SG83154A1 - Heat-resistant adhesive - Google Patents

Heat-resistant adhesive

Info

Publication number
SG83154A1
SG83154A1 SG9904637A SG1999004637A SG83154A1 SG 83154 A1 SG83154 A1 SG 83154A1 SG 9904637 A SG9904637 A SG 9904637A SG 1999004637 A SG1999004637 A SG 1999004637A SG 83154 A1 SG83154 A1 SG 83154A1
Authority
SG
Singapore
Prior art keywords
heat
resistant adhesive
resistant
adhesive
Prior art date
Application number
SG9904637A
Other languages
English (en)
Inventor
Matsuura Hidekazu
Ohta Naoto
Iwazaki Yoshihide
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG83154A1 publication Critical patent/SG83154A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/415—Leadframe inner leads serving as die pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
SG9904637A 1993-03-29 1994-03-29 Heat-resistant adhesive SG83154A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9189993 1993-03-29
JP9187093 1993-03-29
JP2593994 1994-01-31

Publications (1)

Publication Number Publication Date
SG83154A1 true SG83154A1 (en) 2001-09-18

Family

ID=27285212

Family Applications (2)

Application Number Title Priority Date Filing Date
SG9904637A SG83154A1 (en) 1993-03-29 1994-03-29 Heat-resistant adhesive
SG1996006540A SG44732A1 (en) 1993-03-29 1994-03-29 Heat-resistant adhesive

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG1996006540A SG44732A1 (en) 1993-03-29 1994-03-29 Heat-resistant adhesive

Country Status (5)

Country Link
EP (2) EP0618614B1 (fr)
KR (1) KR100243731B1 (fr)
CN (1) CN1041034C (fr)
DE (2) DE69415707T2 (fr)
SG (2) SG83154A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100333452B1 (ko) 1994-12-26 2002-04-18 이사오 우치가사키 필름 형상의 유기 다이본딩재 및 이를 이용한 반도체 장치
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
TW310481B (fr) * 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
TW326566B (en) * 1996-04-19 1998-02-11 Hitachi Chemical Co Ltd Composite film and lead frame with composite film attached
CN1079195C (zh) * 1996-07-05 2002-02-20 蓝进 扇贝裙边的综合利用工艺
US5922167A (en) * 1997-01-16 1999-07-13 Occidential Chemical Corporation Bending integrated circuit chips
JPH10330724A (ja) 1997-05-30 1998-12-15 Hitachi Chem Co Ltd 耐熱接着剤、耐熱接着剤層付き半導体チップ、耐熱接着剤層付きリードフレーム、耐熱接着剤層付きフィルム及び半導体装置
MY124687A (en) * 1998-05-20 2006-06-30 Hitachi Chemical Co Ltd Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same
DE60016217T2 (de) * 1999-04-09 2005-04-07 Kaneka Corp. Polyimidharzzusammensetzung mit verbesserter feuchtigkeitsbeständigkeit, leimlösung, mehrlagiger klebefilm und verfahren zu deren herstellung
US9679831B2 (en) * 2015-08-13 2017-06-13 Cypress Semiconductor Corporation Tape chip on lead using paste die attach material

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236542A (ja) * 1988-07-26 1990-02-06 Hitachi Ltd 半導体装置及びその製造方法
US5068712A (en) * 1988-09-20 1991-11-26 Hitachi, Ltd. Semiconductor device
JPH0521481A (ja) * 1991-07-16 1993-01-29 Hitachi Chem Co Ltd ペースト状被覆組成物及びこれを用いた半導体装置
JPH05112761A (ja) * 1991-10-16 1993-05-07 Sumitomo Bakelite Co Ltd 接着テープ
US5254412A (en) * 1991-05-17 1993-10-19 National Starch And Chemical Investment Holding Corporation Heat resisting adhesive material

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2535523B2 (ja) * 1987-01-28 1996-09-18 三井東圧化学株式会社 ポリイミドおよびポリイミドよりなる耐熱性接着剤
JPH0236543A (ja) * 1988-07-26 1990-02-06 Nec Corp チップキャリア端子コーティング方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236542A (ja) * 1988-07-26 1990-02-06 Hitachi Ltd 半導体装置及びその製造方法
US5068712A (en) * 1988-09-20 1991-11-26 Hitachi, Ltd. Semiconductor device
US5254412A (en) * 1991-05-17 1993-10-19 National Starch And Chemical Investment Holding Corporation Heat resisting adhesive material
JPH0521481A (ja) * 1991-07-16 1993-01-29 Hitachi Chem Co Ltd ペースト状被覆組成物及びこれを用いた半導体装置
JPH05112761A (ja) * 1991-10-16 1993-05-07 Sumitomo Bakelite Co Ltd 接着テープ

Also Published As

Publication number Publication date
CN1041034C (zh) 1998-12-02
DE69415707T2 (de) 1999-09-16
DE69433535T2 (de) 2004-12-23
KR100243731B1 (ko) 2000-02-01
EP0862205B1 (fr) 2004-02-04
EP0618614A3 (fr) 1995-11-22
EP0618614B1 (fr) 1999-01-07
DE69415707D1 (de) 1999-02-18
CN1099518A (zh) 1995-03-01
KR940021690A (ko) 1994-10-19
DE69433535D1 (de) 2004-03-11
SG44732A1 (en) 1997-12-19
EP0862205A1 (fr) 1998-09-02
EP0618614A2 (fr) 1994-10-05

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