en) * 1998-07-06 2002-07-09 Ekc Technology, Inc. Post etch cleaning composition and process for dual damascene system
US6152148A (en) * 1998-09-03 2000-11-28 Honeywell, Inc. Method for cleaning semiconductor wafers containing dielectric films
JP2000208466A (ja) * 1999-01-12 2000-07-28 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
DE60040252D1 (de) * 1999-02-19 2008-10-30 Axcelis Tech Inc Verfahren zur Entfernung von Rückständen nach Photoresistveraschung
US6734120B1 (en) 1999-02-19 2004-05-11 Axcelis Technologies, Inc. Method of photoresist ash residue removal
TWI243204B (en) * 2000-02-04 2005-11-11 Sumitomo Chemical Co Electronic parts cleaning solution
KR20030007969A (ko) 2000-06-16 2003-01-23 카오카부시키가이샤 세정제 조성물
WO2002045148A2 (fr) * 2000-11-29 2002-06-06 Infineon Technologies Ag Solution de nettoyage pour plaquettes semi-conductrices au niveau de l'unite de fabrication finale
KR100416794B1 (ko) * 2001-04-12 2004-01-31 삼성전자주식회사 금속 건식 에쳐 부품의 세정제 및 세정 방법
US20030138737A1 (en) 2001-12-27 2003-07-24 Kazumasa Wakiya Photoresist stripping solution and a method of stripping photoresists using the same
KR100831233B1 (ko) * 2002-03-26 2008-05-22 삼성전자주식회사 액정 표시 장치의 제조 방법
JP3799026B2 (ja) * 2002-03-29 2006-07-19 三洋化成工業株式会社 アルカリ洗浄剤
TWI295076B (en) * 2002-09-19 2008-03-21 Dongwoo Fine Chem Co Ltd Washing liquid for semiconductor substrate and method of producing semiconductor device
US7442675B2 (en) 2003-06-18 2008-10-28 Tokyo Ohka Kogyo Co., Ltd. Cleaning composition and method of cleaning semiconductor substrate
US7312152B2 (en) * 2004-06-28 2007-12-25 Intel Corporation Lactate-containing corrosion inhibitor
US9217929B2 (en) * 2004-07-22 2015-12-22 Air Products And Chemicals, Inc. Composition for removing photoresist and/or etching residue from a substrate and use thereof
US7413993B2 (en) 2004-11-22 2008-08-19 Infineon Technologies Ag Process for removing a residue from a metal structure on a semiconductor substrate
US20070254476A1 (en) 2006-04-28 2007-11-01 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning porous low-k material in the formation of an interconnect structure
US8021490B2 (en) 2007-01-04 2011-09-20 Eastman Chemical Company Substrate cleaning processes through the use of solvents and systems
WO2014039409A1 (fr) * 2012-09-06 2014-03-13 John Moore Compositions à base aqueuse sous forme solide exempte de métal et procédé d'élimination des matériaux polymères dans la fabrication de composants électroniques
JP6165665B2 (ja) 2013-05-30 2017-07-19 信越化学工業株式会社 基板の洗浄方法
CN115023058B (zh) * 2022-06-20 2023-04-18 清华大学深圳国际研究生院 一种高精度电路转移至柔性可拉伸基底上的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0253675A1 (fr) * 1986-07-18 1988-01-20 Syntex (U.S.A.) Inc. Solutions de base de choline stabilisées
EP0463423A1 (fr) * 1990-06-14 1992-01-02 Mitsubishi Gas Chemical Company, Inc. Agent de traitement à surface pour substrat supportant des motifs linéaires d'aluminium
US5185235A (en) * 1987-09-09 1993-02-09 Tokyo Ohka Kogyo Co., Ltd. Remover solution for photoresist
WO1994005766A1 (fr) * 1992-09-03 1994-03-17 Circuit Chemical Products Gmbh Detergent pour le nettoyage de circuits imprimes et de composants electroniques, procede pour sa fabrication et son mode d'utilisation
JPH0728254A (ja) * 1993-07-08 1995-01-31 Kanto Chem Co Inc レジスト用剥離液

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0301044A4 (fr) * 1987-02-05 1989-03-29 Macdermid Inc Composition servant a enlever des photoreserves de protection.
EP0578507B1 (fr) * 1992-07-09 2005-09-28 Ekc Technology, Inc. Composition de nettoyage à base d'un composé aminé redox

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0253675A1 (fr) * 1986-07-18 1988-01-20 Syntex (U.S.A.) Inc. Solutions de base de choline stabilisées
US5185235A (en) * 1987-09-09 1993-02-09 Tokyo Ohka Kogyo Co., Ltd. Remover solution for photoresist
EP0463423A1 (fr) * 1990-06-14 1992-01-02 Mitsubishi Gas Chemical Company, Inc. Agent de traitement à surface pour substrat supportant des motifs linéaires d'aluminium
WO1994005766A1 (fr) * 1992-09-03 1994-03-17 Circuit Chemical Products Gmbh Detergent pour le nettoyage de circuits imprimes et de composants electroniques, procede pour sa fabrication et son mode d'utilisation
JPH0728254A (ja) * 1993-07-08 1995-01-31 Kanto Chem Co Inc レジスト用剥離液

Also Published As

Publication number Publication date
EP0875926A3 (fr) 1999-03-10
TW432524B (en) 2001-05-01
EP0875926A2 (fr) 1998-11-04
KR100509582B1 (ko) 2005-12-07
JPH10289891A (ja) 1998-10-27
KR19980081293A (ko) 1998-11-25

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